REVISIONS
LTR
A
B
DESCRIPTION
Changes in accordance with NOR 5962-R076-92.
Redrawn with changes. Add devices 05 through 09. Add vendor
CAGE number 6Y440 to device types 01 through 04, N package only,
device types 05 through 09 X,Y,T, U and N. Add vendor CAGE
number 04713 to device types 02,03, and 04, X package only. Add
vendor CAGE number 65786 to device types 03 through 06 packages
X, Y, U, N, and M, and to device types 07 and 08, packages Y, U, N,
and M. Add vendor CAGE number 61772 to devices 05 and 06,
packages X, Y, M, N and U. Add vendor CAGE number 0K6N4 to
device types 03 through 08 packages Y,U,N, and M. Remove vendor
CAGE numbers 0BK02 and 0BYV4 from the drawing. Editorial
changes throughout.
Changes in accordance with NOR 5962-R098-95
Boilerplate update, part of 5 year review. ksr
DATE (YR-MO-DA)
91-11-26
93-0217
APPROVED
Ray Monnin
M. A. Frye
C
D
95-04-14
07-10-02
M. A. Frye
Robert M. Heber
THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED.
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
REV
SHEET
D
1
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
PREPARED BY
Kenneth S. Rice
CHECKED BY
Ray Monnin
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
http://www.dscc.dla.mil
APPROVED BY
Michael A. Frye
DRAWING APPROVAL DATE
88-09-27
REVISION LEVEL
D
SIZE
A
SHEET
DSCC FORM 2233
APR 97
.
MICROCIRCUIT, MEMORY, DIGITAL,
CMOS, 32K X 8 STATIC RAM (SRAM),
MONOLITHIC SILICON
CAGE CODE
67268
1 OF
14
5962-88662
5962-E598-07
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
accordance with MIL-PRF-38535, appendix A.
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
5962-88662
01
X_
A
Drawing number
Device type
(see 1.2.1)
Case outline
(see 1.2.2)
Lead finish
(see 1.2.3)
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
02
03
04
05
06
07
08
09
Generic number 1/
Circuit function
32K X 8 CMOS SRAM
Access time
100 ns
70 ns
55 ns
45 ns
35 ns
25 ns
20 ns
15 ns
12 ns
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Y
Z
U
T
N
M
Descriptive designator
GDIP1-T28 or CDIP2-T28
CQCC1-N32
CDFP3-F28
CQCC3-N28
CDFP4-F28
CDIP3-T28 or GDIP4-T28
GDFP2-F28
Terminals
28
32
28
28
28
28
28
Package style
Dual in-line
Rectangular leadless chip carrier
Flat pack
Rectangular leadless chip carrier
Flat pack
Dual in-line
Flat pack
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
Supply voltage range (V
CC
) ---------------------------------------
Input voltage range -------------------------------------------------
Ambient storage temperature ------------------------------------
Thermal resistance, junction-to-case (Θ
JC
) ------------------
Junction temperature (T
J
) -----------------------------------------
Power dissipation ---------------------------------------------------
Lead temperature (soldering, 10 seconds)--------------------
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) --------------------------------------
Ground voltage (V
SS
) ----------------------------------------------
Input high voltage range (V
IH
) -----------------------------------
Input low voltage range (V
IL
) -------------------------------------
Operating case temperature (T
C
) -------------------------------
1/
2/
3/
4.5 V dc to 5.5 V dc 2/
0 V dc
2.2 V dc to V
CC
+0.5 V dc
-0.5 V dc to 0.8 V dc
-55°C to +125°C
-0.5 V dc to +7.0 V dc 2/
-0.5 V dc to +6.0 V dc
-65°C to +150°C
See MIL-STD-1835
+150°C 3/
1.0 W
+260°C
Generic numbers are listed on the Standard Microcircuit Drawing Source Approval Bulletin and will also be listed in
MIL-HDBK-103.
All voltages referenced to V
SS
.
Maximum junction temperature shall not be exceeded except for allowable short duration burn-in screening conditions in
accordance with method 5004 of MIL-STD-883.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88662
SHEET
D
2
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATION
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Copies of these documents are available online at
http://assist.daps.dla.mil/quicksearch/
or
http://assist.daps.dla.mil
or from
the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-PRF-
38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying activity
approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan may make
modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device. These
modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-PRF-38535
is required to identify when the QML flow option is used.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535, appendix A and herein.
3.2.1 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.2 Truth table. The truth table shall be as specified on figure 2.
3.2.3 Case outlines. The case outlines shall be in accordance with 1.2.2 herein.
3.2.4 Die overcoat. Polyimide and silicone coatings are allowable as an overcoat on the die for alpha particle protection only.
Each coated microcircuit inspection lot (see inspection lot as defined in MIL-PRF-38535) shall be subjected to and pass the
internal moisture content test at 5000 ppm (see method 1018 of MIL-STD-883). The frequency of the internal water vapor
testing shall not be decreased unless approved by the preparing activity for class M. The TRB will ascertain the requirements
as provided by MIL-PRF-38535 for classes Q and V. Samples may be pulled any time after seal.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
as specified in table I and shall apply over the full case operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are described in table I.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88662
SHEET
D
3
TABLE I. Electrical performance characteristics.
Test
│
│Symbol
│
│
│
│
│I
LI
│
│
│
│I
LO
│
│
│
│
│
│
│V
OL
│
│
│
│V
OH
│
│
│
│I
CC1
│
│
│
│
│
│
│
│I
CC2
│
│
│
│I
CC3
│
│
│
│
│
│C
I
2/
│
│
│
│C
O
2/
│
│
│
Conditions
│
-55°C
≤
T
C
≤
+125°C
│
V
SS
= 0 V,
│
4.5 V
≤
V
CC
≤
5.5 V
│
unless otherwise specified
│
│V
CC
= maximum
│V
IN
= GND to V
CC
│
│
│V
CC
= maximum
│V
OUT
= GND to V
CC
│
│
CE
≥
V
IH
,
WE
≤
V
IL
│
│
│
│V
CC
= 4.5 V, I
OL
= 8 mA
│V
IL
= 0.8 V, V
IH
= 2.2 V
│
│
│V
CC
= 4.5 V, I
OH
= -4 mA
│V
IL
= 0.8 V, V
IH
= 2.2 V
│
│
│V
CC
= 5.5 V, f = f
max
1/
│
│
CE = V
IL
, outputs open
│
all other inputs at V
IL
│
│
│
│
│CE
≥
V
IH
, outputs open
│V
CC
= 5.5 V
│
│
│CE
≥
(V
CC
-0.2 V), f = 0 MHz
│
outputs open, V
CC
= 5.5 V
│
all other inputs
│
≤
0.2 V or
≥
(V
CC
-0.2 V)
│
│
│V
I
= 5.0 V or GND
│f
= 1 MHz, T
C
= +25°C
│See
4.3.1c
│
│V
O
= 5.0 V or GND
│f
= 1 MHz, T
C
= +25°C
│See
4.3.1c
│
│
│
Group A
│
Device
│subgroups │
Types
│
│
│
│
│
│
│
1,2,3
│
All
│
│
│
│
│
│
│
│
│
1,2,3
│
All
│
│
│
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
│
│
│
│
1,2,3
│
│
│
│
1,2,3
│
│
│
│
│
│
4
│
│
│
│
4
│
│
│
│
│
│
│
All
│
│
│
│
All
│
│
│
│
01,02
│
│
03-05
│
06
│
07
│
08
│
09
│
01-06
│
07
│
08
│
09
│
│
All
│
│
│
│
│
│
All
│
│
│
│
All
│
│
│
│
Limits
│
│
│
Min
│
Max
│
│
│
│
│
│
10
│
│
│
│
│
│
│
│
│
│
10
│
│
│
│
│
│
│
│
│
│
│
2.4
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
0.4
│
│
│
│
│
│
│
│
105
│
│
150
│
160
│
170
│
180
│
190
│
35
│
40
│
50
│
60
│
│
20
│
│
│
│
│
│
11
│
│
│
│
11
│
│
│
│Unit
│
│
│
│
│μA
│
│
│
│μA
│
│
│
│
│
│
│
V
│
│
│
│
V
│
│
│
│
mA
│
│
│
│
│
│
│
│
mA
│
│
│
│
mA
│
│
│
│
│
│
pF
│
│
│
│
pF
│
│
Input leakage current
Output leakage
current
Output low voltage
Output high voltage
Operating supply
current
Standby power supply
current (TTL)
Standby power supply
current (CMOS)
Input capacitance
Output capacitance
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88662
SHEET
D
4
TABLE I. Electrical performance characteristics - Continued.
Test
│
│Symbol
│
│
│
│
│t
AVAV
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│t
AVQV
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│t
ELQV
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Conditions
│
-55°C
≤
T
C
≤
+125°C
│
V
SS
= 0 V, 3/
│
4.5 V
≤
V
CC
≤
5.5 V
│
unless otherwise specified
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Group A
│
Device
│subgroups │
Types
│
│
│
│
│
│
│
9,10,11
│
01
│
│
│
│
02
│
│
│
│
03
│
│
│
│
04
│
│
│
│
05
│
│
│
│
06
│
│
│
│
07
│
│
│
│
08
│
│
│
│
09
│
│
│
9,10,11
│
01
│
│
│
│
02
│
│
│
│
03
│
│
│
│
04
│
│
│
│
05
│
│
│
│
06
│
│
│
│
07
│
│
│
│
08
│
│
│
│
09
│
│
│
9,10,11
│
01
│
│
│
│
02
│
│
│
│
03
│
│
│
│
04
│
│
│
│
05
│
│
│
│
06
│
│
│
│
07
│
│
│
│
08
│
│
│
│
09
│
│
│
│
Min
│
│
│100
│
│
70
│
│
55
│
│
45
│
│
35
│
│
25
│
│
20
│
│
15
│
│
12
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Limits
│
│
Max
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
100
│
│
70
│
│
55
│
│
45
│
│
35
│
│
25
│
│
20
│
│
15
│
│
12
│
│
100
│
│
70
│
│
55
│
│
45
│
│
35
│
│
25
│
│
20
│
│
15
│
│
12
│
│Unit
│
│
│
│
│
ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
ns
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
│
Read cycle time
Address access time
Chip-enable access
time
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-88662
SHEET
D
5
FPGA/CPLD
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