Composite Transistors
XP05534
(0.425)
Silicon NPN epitaxial planar type
0.2
±0.05
Unit: mm
0.12
+0.05
–0.02
For high-frequency amplification
■
Features
•
High transition frequency f
T
•
Two elements incorporated into one package
•
Reduction of the mounting area and assembly cost by one half
10˚
6
5
4
1.25
±0.10
2.1
±0.1
1
2
3
(0.65) (0.65)
1.3
±0.1
2.0
±0.1
0.9
±0.1
•
2SC2404
×
2
1: Emitter (Tr1)
2: Base (Tr1)
3: Base (Tr2)
EIAJ: SC-88
0 to 0.1
■
Absolute Maximum Ratings
T
a
=
25°C
Parameter
Collector-base voltage (Emitter open)
Collector-emitter voltage (Base open)
Emitter-base voltage (Collector open)
Collector current
Total power dissipation
Junction temperature
Storage temperature
Symbol
V
CBO
V
CEO
V
EBO
I
C
P
T
T
j
T
stg
Rating
30
20
3
15
150
150
−55
to
+150
Unit
V
V
V
mA
mW
°C
°C
Marking Symbol: IS
Internal Connection
6
5
4
Tr1
0.9
+0.2
–0.1
■
Basic Part Number
4: Collector (Tr2)
5: Emitter (Tr2)
6: Collector (Tr1)
SMini6-G1 Package
Tr2
1
2
3
■
Electrical Characteristics
T
a
=
25°C
±
3°C
Parameter
Collector-base voltage (Emitter open)
Emitter-base voltage (Collector open)
Base-emitter voltage
Forward current transfer ratio
Transition frequency
Reverse transfer capacitance
(Common emitter)
Power gain
Noise figure
Symbol
V
CBO
V
EBO
V
BE
h
FE
f
T
C
re
G
P
NF
Conditions
I
C
=
10
µA,
I
E
=
0
I
E
=
10
µA,
I
C
=
0
V
CB
=
6 V, I
E
= −1
mA
V
CB
=
6 V, I
E
= −1
mA
V
CB
=
6 V, I
E
= −1
mA, f
=
100 MHz
V
CB
=
6 V, I
E
= −1
mA, f
=
10.7 MHz
V
CB
=
6 V, I
E
= −1
mA, f
=
100 MHz
V
CB
=
6 V, I
E
= −1
mA, f
=
100 MHz
40
450
650
0.8
24
3.3
1.0
Min
30
3
720
Typ
Max
Unit
V
V
mV
MHz
pF
dB
dB
Note) Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors.
0.2
±0.1
5˚
Publication date: March 2004
SJJ00192AED
1
Request for your special attention and precautions in using the technical information
and semiconductors described in this material
(1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of
the products or technical information described in this material and controlled under the "Foreign Exchange
and Foreign Trade Law" is to be exported or taken out of Japan.
(2) The technical information described in this material is limited to showing representative characteristics and
applied circuits examples of the products. It neither warrants non-infringement of intellectual property right
or any other rights owned by our company or a third party, nor grants any license.
(3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical
information as described in this material.
(4) The products described in this material are intended to be used for standard applications or general elec-
tronic equipment (such as office equipment, communications equipment, measuring instruments and house-
hold appliances).
Consult our sales staff in advance for information on the following applications:
•
Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus-
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required, or if the failure or malfunction of the products may directly jeopardize life or harm the human
body.
•
Any applications other than the standard applications intended.
(5) The products and product specifications described in this material are subject to change without notice for
modification and/or improvement. At the final stage of your design, purchasing, or use of the products,
therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica-
tions satisfy your requirements.
(6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat-
ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not
be liable for any defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of
break down and failure mode, possible to occur to semiconductor products. Measures on the systems such
as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent
physical injury, fire, social damages, for example, by using the products.
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