4000/14000/40000 SERIES, SEVEN SEGMENT DECODER/DRIVER, CONFIGURABLE OUTPUT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 16 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 系列 | 4000/14000/40000 |
| 输入调节 | LATCHED |
| JESD-30 代码 | R-GDIP-T16 |
| 逻辑集成电路类型 | SEVEN SEGMENT DECODER/DRIVER |
| 功能数量 | 1 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | CONFIGURABLE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 传播延迟（tpd） | 1200 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| CD4543BF | CD4543BD | CD4543BH | |
|---|---|---|---|
| 描述 | 4000/14000/40000 SERIES, SEVEN SEGMENT DECODER/DRIVER, CONFIGURABLE OUTPUT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | 4000/14000/40000 SERIES, SEVEN SEGMENT DECODER/DRIVER, CONFIGURABLE OUTPUT, CDIP16, HERMETIC SEALED, CERAMIC, DIP-16 | 4000/14000/40000 SERIES, SEVEN SEGMENT DECODER/DRIVER, CONFIGURABLE OUTPUT, UUC16, DIE-16 |
| 零件包装代码 | DIP | DIP | DIE |
| 包装说明 | DIP, | DIP, | DIE, |
| 针数 | 16 | 16 | 16 |
| Reach Compliance Code | not_compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 |
| 系列 | 4000/14000/40000 | 4000/14000/40000 | 4000/14000/40000 |
| 输入调节 | LATCHED | LATCHED | LATCHED |
| JESD-30 代码 | R-GDIP-T16 | R-CDIP-T16 | R-XUUC-N16 |
| 逻辑集成电路类型 | SEVEN SEGMENT DECODER/DRIVER | SEVEN SEGMENT DECODER/DRIVER | SEVEN SEGMENT DECODER/DRIVER |
| 功能数量 | 1 | 1 | 1 |
| 端子数量 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C |
| 输出极性 | CONFIGURABLE | CONFIGURABLE | CONFIGURABLE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED |
| 封装代码 | DIP | DIP | DIE |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | UNCASED CHIP |
| 传播延迟（tpd） | 1200 ns | 1200 ns | 1200 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 18 V | 18 V | 18 V |
| 最小供电电压 (Vsup) | 3 V | 3 V | 3 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V |
| 表面贴装 | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD |
| 端子位置 | DUAL | DUAL | UPPER |
| 座面最大高度 | 5.08 mm | 5.08 mm | - |
| 端子节距 | 2.54 mm | 2.54 mm | - |
| 宽度 | 7.62 mm | 7.62 mm | - |
| 厂商名称 | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
