P R E L I M I N A RY I N F O R M AT I O N
ICS557-07
2:1 M
ULTIPLEXER
C
HIP FOR PCI
-
E
Description
The ICS557-07 is a 2:1 HCSL multiplexer chip that
allows the user to select one of the two input pairs of
HCSL (Host Clock Signal Level) or LVDS inputs and
fans out to one pair of differential HCSL outputs. This
chip is suited especially for PCI-Express applications,
where there is a need to select the PCI-Express clock
locally from the PCI-E card or from the motherboard.
Features
•
•
•
•
•
Packaged in 16-pin TSSOP
Available in Pb (lead) free package
Operating voltage of 3.3 V
Low power consumption
Input differential clock of up to 200 MHz (can accept
LVDS, HCSL)
differential pair)
•
Output, one pair (HCSL, 0.7 V Current mode
•
Jitter 60 ps (peak-to-peak)
•
Operating frequency of 80 MHz to 200 MHz
Block Diagram
VDD
3
OE
IN1
IN1
IN2
IN2
CLK
MUX
2 to 1
CLK
3
SEL
GND
PD
Rr (IREF)
MDS 557-07 B
I n t e gra te d C i r c u i t S y s t e m s
●
1
525 Race Stre et, San Jo se, CA 9 5126
●
Revision 041405
te l (40 8) 2 97-12 01
●
w w w. i c st . c o m
P R E L I M I N A R Y I N F O R M AT I O N
ICS557-07
2:1 Multiplexer Chip for PCI-E
Pin Assignment
VDD
IN1
IN1
PD
IN2
IN2
OE
GND
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
SEL
GND
GND
VDD
VDD
CLK
CLK
IREF
Select Table
SEL
0
1
Input Pair
selected
IN2/ IN2
IN1/ IN1
16-pin (173 mil) TSSOP
Pin Descriptions
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
Pin
Name
VDD
IN1
IN1
PD
IN2
IN2
OE
GND
Rr(IREF)
CLK
CLK
VDD
VDD
GND
GND
SEL
Pin
Type
Power
Input
Input
Input
Input
Input
Input
Power
Output
Output
Output
Power
Power
Power
Power
Input
HCSL/LVDS true input signal 1.
Pin Description
Connect to +3.3 V. Supply voltage for Input clocks.
HCSL/LVDS complimentary input signal 1.
Powers down the chip and tri-states outputs when low. Internal pull-up resistor.
HCSL/LVDS true input signal 2.
HCSL/LVDS complimentary input signal 2.
Provides fast output on, tri-states output (High = enable outputs; Low = disable).
Internal pull-up resistor.
Connect to ground.
Precision resistor attached to this pin is connected to the internal current reference.
HCSL differential complimentary clock .
HCSL True clock.
Connect to +3.3 V. Supply Voltage for output clocks.
Connect to +3.3 V. Supply Voltage for output clocks.
Connect to ground.
Connect to ground.
SEL=1 selects IN1/IN1. SEL =0 selects IN2/ IN2. Internal pull-up resistor.
MDS 557-07 B
In te grated Circuit Systems
●
2
525 Ra ce Street, San Jose, CA 9512 6
●
Revision 041405
tel (4 08) 297-1 201
●
w w w. i c s t . c o m
P R E L I M I N A R Y I N F O R M AT I O N
ICS557-07
2:1 Multiplexer Chip for PCI-E
Applications Information
External Components
A minimum number of external components are
required for proper operation.
Output Structures
IREF
=2.3 mA
6*IREF
Decoupling Capacitors
Decoupling capacitors of 0.01
µF
should be connected
between VDD and the ground plane (pin 4) as close to
the VDD pin as possible. Do not share ground vias
between components. Route power from power source
through the capacitor pad and then into ICS pin.
Crystal
A 25 MHz fundamental mode parallel resonant crystal
with C
L
= 16 pF should be used. This crystal must have
less than 300 ppm of error across temperature in order
for the ICS557-07 to meet PCI Express specifications.
R
R
475
Ω
See Output Termination
Sections - Pages 3 ~ 5
Crystal Capacitors
Crystal capacitors are connected from pins X1 to
ground and X2 to ground to optimize the accuracy of
the output frequency.
C
L
= Crystal’s load capacitance in pF
Crystal Capacitors (pF) = (C
L
- 8) * 2
For example, for a crystal with a 16 pF load cap, each
external crystal cap would be 16 pF. (16-8)*2=16.
General PCB Layout Recommendations
For optimum device performance and lowest output
phase noise, the following guidelines should be
observed.
1. Each 0.01µF decoupling capacitor should be
mounted on the component side of the board as close
to the VDD pin as possible.
2. No vias should be used between decoupling
capacitor and VDD pin.
3. The PCB trace to VDD pin should be kept as short
as possible, as should the PCB trace to the ground via.
Distance of the ferrite bead and bulk decoupling from
the device is less critical.
4. An optimum layout is one with all components on the
same side of the board, minimizing vias through other
signal layers (any ferrite beads and bulk decoupling
capacitors can be mounted on the back). Other signal
traces should be routed away from the ICS557-07.This
includes signal traces just underneath the device, or on
layers adjacent to the ground plane layer used by the
device.
Current Source (Iref) Reference Resistor - R
R
If board target trace impedance (Z) is 50Ω then R
R
=
,
475Ω (1%), providing IREF of 2.32 mA. The output
current (I
OH
) is equal to 6*IREF.
Output Termination
The PCI-Express differential clock outputs of the
ICS557-07 are open source drivers and require an
external series resistor and a resistor to ground. These
resistor values and their allowable locations are shown
in detail in the
PCI-Express Layout Guidelines
section.
The ICS557-07can also be configured for LVDS
compatible voltage levels. See the
LVDS Compatible
Layout Guidelines
section
MDS 557-07 B
In te grated Circuit Systems
●
3
525 Ra ce Street, San Jose, CA 9512 6
●
Revision 041405
tel (4 08) 297-1 201
●
w w w. i c s t . c o m
P R E L I M I N A R Y I N F O R M AT I O N
ICS557-07
2:1 Multiplexer Chip for PCI-E
Absolute Maximum Ratings
Stresses above the ratings listed below can cause permanent damage to the ICS557-07. These ratings are
stress ratings only. Functional operation of the device at these or any other conditions above those
indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods can affect product reliability. Electrical parameters are guaranteed
only over the recommended operating temperature range.
Item
Supply Voltage, VDD
All Inputs and Outputs
Ambient Operating Temperature
Storage Temperature
Junction Temperature
Soldering Temperature
ESD Protection (Input)
5.5 V
Rating
-0.5 V to VDD+0.5 V
0 to +70° C
-65 to +150° C
125° C
260° C
2000 V min. (HBM)
DC Electrical Characteristics
Unless stated otherwise,
VDD = 3.3 V ±5%,
Ambient Temperature 0 to +70° C
Parameter
Supply Voltage
Input High Voltage
1
Input Low Voltage
1
Input Leakage Current
2
Operating Supply Current
Symbol
V
V
IH
V
IL
I
IL
I
DD
I
DDOE
I
DDPD
Input Capacitance
Output Capacitance
Pin Inductance
Output Resistance
Pull-up Resistor
C
IN
C
OUT
L
PIN
R
OUT
R
PU
region.
Conditions
OE, SEL, PD
OE, SEL, PD
0 < Vin < VDD
50Ω 2 pF
,
OE =Low
No load, PD =Low
Input pin capacitance
Output pin capacitance
CLK, each output
Min.
3.135
2.0
VDD-0.3
-5
Typ.
Max.
3.465
VDD +0.3
0.8
5
40
20
400
7
6
5
Units
V
V
µA
mA
mA
µA
pF
pF
nH
kΩ
kΩ
3.0
110
1
Single edge is monotonic when transitioning through
2
Inputs with pull-ups/-downs are not included.
MDS 557-07 B
In te grated Circuit Systems
●
4
525 Ra ce Street, San Jose, CA 9512 6
●
Revision 041405
tel (4 08) 297-1 201
●
w w w. i c s t . c o m
P R E L I M I N A R Y I N F O R M AT I O N
ICS557-07
2:1 Multiplexer Chip for PCI-E
AC Electrical Characteristics - CLKOUTA/CLKOUTB
Unless stated otherwise,
VDD=3.3 V ±5%,
Ambient Temperature 0 to +70° C
Parameter
Input Frequency
Output Frequency
Input High Voltage
1,2
Input Low Voltage
Differential Input
Voltages
Input Offset Voltage
Output High Voltage
1,2
Output Low Voltage
Crossing Point
Voltage
1,2
Crossing Point
Voltage
1,2,4
Jitter, Cycle-to-Cycle
1,3
Rise Time
1,2
Fall Time
1,2
Rise/Fall Time
Variation
1,2
Duty Cycle
1,3
Output Enable Time
5
Output Disable Time
5
Stabilization Time
Input to Output Delay
1
2
3
4
5
1,2
1,2
Symbol
Conditions
Min.
80
80
Typ.
Max.
200
200
Units
MHz
MHz
mV
mV
mV
V
mV
mV
mV
mV
ps
V
IH
V
IL
(V
ID
)
(V
IS
)
V
OH
V
OL
HCSL
HCSL
LVDS
LVDS
HCSL
HCSL
Absolute
Variation over all edges
660
-150
250
1.125
660
-150
250
700
0
350
1.25
700
0
350
850
450
1.375
850
550
140
60
t
OR
t
OF
From 0.175 V to 0.525 V
From 0.525 V to 0.175 V
175
175
332
344
700
700
125
45
All outputs
All outputs
t
STABLE
From power-up VDD=3.3 V
Measured at crossing points
10
10
3.0
4
55
ps
ps
ps
%
µs
µs
ms
ns
Test setup is R
L
=50 ohms with 2 pF, Rr = 475Ω (1%).
Measurement taken from a single-ended waveform.
Measurement taken from a differential waveform.
Measured at the crossing point where instantaneous voltages of both CLKOUT and CLKOUT are equal.
CLK and CLK pins are tri-stated when OE is Low. CLK and CLK are driven differential when OE is High unless its
PD = low.
Thermal Characteristics
Parameter
Thermal Resistance Junction to
Ambient
Symbol
θ
JA
θ
JA
θ
JA
θ
JC
Conditions
Still air
1 m/s air flow
3 m/s air flow
Min.
Typ.
93
78
65
20
Max. Units
°
C/W
°
C/W
°
C/W
°
C/W
Thermal Resistance Junction to Case
MDS 557-07 B
In te grated Circuit Systems
●
5
525 Ra ce Street, San Jose, CA 9512 6
●
Revision 041405
tel (4 08) 297-1 201
●
w w w. i c s t . c o m
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