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CY7C1318CV18-200BZXC: 产品描述1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165; 产品类别存储存储; 文件大小2MB，共30页; 制造商Rochester Electronics; 官网地址https://www.rocelec.com/; 标准

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CY7C1318CV18-200BZXC概述

1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165

CY7C1318CV18-200BZXC规格参数

参数名称	属性值
是否无铅	不含铅
是否Rohs认证	符合
厂商名称	Rochester Electronics
零件包装代码	BGA
包装说明	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
针数	165
Reach Compliance Code	unknown
最长访问时间	0.45 ns
其他特性	PIPELINED ARCHITECTURE
JESD-30 代码	R-PBGA-B165
JESD-609代码	e1
长度	15 mm
内存密度	18874368 bit
内存集成电路类型	DDR SRAM
内存宽度	18
湿度敏感等级	NOT SPECIFIED
功能数量	1
端子数量	165
字数	1048576 words
字数代码	1000000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	1MX18
封装主体材料	PLASTIC/EPOXY
封装代码	LBGA
封装形状	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	260
认证状态	COMMERCIAL
座面最大高度	1.4 mm
最大供电电压 (Vsup)	1.9 V
最小供电电压 (Vsup)	1.7 V
标称供电电压 (Vsup)	1.8 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子节距	1 mm
端子位置	BOTTOM
处于峰值回流温度下的最长时间	20
宽度	13 mm
Base Number Matches	1

CY7C1318CV18-200BZXC相似产品对比

	CY7C1318CV18-200BZXC	CY7C1318CV18-167BZC	CY7C1318CV18-250BZI	CY7C1318CV18-200BZI	CY7C1318CV18-250BZC	CY7C1318CV18-250BZXC	CY7C1320CV18-267BZXC	CY7C1320CV18-167BZC	CY7C1320CV18-250BZC	CY7C1320CV18-250BZXC
描述	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	1MX18 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	1MX18 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	512KX36 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	512KX36 DDR SRAM, 0.5ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	512KX36 DDR SRAM, 0.45ns, PBGA165, 13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
零件包装代码	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
包装说明	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, MO-216, FBGA-165	13 X 15 MM, 1.40 MM HEIGHT, LEAD FREE, MO-216, FBGA-165
针数	165	165	165	165	165	165	165	165	165	165
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown
最长访问时间	0.45 ns	0.5 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.45 ns	0.5 ns	0.45 ns	0.45 ns
其他特性	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE	PIPELINED ARCHITECTURE
JESD-30 代码	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165	R-PBGA-B165
长度	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm	15 mm
内存密度	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit	18874368 bit
内存集成电路类型	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM	DDR SRAM
内存宽度	18	18	18	18	18	18	36	36	36	36
功能数量	1	1	1	1	1	1	1	1	1	1
端子数量	165	165	165	165	165	165	165	165	165	165
字数	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	1048576 words	524288 words	524288 words	524288 words	524288 words
字数代码	1000000	1000000	1000000	1000000	1000000	1000000	512000	512000	512000	512000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	85 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	1MX18	1MX18	1MX18	1MX18	1MX18	1MX18	512KX36	512KX36	512KX36	512KX36
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA	LBGA
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE	GRID ARRAY, LOW PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
座面最大高度	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm	1.4 mm
最大供电电压 (Vsup)	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
最小供电电压 (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
标称供电电压 (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	TIN SILVER COPPER	TIN LEAD	TIN LEAD	TIN LEAD	TIN LEAD	TIN SILVER COPPER	NOT SPECIFIED	TIN LEAD	TIN LEAD	TIN SILVER COPPER
端子形式	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
端子节距	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
宽度	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm	13 mm
是否无铅	不含铅	含铅	含铅	含铅	含铅	不含铅	-	含铅	含铅	不含铅
是否Rohs认证	符合	不符合	不符合	不符合	不符合	符合	-	不符合	不符合	符合
厂商名称	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics	-	-	Rochester Electronics	Rochester Electronics	Rochester Electronics	Rochester Electronics
JESD-609代码	e1	e0	e0	e0	e0	e1	-	e0	e0	e1
湿度敏感等级	NOT SPECIFIED	3	3	3	3	3	-	3	3	3
峰值回流温度（摄氏度）	260	220	220	220	NOT SPECIFIED	260	-	220	220	260
处于峰值回流温度下的最长时间	20	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	40	-	NOT SPECIFIED	NOT SPECIFIED	20
Base Number Matches	1	1	1	1	1	1	-	-	-	-

CY7C1318CV18-200BZXC

CY7C1318CV18-200BZXC在线购买

CY7C1318CV18-200BZXC概述

CY7C1318CV18-200BZXC规格参数

CY7C1318CV18-200BZXC相似产品对比

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