The HCPL-530x devices consist of a GaAsP LED optically
coupled to an integrated high gain photo detector in a
hermetically sealed package. The products are capable of
operation and storage over the full military temperature range
and can be purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the DLA
Standard Microcircuit Drawing (SMD) 5962-96852. All devices
are manufactured and tested on a MIL-PRF-38534 certified line,
and Class H and K devices are included in the DLA Qualified
Manufacturers List QML-38534 for Hybrid Microcircuits.
Minimized propagation delay difference between devices
makes these optocouplers excellent solutions for improving
inverter efficiency through reduced switching dead time. An
on-chip 20-kΩ output pull-up resistor can be enabled by
shorting output pins 6 and 7, thus eliminating the need for an
external pull-up resistor in common IPM applications.
Specifications and performance plots are given for typical IPM
applications.
Features
Performance specified over full military temperature
Range: –55°C to +125°C
Fast maximum propagation delays
—
t
PHL
= 450 ns
—
t
PLH
= 650 ns
Minimized pulse width distortion (PWD = 450 ns)
High common mode rejection (CMR): 10 kV/μs at V
CM
=
1000V
CTR > 30% at I
F
= 10 mA
1500 Vdc withstand test voltage
Manufactured and tested on a MIL-PRF-38534 certified line
Hermetically sealed packages
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
QML-38534, Class H and K
HCPL-4506 function compatibility
Applications
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Military and space
High reliability systems
Harsh industrial environments
Transportation, medical, and life critical systems
IPM isolation
Isolated IGBT/MOSFET gate drive
AC and brushless DC motor drives
Industrial inverters
1.
See
Selection Guide–Lead Configuration Options
for available
extensions.
Broadcom
-1-
HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Data Sheet
Schematic Diagram
Schematic Diagram
1
20 k
2
7
8
Selection Guide–Lead Configuration
Options
Part Numbers and Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part #
HCPL-5300
HCPL-5301
HCPL-530K
Gold Plate
Option #200
Option #100
Option #300
5962-
9685201HPC
9685201HPA
9685201HYC
9685201HYA
9685201HXA
5962-
9685201KPC
9685201KPA
9685201KYC
9685201KYA
9685201KXA
3
6
4
SHIELD
5
Truth Table
LED
ON
OFF
V
O
L
H
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part #
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Cut/Gold Plate
a
Butt Cut/Soldered
b
Gull Wing/Soldered
b
a.
b.
NOTE
The connection of a 0.1-μF bypass capacitor
between pins 5 and 8 is recommended.
Gold Plate lead finish: Maximum gold thickness of leads is <100
micro inches. Typical is 60 to 90 micro inches.
Solder lead finish: Sn63/Pb37.
Outline Drawing
8-Pin DIP, Through Hole, 1 Channel
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
7.36 (0.290)
7.87 (0.310)
Broadcom
-2-
HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Data Sheet
Device Marking
Device Marking
Avago DESIGNATOR
Avago P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Avago CAGE CODE
[1]
[1] QML PARTS ONLY
Hermetic Optocoupler Options
Option
100
Description
Surface-mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is available on
Commercial, Class H and Class K product in 8-pin DIP.
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
1.14 (0.045)
1.40 (0.055)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
200
300
Lead finish is solder dipped rather than gold plated. This option is available on Commercial, Class H and Class K
product in 8-pin DIP. DLA Drawing (SMD) part numbers contain provisions for lead finish.
Surface-mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is available
on Commercial, Class H and Class K product in 8-pin DIP. This option has solder-dipped leads.
4.57 (0.180)
MAX.
0.51 (0.020)
MIN.
2.29 (0.090)
2.79 (0.110)
0.20 (0.008)
0.33 (0.013)
9.65 (0.380)
9.91 (0.390)
4.57 (0.180)
MAX.
5° MAX.
1.40 (0.055)
1.65 (0.065)
0.51 (0.020)
MAX.
1.07 (0.042)
1.32 (0.052)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
Broadcom
-3-
HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Data Sheet
Absolute Maximum Ratings
Absolute Maximum Ratings
Parameter
Storage Temperature
Operating Temperature
Junction Temperature
Lead Solder Temperature
Average Input Current
Peak Input Current (50% duty cycle, ≤1 μs pulse width)
Peak Transient Input Current (≤1 μs pulse width, 300 pps)
Reverse Input Voltage (Pin 3-2)
Average Output Current (Pin 6)
Resistor Voltage (Pin 7)
Output Voltage (Pin 6-5)
Supply Voltage (Pin 8-5)
Output Power Dissipation
Total Power Dissipation
V
R
I
O(AVG)
V
7
V
O
V
CC
P
O
P
T
I
F(AVG)
I
F(PEAK)
Symbol
T
S
T
A
T
J
Min
–65
–55
—
—
—
—
—
—
—
–0.5
–0.5
–0.5
—
—
Max
+150
+125
+175
260 for 10 sec
25
50
1.0
5
15
V
CC
30
30
100
145
Unit
°C
°C
°C
°C
mA
mA
A
V
mA
V
V
V
mW
mW
ESD Classification
(MIL-STD-883, Method 3015)
, Class 1
Recommended Operating Conditions
Parameter
Power Supply Voltage
Output Voltage
Input Current (ON)
Input Voltage (OFF)
Symbol
V
CC
V
O
I
F(ON)
V
F(OFF)
Min
4.5
0
10
–5
Max
30
30
20
0.8
Unit
V
V
mA
V
Broadcom
-4-
HCPL-5300, HCPL-5301, HCPL-530K, 5962-96852
Data Sheet
Electrical Specifications
Electrical Specifications
Over recommended operating conditions (T
A
= –55°C to +125°C, V
CC
= +4.5V to 30V, I
F(ON)
= 10 mA to 20 mA, V
F(OFF)
= –5V to 0.8V)
unless otherwise specified.
Parameter
Current Transfer Ratio
Low Level Output Current
Low Level Output Voltage
Input Threshold Current
High Level Output Current
High Level Supply Current
Low Level Supply Current
Input Forward Voltage
Temperature Coefficient of
Forward Voltage
Input Reverse Breakdown
Voltage
Input Capacitance
Input-Output Insulation
Leakage Current
Symbol
CTR
I
OL
V
OL
I
TH
I
OH
I
CCH
I
CCL
V
F
ΔV
F
/ΔT
A
BV
R
C
IN
I
I-O
1
1, 2, 3
Group A
Subgroups
a
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
Min
30
3.0
—
—
—
—
—
1.0
—
5
—
—
Typ
b
90
9.0
0.3
1.5
5
0.6
0.6
1.5
–1.6
—
90
—
Max
—
—
0.6
5.0
75
1.5
1.5
1.8
—
—
—
1.0
Unit
%
mA
V
mA
μA
mA
mA
V
mV/°C
V
pF
μA
Test Conditions
I
F
= 10 mA,
V
O
= 0.6V
I
F
= 10 mA,
V
O
= 0.6V
I
O
= 2.4 mA
V
O
= 0.8V,
I
O
= 0.75 mA
V
F
= 0.8V
V
F
= 0.8V,
V
O
= Open
I
F
= 10 mA,
V
O
= Open
I
F
= 10 mA
I
F
= 10 mA
I
R
= 100 μA
f = 1 MHz,
V
F
= 0V
RH ≤ 65%,
t = 5 sec,
V
I-O
= 1500 Vdc,
T
A
= 25°C
V
I-O
= 500 Vdc
f = 1 MHz
T
A
= 25°C
e
Fig
Note
c
1, 2
1
3
d
d
d
4
Resistance (Input-Output)
Capacitance (Input-Output)
Internal Pull-up Resistor
Internal Pull-up Resistor
Temperature Coefficient
a.
b.
c.
d.
e.
f.
g.
h.
R
I-O
C
I-O
R
L
ΔR
L
/ΔT
A
1
—
—
14
—
1012
2.4
20
0.014
—
—
28
—
Ω
pF
kΩ
kΩ/°C
e
e
f, g, h
Commercial parts receive 100% testing at 25°C (Subgroups 1 and 9). SMD, Class H and K parts receive 100% testing at 25°C, +125°C, and –55°C (Subgroups 1
and 9, 2 and 10, 3 and 11 respectively).
All typical values at 25°C, V
CC
= 15V.
Current Transfer Ratio in percent is defined as the ratio of output collector current (I
O
) to the forward LED input current (I
F
) times 100.
Use of a 0.1 μF bypass capacitor connected between pins 5 and 8 can improve performance by filtering power supply line noise.
Device considered a two-terminal device: Pins 1, 2, 3, and 4 shorted together and Pins 5, 6, 7, and 8 shorted together.
The internal 20 kΩ resistor can be used by shorting pins 6 and 7 together.
Due to the tolerance of the internal resistor, and since propagation delay is dependent on the load resistor value, performance can be improved by using an
external 20 kΩ 1% load resistor. For more information on how propagation delay varies with load resistance, see
Figure 8.
The RL = 20 kΩ, C
L
= 100 pF represents a typical IPM (Intelligent Power Module) load.
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