32KX8 UVPROM, 250ns, CDIP28, CERAMIC, DIP-28
| 参数名称 | 属性值 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最长访问时间 | 250 ns |
| JESD-30 代码 | R-GDIP-T28 |
| JESD-609代码 | e0 |
| 内存密度 | 262144 bit |
| 内存集成电路类型 | UVPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 32768 words |
| 字数代码 | 32000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 32KX8 |
| 输出特性 | 3-STATE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-8606302XA | FHP-02-02-H-S-K-TR | 5962-8606301XA | 5962-8606304XA | |
|---|---|---|---|---|
| 描述 | 32KX8 UVPROM, 250ns, CDIP28, CERAMIC, DIP-28 | Rectangular Power Connector, 2 Contact(s), Female, Surface Mount Terminal, | 32KX8 UVPROM, 200ns, CDIP28, CERAMIC, DIP-28 | 32KX8 UVPROM, 170ns, CDIP28, CERAMIC, DIP-28 |
| Reach Compliance Code | unknown | compliant | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| JESD-609代码 | e0 | e4 | e0 | e0 |
| 最高工作温度 | 125 °C | 105 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 零件包装代码 | DIP | - | DIP | DIP |
| 包装说明 | DIP, | - | DIP, | DIP, |
| 针数 | 28 | - | 28 | 28 |
| 最长访问时间 | 250 ns | - | 200 ns | 170 ns |
| JESD-30 代码 | R-GDIP-T28 | - | R-GDIP-T28 | R-GDIP-T28 |
| 内存密度 | 262144 bit | - | 262144 bit | 262144 bit |
| 内存集成电路类型 | UVPROM | - | UVPROM | UVPROM |
| 内存宽度 | 8 | - | 8 | 8 |
| 功能数量 | 1 | - | 1 | 1 |
| 端子数量 | 28 | - | 28 | 28 |
| 字数 | 32768 words | - | 32768 words | 32768 words |
| 字数代码 | 32000 | - | 32000 | 32000 |
| 工作模式 | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 32KX8 | - | 32KX8 | 32KX8 |
| 封装主体材料 | CERAMIC, GLASS-SEALED | - | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | - | DIP | DIP |
| 封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | - | IN-LINE | IN-LINE |
| 并行/串行 | PARALLEL | - | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | - | Not Qualified | Not Qualified |
| 筛选级别 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V |
| 表面贴装 | NO | - | NO | NO |
| 技术 | CMOS | - | CMOS | CMOS |
| 温度等级 | MILITARY | - | MILITARY | MILITARY |
| 端子面层 | TIN LEAD | - | TIN LEAD | TIN LEAD |
| 端子形式 | THROUGH-HOLE | - | THROUGH-HOLE | THROUGH-HOLE |
| 端子位置 | DUAL | - | DUAL | DUAL |
| Base Number Matches | 1 | - | 1 | 1 |
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