POWER SUPPLY SUPPORT CKT, PDIP8
参数名称 | 属性值 |
厂商名称 | DS-IMP |
包装说明 | DIP, DIP8,.3 |
Reach Compliance Code | unknow |
ECCN代码 | EAR99 |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-PDIP-T8 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP8,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 1.1/5.5 V |
认证状态 | Not Qualified |
最大供电电流 (Isup) | 0.1 mA |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
IMP805LEPA | IMP802LCSA | IMP802LEPA | IMP802MCPA | IMP802MEPA | IMP805LCSA | IMP805LESA | IMP805LMJA | |
---|---|---|---|---|---|---|---|---|
描述 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 | POWER SUPPLY SUPPORT CKT, PDIP8 |
厂商名称 | DS-IMP | DS-IMP | - | DS-IMP | DS-IMP | DS-IMP | DS-IMP | - |
包装说明 | DIP, DIP8,.3 | SOP, SOP8,.25 | - | DIP, DIP8,.3 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | - |
Reach Compliance Code | unknow | unknow | - | unknow | unknow | unknow | unknow | - |
ECCN代码 | EAR99 | EAR99 | - | EAR99 | EAR99 | EAR99 | EAR99 | - |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | - |
JESD-30 代码 | R-PDIP-T8 | R-PDSO-G8 | - | R-PDIP-T8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | - |
端子数量 | 8 | 8 | - | 8 | 8 | 8 | 8 | - |
最高工作温度 | 85 °C | 70 °C | - | 70 °C | 85 °C | 70 °C | 85 °C | - |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | - |
封装代码 | DIP | SOP | - | DIP | DIP | SOP | SOP | - |
封装等效代码 | DIP8,.3 | SOP8,.25 | - | DIP8,.3 | DIP8,.3 | SOP8,.25 | SOP8,.25 | - |
封装形状 | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | - |
封装形式 | IN-LINE | SMALL OUTLINE | - | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | - |
电源 | 1.1/5.5 V | 1.1/5.5 V | - | 1.1/5.5 V | 1.1/5.5 V | 1.1/5.5 V | 1.1/5.5 V | - |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - |
最大供电电流 (Isup) | 0.1 mA | 0.1 mA | - | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | - |
表面贴装 | NO | YES | - | NO | NO | YES | YES | - |
技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | - |
温度等级 | INDUSTRIAL | COMMERCIAL | - | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | - |
端子形式 | THROUGH-HOLE | GULL WING | - | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | - |
端子节距 | 2.54 mm | 1.27 mm | - | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | - |
端子位置 | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL | - |
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