Flash, 16MX16, 90ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | SAMSUNG(三星) |
零件包装代码 | BGA |
包装说明 | 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 |
针数 | 44 |
Reach Compliance Code | compliant |
ECCN代码 | 3A991.B.1.A |
最长访问时间 | 90 ns |
其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
启动块 | TOP |
命令用户界面 | YES |
通用闪存接口 | YES |
数据轮询 | YES |
JESD-30 代码 | R-PBGA-B44 |
长度 | 11 mm |
内存密度 | 268435456 bit |
内存集成电路类型 | FLASH |
内存宽度 | 16 |
功能数量 | 1 |
部门数/规模 | 8,511 |
端子数量 | 44 |
字数 | 16777216 words |
字数代码 | 16000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 16MX16 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | VFBGA |
封装等效代码 | BGA44,8X14,20 |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 1.8 V |
编程电压 | 1.8 V |
认证状态 | Not Qualified |
座面最大高度 | 1 mm |
部门规模 | 4K,32K |
最大待机电流 | 0.00007 A |
最大压摆率 | 0.07 mA |
最大供电电压 (Vsup) | 1.95 V |
最小供电电压 (Vsup) | 1.7 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
切换位 | YES |
类型 | NOR TYPE |
宽度 | 8 mm |
Base Number Matches | 1 |
K8S5615ETA-DC7B0 | K8S5615ETA-DE7C0 | K8S5615ETA-FC7B0 | K8S5615ETA-DC7C0 | K8S5615ETA-FE7C0 | K8S5615ETA-FE7B0 | K8S5615ETA-FC7C0 | K8S5615ETA-DE7B0 | |
---|---|---|---|---|---|---|---|---|
描述 | Flash, 16MX16, 90ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 | Flash, 16MX16, 80ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 | Flash, 16MX16, 90ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | Flash, 16MX16, 80ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 | Flash, 16MX16, 80ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | Flash, 16MX16, 90ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | Flash, 16MX16, 80ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | Flash, 16MX16, 90ns, PBGA44, 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 |
是否Rohs认证 | 符合 | 符合 | 不符合 | 符合 | 不符合 | 不符合 | 不符合 | 符合 |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 | VFBGA, BGA44,8X14,20 | 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | VFBGA, BGA44,8X14,20 | VFBGA, BGA44,8X14,20 | 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, FBGA-44 | VFBGA, BGA44,8X14,20 | 8 X 11 MM, 1 MM HEIGHT, 0.50 MM PITCH, LEAD FREE, FBGA-44 |
针数 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compli |
ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | EAR99 |
最长访问时间 | 90 ns | 80 ns | 90 ns | 80 ns | 80 ns | 90 ns | 80 ns | 90 ns |
其他特性 | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE |
启动块 | TOP | TOP | TOP | TOP | TOP | TOP | TOP | TOP |
命令用户界面 | YES | YES | YES | YES | YES | YES | YES | YES |
通用闪存接口 | YES | YES | YES | YES | YES | YES | YES | YES |
数据轮询 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 | R-PBGA-B44 |
长度 | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm | 11 mm |
内存密度 | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bi |
内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
部门数/规模 | 8,511 | 8,511 | 8,511 | 8,511 | 8,511 | 8,511 | 8,511 | 8,511 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
字数代码 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 | 16000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C |
组织 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 | 16MX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA | VFBGA |
封装等效代码 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 | BGA44,8X14,20 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | 225 | NOT SPECIFIED | 225 | 225 | 225 | NOT SPECIFIED |
电源 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
编程电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm | 1 mm |
部门规模 | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K | 4K,32K |
最大待机电流 | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A | 0.00007 A |
最大压摆率 | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA | 0.07 mA |
最大供电电压 (Vsup) | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V | 1.95 V |
最小供电电压 (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | OTHER | COMMERCIAL | COMMERCIAL | OTHER | OTHER | COMMERCIAL | OTHER |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
切换位 | YES | YES | YES | YES | YES | YES | YES | YES |
类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
宽度 | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm | 8 mm |
厂商名称 | SAMSUNG(三星) | - | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
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