FEATURES AND SPECIFICATIONS
Features and Benefits
s
Similar features as the 73642 header
s
Eye of the needle press-fit for high reliability
s
Metal hex key offers 8 coding combinations (64 with
Electrical
Current: 1.0A
Contact Resistance:
Row
m
Ω
max.
A
13
B
18
C
20
D
25
E
30
F
32
s
s
s
s
2 keys) and makes metallic sound when card is in
wrong slot
Guide pin provides ± 1.9mm of capture prior to plastic
mating
Can use 1 guide pin in center of connector or on both ends
Guide pin module attached to header enhances accuracy
and reduces parts count
Surface Mount Compatible
2.00mm (.079") Pitch
HDM*
Board-to-Board
Backplane Header
73644
Vertical
Press-Fit Guide Pin Option
Dielectric Withstanding Voltage: 1000V
Insulation Resistance: 1000 M
Ω
min.
Mechanical
Insertion Force: 135N max. per press-fit pin
Retention Force: 22.5N min. per press-fit pin
Mating Force: 0.35N typical per contact
Unmating Force: 0.15N min.
Signal Normal Force: 0.75N nom./0.60N min.
Durability: 250 cycles
Physical
Housing: Liquid crystal polymer
Contact: Phosphor Bronze
Plating: 30
µ
" Gold
Operating Temperature: -55 to +105˚C
Backplane Connector Systems
Reference Information
Product Specification: PS-73670-9999
Packaging: Tube
UL File No.: E29179
Mates With:
73632
and
73780
Designed In: Millimeters
CATALOG DRAWING (FOR REFERENCE ONLY)
J
0.71
DIA plated thru hole TYP
.028
0.838
DIA drilled hole
0.0330
ORDERING INFORMATION AND DIMENSIONS
Circuits
Location B = Pin
Location A = No Code
73644-0016
73644-0216
73644-2016
73644-2216
73644-1016
73644-1216
73644-3016
73644-3216
73650-XXXX
Order No.
Location B = No Code
Location B = Pin
Location A = Pin
Location A = Code A
73644-0017
73644-0000
73644-0217
73644-0200
73644-2017
73644-2000
73644-2217
73644-2200
73644-1017
73644-1000
73644-1217
73644-1200
73644-3017
73644-3000
73644-3217
73644-3200
73650-XXXX
73650-XXXX
Dimension
Location B = Code A
Location A = Pin
73644-0001
73644-0201
73644-2001
73644-2201
73644-1001
73644-1201
73644-3001
73644-3201
73650-XXXX
Termination
Standard Press-Fit
Standard Press-Fit
Tin/Lead Press-Fit
Tin/Lead Press-Fit
Standard Press-Fit
Standard Press-Fit
Tin/Lead Press-Fit
Tin/Lead Press-Fit
Custom
A
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
31.60 (1.244)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
55.60 (2.189)
Custom
Application Note
B
22.00 (.866)
22.00 (.866)
22.00 (.866)
22.00 (.866)
46.00 (1.811)
46.00 (1.811)
46.00 (1.811)
46.00 (1.811)
Custom
M
5.00 (.197)
6.00 (.236)
5.00 (.197)
6.00 (.236)
5.00 (.197)
6.00 (.236)
5.00 (.197)
6.00 (.236)
Custom
72
144
Custom
* High Density Metric and HDM
PLUS
are trademarks of Teradyne, Inc.
Note: Additional key combinations and locations are available, please contact Molex
Note: Tin/Lead press-fit zones are used for bare Copper or Gold plated PCBs
Note: The guide pin must mate with the top position on the mating receptacle to clear the board edge. Therefore, if
guidepin headers are used on each end of a header array, you should select one with the pin in location B and the
second with the guidepin in location A.
The backplane headers are delivered as modules and are press-fitted into the backplane. This
allows maximum flexibility with minimum inventory. Note that the guidepins are an integral
part of the headers. This also means that you may have different part numbers for left-
handed and right-handed headers. You must consult the customer print to determine the
appropriate part number for various combinations of guide pin locations (2) and coding pin
orientations (8).
J-36
MX01
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