HEXFET Power MOSFET
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | International Rectifier ( Infineon ) |
零件包装代码 | TO-220AB |
包装说明 | FLANGE MOUNT, R-PSFM-T3 |
针数 | 3 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
雪崩能效等级(Eas) | 980 mJ |
外壳连接 | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 100 V |
最大漏极电流 (Abs) (ID) | 140 A |
最大漏极电流 (ID) | 75 A |
最大漏源导通电阻 | 0.007 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-220AB |
JESD-30 代码 | R-PSFM-T3 |
JESD-609代码 | e0 |
元件数量 | 1 |
端子数量 | 3 |
工作模式 | ENHANCEMENT MODE |
最高工作温度 | 175 °C |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | RECTANGULAR |
封装形式 | FLANGE MOUNT |
峰值回流温度(摄氏度) | 225 |
极性/信道类型 | N-CHANNEL |
最大功率耗散 (Abs) | 330 W |
最大脉冲漏极电流 (IDM) | 550 A |
认证状态 | Not Qualified |
表面贴装 | NO |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子位置 | SINGLE |
处于峰值回流温度下的最长时间 | 30 |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
Base Number Matches | 1 |
IRFB4310 | IRFS4310 | IRFB4310ZTRLPBF | IRFB4310ZTRRPBF | IRFS4310TRL | IRFS4310TRR | |
---|---|---|---|---|---|---|
描述 | HEXFET Power MOSFET | HEXFET Power MOSFET | Power Field-Effect Transistor, 75A I(D), 100V, 0.006ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, LEAD FREE, PLASTIC PACKAGE-3 | Power Field-Effect Transistor, 75A I(D), 100V, 0.006ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-220AB, LEAD FREE, PLASTIC PACKAGE-3 | Power Field-Effect Transistor, 75A I(D), 100V, 0.007ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC, D2PAK-3 | Power Field-Effect Transistor, 75A I(D), 100V, 0.007ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-263AB, PLASTIC, D2PAK-3 |
是否无铅 | 含铅 | 含铅 | 不含铅 | 不含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 符合 | 符合 | 不符合 | 不符合 |
厂商名称 | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) | International Rectifier ( Infineon ) |
零件包装代码 | TO-220AB | D2PAK | TO-220AB | TO-220AB | D2PAK | D2PAK |
包装说明 | FLANGE MOUNT, R-PSFM-T3 | PLASTIC, D2PAK-3 | FLANGE MOUNT, R-PSFM-T3 | FLANGE MOUNT, R-PSFM-T3 | SMALL OUTLINE, R-PSSO-G2 | SMALL OUTLINE, R-PSSO-G2 |
针数 | 3 | 3 | 3 | 3 | 3 | 3 |
Reach Compliance Code | unknown | unknow | compliant | compliant | unknown | compli |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
雪崩能效等级(Eas) | 980 mJ | 980 mJ | 130 mJ | 130 mJ | 980 mJ | 980 mJ |
外壳连接 | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN | DRAIN |
配置 | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE | SINGLE WITH BUILT-IN DIODE |
最小漏源击穿电压 | 100 V | 100 V | 100 V | 100 V | 100 V | 100 V |
最大漏极电流 (ID) | 75 A | 75 A | 75 A | 75 A | 75 A | 75 A |
最大漏源导通电阻 | 0.007 Ω | 0.007 Ω | 0.006 Ω | 0.006 Ω | 0.007 Ω | 0.007 Ω |
FET 技术 | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR | METAL-OXIDE SEMICONDUCTOR |
JEDEC-95代码 | TO-220AB | TO-263AB | TO-220AB | TO-220AB | TO-263AB | TO-263AB |
JESD-30 代码 | R-PSFM-T3 | R-PSSO-G2 | R-PSFM-T3 | R-PSFM-T3 | R-PSSO-G2 | R-PSSO-G2 |
JESD-609代码 | e0 | e0 | e3 | e3 | e0 | e0 |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 2 | 3 | 3 | 2 | 2 |
工作模式 | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE | ENHANCEMENT MODE |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLANGE MOUNT | SMALL OUTLINE | FLANGE MOUNT | FLANGE MOUNT | SMALL OUTLINE | SMALL OUTLINE |
峰值回流温度(摄氏度) | 225 | 225 | 250 | 250 | NOT SPECIFIED | 260 |
极性/信道类型 | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
最大脉冲漏极电流 (IDM) | 550 A | 550 A | 550 A | 550 A | 550 A | 550 A |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
表面贴装 | NO | YES | NO | NO | YES | YES |
端子面层 | TIN LEAD | TIN LEAD | MATTE TIN OVER NICKEL | MATTE TIN OVER NICKEL | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING |
端子位置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
最高工作温度 | 175 °C | 150 °C | 175 °C | 175 °C | - | 150 °C |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
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