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IS24C64-2P

产品描述EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
产品类别存储    存储   
文件大小80KB,共11页
制造商Integrated Silicon Solution ( ISSI )
下载文档 详细参数 选型对比 全文预览

IS24C64-2P概述

EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8

IS24C64-2P规格参数

参数名称属性值
是否Rohs认证不符合
零件包装代码DIP
包装说明DIP, DIP8,.3
针数8
Reach Compliance Codenot_compliant
ECCN代码EAR99
最大时钟频率 (fCLK)0.1 MHz
数据保留时间-最小值100
耐久性1000000 Write/Erase Cycles
I2C控制字节1010DDDR
JESD-30 代码R-PDIP-T8
JESD-609代码e0
长度9.325 mm
内存密度65536 bit
内存集成电路类型EEPROM
内存宽度8
功能数量1
端子数量8
字数8192 words
字数代码8000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织8KX8
封装主体材料PLASTIC/EPOXY
封装代码DIP
封装等效代码DIP8,.3
封装形状RECTANGULAR
封装形式IN-LINE
并行/串行SERIAL
峰值回流温度(摄氏度)240
电源2/5 V
认证状态Not Qualified
座面最大高度4.57 mm
串行总线类型I2C
最大待机电流0.000005 A
最大压摆率0.003 mA
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)1.8 V
标称供电电压 (Vsup)2.5 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度7.62 mm
最长写入周期时间 (tWC)10 ms
写保护HARDWARE
Base Number Matches1

文档预览

下载PDF文档
IS24C32-2/3
IS24C64-2/3
65,536-bit/32,768-bit 2-WIRE SERIAL
CMOS EEPROM
FEATURES
• Low Power CMOS Technology
– Standby Current less than 10 µA (5.5V)
– Read Current (typical) less than 1 mA (5.5V)
– Write Current (typical) less than 3 mA (5.5V)
• Low Voltage Operation
– IS24C64-2 & IS24C32-2: Vcc = 1.8V to 5.5V
– IS24C64-3 & IS24C32-3: Vcc = 2.5V to 5.5V
• 100 KHz (1.8V) and 400 KHz (5V) Compatibility
• Hardware Data Protection
– Write Protect Pin
• Sequential Read Feature
• Filtered Inputs for Noise Suppression
ISSI
• 8-pin PDIP and 8-pin SOIC packages
• Self time write cycle with auto clear
– 5 ms @ 2.5V
• Organization:
– IS24C64-2 and IS24C64-3: 8192x8
– IS24C32-2 and IS24C32-3: 4096x8
• 32-Byte Page Write Buffer
• Two-Wire Serial Interface
– Bi-directional data transfer protocol
• High Reliability
– Endurance: 1,000,000 Cycles
– Data Retention: 100 Years
• Commercial and Industrial temperature ranges
®
PRELIMINARY INFORMATION
APRIL 2001
PRODUCT OFFERING OVERVIEW
Part No
IS24C64-2
IS24C64-3
IS24C32-2
IS24C32-3
Voltage
1.8V-5.5V
2.5V-5.5V
1.8V-5.5V
2.5V-5.5V
Speed
100 KHz
400 KHz
100 KHz
400 KHz
Standby ICC
< 5 µA
< 10 µA
< 5 µA
< 10 µA
Read ICC
1 mA
1 mA
1 mA
1 mA
Write ICC
3 mA
3 mA
3 mA
3 mA
Temperature
C,I
C,I
C,I
C,I
DESCRIPTION
The IS24C64-2 is a 1.8V (1.8V-5.5V) 64K-bit (8192 x 8)
Electrically Erasable PROM, IS24C64-3 is a 2.5V (2.5V-
5.5V) 64K-bit (8192 x 8) Electrically Erasable PROM,
IS24C32-2 is a 1.8V (1.8V-5.5V) 32K-bit (4096 x 8)
Electrically Erasable PROM and the IS24C32-3 is a 2.5V
(2.5V-5.5V) 32K-bit (4096 x 8) Electrically Erasable
PROM.
The IS24CXX (IS24C64-2, IS24C64-3, IS24C32-2 and
IS24C32-3) family is a low-cost and low voltage 2-wire
Serial EEPROM. It is fabricated using ISSI’s advanced
CMOS EEPROM technology and provides a low power
and low voltage operation. The IS24CXX family features
a write protection feature, and is available in 8-pin DIP and
8-pin SOIC packages.
This document contains PRELIMINARY INFORMATION data. ISSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the
best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2001, Integrated Silicon Solution, Inc.
Integrated Silicon Solution, Inc. — 1-800-379-4774
PRELIMINARY INFORMATION
04/04/01
Rev. 00B
1

IS24C64-2P相似产品对比

IS24C64-2P IS24C32-2GI IS24C32-2G IS24C32-3P IS24C64-2GI IS24C64-2PI
描述 EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 EEPROM, 4KX8, Serial, CMOS, PDSO8, SOIC-8 EEPROM, 4KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 EEPROM, 8KX8, Serial, CMOS, PDSO8, SOIC-8 EEPROM, 8KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合
零件包装代码 DIP SOIC SOIC DIP SOIC DIP
包装说明 DIP, DIP8,.3 SOP, SOP8,.25 SOIC-8 0.300 INCH, PLASTIC, DIP-8 SOIC-8 0.300 INCH, PLASTIC, DIP-8
针数 8 8 8 8 8 8
Reach Compliance Code not_compliant not_compliant unknown unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
最大时钟频率 (fCLK) 0.1 MHz 0.1 MHz 0.1 MHz 0.4 MHz 0.1 MHz 0.1 MHz
数据保留时间-最小值 100 100 100 100 100 100
耐久性 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles 1000000 Write/Erase Cycles
I2C控制字节 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR 1010DDDR
JESD-30 代码 R-PDIP-T8 R-PDSO-G8 R-PDSO-G8 R-PDIP-T8 R-PDSO-G8 R-PDIP-T8
JESD-609代码 e0 e0 e0 e0 e0 e0
长度 9.325 mm 4.9 mm 4.9 mm 9.325 mm 4.9 mm 9.325 mm
内存密度 65536 bit 32768 bit 32768 bit 32768 bi 65536 bi 65536 bi
内存集成电路类型 EEPROM EEPROM EEPROM EEPROM EEPROM EEPROM
内存宽度 8 8 8 8 8 8
功能数量 1 1 1 1 1 1
端子数量 8 8 8 8 8 8
字数 8192 words 4096 words 4096 words 4096 words 8192 words 8192 words
字数代码 8000 4000 4000 4000 8000 8000
工作模式 SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
最高工作温度 70 °C 85 °C 70 °C 70 °C 85 °C 85 °C
组织 8KX8 4KX8 4KX8 4KX8 8KX8 8KX8
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 DIP SOP SOP DIP SOP DIP
封装等效代码 DIP8,.3 SOP8,.25 SOP8,.25 DIP8,.3 SOP8,.25 DIP8,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE IN-LINE
并行/串行 SERIAL SERIAL SERIAL SERIAL SERIAL SERIAL
峰值回流温度(摄氏度) 240 240 240 240 240 240
电源 2/5 V 2/5 V 2/5 V 3/5 V 2/5 V 2/5 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 4.57 mm 1.75 mm 1.75 mm 4.57 mm 1.75 mm 4.57 mm
串行总线类型 I2C I2C I2C I2C I2C I2C
最大待机电流 0.000005 A 0.000005 A 0.000005 A 0.00001 A 0.000005 A 0.000005 A
最大压摆率 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA 0.003 mA
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 1.8 V 1.8 V 1.8 V 2.5 V 1.8 V 1.8 V
标称供电电压 (Vsup) 2.5 V 2.5 V 2.5 V 5 V 2.5 V 2.5 V
表面贴装 NO YES YES NO YES NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL INDUSTRIAL COMMERCIAL COMMERCIAL INDUSTRIAL INDUSTRIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE GULL WING THROUGH-HOLE
端子节距 2.54 mm 1.27 mm 1.27 mm 2.54 mm 1.27 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 30 30 30 30 30 30
宽度 7.62 mm 3.9 mm 3.9 mm 7.62 mm 3.9 mm 7.62 mm
最长写入周期时间 (tWC) 10 ms 10 ms 10 ms 5 ms 10 ms 10 ms
写保护 HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE HARDWARE
厂商名称 - - Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI ) Integrated Silicon Solution ( ISSI )

 
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