4X4 DUAL-PORT SRAM, CDFP24
| 参数名称 | 属性值 |
| 厂商名称 | Renesas(瑞萨电子) |
| 零件包装代码 | DFP |
| 包装说明 | DFP, FL24,.4 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 972 ns |
| 最大时钟频率 (fCLK) | 1.11 MHz |
| JESD-30 代码 | R-CDFP-F24 |
| JESD-609代码 | e4 |
| 内存密度 | 16 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 字数 | 4 words |
| 字数代码 | 4 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4X4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | DFP |
| 封装等效代码 | FL24,.4 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 并行/串行 | PARALLEL |
| 电源 | 5/15 V |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class V |
| 座面最大高度 | 2.92 mm |
| 最大供电电压 (Vsup) | 18 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 宽度 | 9.9 mm |
| Base Number Matches | 1 |
| 5962R9668201VXC | 5962R9668201VJC | CD40108BDMS | CD40108BKMS | |
|---|---|---|---|---|
| 描述 | 4X4 DUAL-PORT SRAM, CDFP24 | 4X4 DUAL-PORT SRAM, 972ns, CDIP24, CERAMIC, DIP-24 | 4X4 MULTI-PORT SRAM, CDIP24 | 4X4 MULTI-PORT SRAM, CDFP24 |
| 厂商名称 | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) | Renesas(瑞萨电子) |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| JESD-30 代码 | R-CDFP-F24 | R-CDIP-T24 | R-CDIP-T24 | R-CDFP-F24 |
| 内存密度 | 16 bit | 16 bit | 16 bit | 16 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | MULTI-PORT SRAM | MULTI-PORT SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 24 | 24 | 24 |
| 字数 | 4 words | 4 words | 4 words | 4 words |
| 字数代码 | 4 | 4 | 4 | 4 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 4X4 | 4X4 | 4X4 | 4X4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | FLATPACK | IN-LINE | IN-LINE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | FLAT | THROUGH-HOLE | THROUGH-HOLE | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
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