十 速 科 技
tenx technology
GENERAL DESCRIPTION
TM8713
4 Bit Microcontroller
The TM8713 is an embedded high-performance 4-bit microcomputer with LCD/LED driver.
It contains all the necessary functions, such as 4-bit parallel processing ALU, ROM, RAM,
I/O ports, timer, clock generator, dual clock operation, EL panel driver, LCD driver, look-up
table, watchdog timer and key matrix scanning circuitry in a signal chip.
FEATURES
1. Low power dissipation.
2. Powerful instruction set (135 instructions).
Binary addition, subtraction, BCD adjust, logical operation in direct and index
addressing mode.
Single bit manipulation (set, reset, decision for branch).
Various conditional branch.
16 working registers and manipulation.
Table look-up.
LCD driver data transfer.
3. LCD/LED driver output.
5 common outputs and 27 segment outputs (up to drive 135 LCD/LED segments).
1/2 Duty, 1/3 Duty, 1/4 Duty or 1/5 Duty for both LCD/LED drivers is selected by
MASK option.
1/2 Bias or 1/3 Bias for LCD driver is selected by MASK option.
Single instruction to turn off all segments.
Segment outputs(SEG1~12,21~35) could be defined as CMOS or P_open drain
type output by mask option.
4. Memory capacity.
ROM capacity
RAM capacity
1536
96
x 16 bits.
x 4 bits.
5. Input/output ports.
Port IOA
4 pins (with internal pull-low), muxed with SEG24~27.
Port IOB
4 pins (with internal pull-low), muxed with SEG28~31.
Port IOC
4 pins (with internal pull-low / low-level-hold), muxed with SEG32 ~
SEG35.
IOC port had built-in input signal chattering prevention circuitry.
6. 8 level subroutine nesting.
7. Interrupt function.
External factors
Internal factors
3
2
(INT pin, Port IOC & KI input).
(Pre-Divider, Timer1).
8. Built-in EL panel driver.
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ELC, ELP (Muxed with SEG28, SEG29).
9. Built in Alarm, clock or single tone melody generator.
BZB, BZ (Muxed with SEG30, SEG31).
10. Built in key matrix scanning function.
K1~K12 (Shared with SEG1~SEG12).
KI1~KI4 (Muxed with SEG32~SEG35).
11. One 6-bit programmable timer with programmable clock source.
12. Watch dog timer.
13. Built-in Voltage doubler, halver, tripler charge pump circuit.
14. Dual clock operation.
slow clock oscillation can be defined as X’tal or external RC type oscillator by mask
option.
fast clock oscillation can be defined as internal R or external R type oscillator by
mask option.
15. HALT function.
16. STOP function.
BLOCK DIAGRAM
B1-4
ELC,ELP
BZ,BZB
B-PORT
EL DRIVER
ALARM
C1-4
KI1~KI4
SEG1-12,21-35
K1~K12
A1-4
COM1-5
VDD1-3
A-PORT
C-PORT
KEY-IN
LCD DRIVER
SEGMENT PLA
4 BITS DATA BUS
FREQUENCY
GENERATOR
TABLE ROM
256(12-N) X 8 BITS
ALU
DATA RAM
96 X 4 BITS
PRE-DIVIDER
6 BITS PRESET
TIMER 1
CONTROL
CIRCUIT
RESET
INT
8 LEVELS
STACK
11 BITS PROGRAM
COUNTER
INSTRUCTION
DECODER
PROGRAM ROM
128N X 16 BITS
N:1->12
OSCILLATOR
CUP1,2
XTIN,OUT
2
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
PAD DIAGRAM
1
44
32
12
19
21
The substrate of chip should be connected to GND.
PAD COORDINATE
No
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
Name
BAK
XIN
XOUT
GND
VDD1
VDD2
VDD3
CUP1
CUP2
COM1
COM2
COM3
COM4
COM5
SEG1(K1)
SEG2(K2)
SEG3(K3)
SEG4(K4)
SEG5(K5)
SEG6(K6)
SEG7(K7)
SEG8(K8)
X
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
207.50
322.50
437.50
552.50
667.50
782.50
1366.80
1481.80
1602.50
1602.50
Y
1399.10
1269.10
1154.10
1039.10
924.10
809.10
694.10
579.10
464.10
349.10
224.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
77.50
224.50
3
No
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
40
41
42
43
44
Name
SEG9(K9)
SEG10(K10)
SEG11(K11)
SEG12(K12)
SEG21
SEG22
SEG23
SEG24/IOA1
SEG25/IOA2
SEG26/IOA3
SEG27/IOA4
SEG28/IOB1/ELC
SEG29/IOB2/ELP
SEG30/IOB3/BZB
SEG31/IOB4/BZ
SEG32/IOC1/KI1
SEG33/IOC2/KI2
SEG34/IOC3/KI3
SEG35/IOC4/KI4
RESET
INT
TEST
X
1602.50
1602.50
1602.50
1602.50
1602.50
1602.50
1602.50
1602.50
1602.50
1602.50
1472.50
1357.50
1242.50
1127.50
1012.50
897.50
782.50
667.50
552.50
437.50
322.50
207.50
Y
344.70
464.10
579.10
694.10
809.10
924.10
1039.10
1154.10
1269.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
1399.10
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
PIN DESCRIPTION
Name
BAK
VDD1,2,3
I/O
P
P
Description
Power Back-up pin(+).
. At Li Mode, connect a 0.1u capacitor to GND.
LCD supply voltage and positive supply pins.
. In Ag power mode, connect positive power to VDD1.
. In Li or ExtV power mode, connect positive power to VDD2.
Input pin for external reset request signal, built-in internal pull-down resistor.
. Reset cycle time can be defined as “PH15/2” or “PH12/2” by mask option.
. Reset Type can be defined as “Level reset” or “Pulse reset” by mask option.
Input pin for external interrupt request signal.
. Falling edge or rising edge triggered is defined by mask option.
. Internal pull-down or pull-up resistor is defined by mask option.
Test signal input pin.
Switching pins for supply the LCD driving voltage to the VDD1,2,3 pins.
. Connect the CUP1 and CUP2 pins with non-polarized electrolytic capacitor when chip
operated in 1/2 or 1/3 bias mode.
. In no BIAS mode application, leave these pins opened
Time base counter frequency (clock specified. LCD alternating frequency. Alarm signal
frequency) or system clock oscillation.
. 32KHz Crystal oscillator.
. In FAST ONLY mode option, connect an external resistor could compose a RC
oscillator.
Output pins for driving the common pins of the LCD or LED panel.
Output pins for driving the LCD or LED panel segment.
Input / Output port A.
Input / Output port B.
Input / Output port C.
Output port for EL driver.
Output port for alarm, clock or single tone melody generator
Output port for key matrix scanning.(Shared with SEG1~SEG16)
Input port for key matrix.
Negative supply voltage.
RESET
I
INT
I
TESTA
CUP1,2
I
O
XIN
XOUT
I
O
COM1~5
SEG1-12,21-
35
IOA1-4
IOB1-4
IOC1-4
ELC/ELP
BZB/BZ
K1~16
KI1~4
GND
O
O
I/O
I/O
I/O
O
O
O
I
P
4
tenx technology, inc.
Rev.1.4 2001/9/4
TM8713
ABSOLOUTE MAXIMUM RATINGS
(GND= 0V)
Name
Symbol
VDD1
Maximum Supply Voltage
VDD2
VDD3
Maximum Input Voltage
Maximum output Voltage
Vin
Vout1
Vout2
Maximum Operating Temperature
Maximum Storage Temperature
Topg
Tstg
Range
-0.3 to 5.5
-0.3 to 5.5
-0.3 to 8.5
-0.3 to VDD1/2+0.3
-0.3 to VDD1/2+0.3
-0.3 to VDD3+0.3
-20 to +70
-25 to +125
Unit
V
V
V
V
V
V
℃
℃
POWER CONSUMPTION
at Ta=-20℃ to 70℃,GND= 0V
Name
HALT mode
Sym.
Condition
Min.
Typ.
2
Max.
Unit
uA
I
HALT1
Only 32.768KHz Crystal oscillator operating,
without loading.
Ag mode, VDD1=1.5V, BCF = 0
I
HALT2
Only 32.768KHz Crystal oscillator operating,
without loading.
Li mode, VDD2=3.0V, BCF = 0
2
uA
STOP mode
I
STOP
1
uA
Note : When RC oscillator function is operating, the current consumption will depend on the frequency of
oscillation.
INTERNAL RC FREQUENCY RANGE
Option Mode
250KHz
BAK
1.2V~1.5V
2.4V~5.0V
500KHz
1.2V~1.5V
2.4V~5.0V
Min.
300KHz
200KHz
550KHz
400KHz
Typ.
350KHz
250KHz
650KHz
500KHz
Max.
400KHz
300KHz
750KHz
600KHz
5
tenx technology, inc.
Rev.1.4 2001/9/4
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