IC,BUFFER/DRIVER,SINGLE,4-BIT,AC-CMOS,DIP,14PIN,PLASTIC
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | compliant |
| 其他特性 | ALSO OPERATES AT 5V SUPPLY |
| 控制类型 | ENABLE HIGH |
| 系列 | AC |
| JESD-30 代码 | R-PDIP-T14 |
| 长度 | 19.2 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 电源 | 3.3/5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.06 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| HD74AC126P | HD74AC126RP | HD74AC126T | HD74AC126FP | |
|---|---|---|---|---|
| 描述 | IC,BUFFER/DRIVER,SINGLE,4-BIT,AC-CMOS,DIP,14PIN,PLASTIC | AC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, FP-14DN | AC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, TTP-14D | AC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, FP-14DA |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC |
| 包装说明 | DIP, DIP14,.3 | FP-14DN | TSSOP, | SOP, SOP14,.3 |
| 针数 | 14 | 14 | 14 | 14 |
| Reach Compliance Code | compliant | compliant | compliant | unknown |
| 其他特性 | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY | ALSO OPERATES AT 5V SUPPLY |
| 系列 | AC | AC | AC | AC |
| JESD-30 代码 | R-PDIP-T14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 19.2 mm | 8.65 mm | 5 mm | 10.06 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 位数 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | 14 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | TSSOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE |
| 传播延迟（tpd） | 10 ns | 10 ns | 10 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.06 mm | 1.75 mm | 1.1 mm | 2.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 1.27 mm | 0.65 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.95 mm | 4.4 mm | 5.5 mm |
| Base Number Matches | 1 | 1 | 1 | 1 |
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