Small Signal Bipolar Transistor, 12V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
零件包装代码 | SOT |
包装说明 | SMALL OUTLINE, R-CDSO-N3 |
针数 | 3 |
Reach Compliance Code | compliant |
集电极-发射极最大电压 | 12 V |
配置 | SINGLE |
最小直流电流增益 (hFE) | 30 |
JESD-30 代码 | R-CDSO-N3 |
元件数量 | 1 |
端子数量 | 3 |
最高工作温度 | 200 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
极性/信道类型 | NPN |
最大功率耗散 (Abs) | 0.4 W |
认证状态 | Qualified |
参考标准 | MIL-19500/399 |
表面贴装 | YES |
端子形式 | NO LEAD |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
晶体管应用 | SWITCHING |
晶体管元件材料 | SILICON |
Base Number Matches | 1 |
JAN2N3960UB | JANTX2N3960UB | 2N3960UB | JANTXV2N3960UB | |
---|---|---|---|---|
描述 | Small Signal Bipolar Transistor, 12V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3 | Small Signal Bipolar Transistor, 12V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3 | Small Signal Bipolar Transistor, 12V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3 | Small Signal Bipolar Transistor, 12V V(BR)CEO, 1-Element, NPN, Silicon, HERMETIC SEALED, CERAMIC, CERSOT-3 |
零件包装代码 | SOT | SOT | SOT | SOT |
包装说明 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-CDSO-N3 | SMALL OUTLINE, R-CDSO-N3 |
针数 | 3 | 3 | 3 | 3 |
Reach Compliance Code | compliant | compliant | unknown | compli |
集电极-发射极最大电压 | 12 V | 12 V | 12 V | 12 V |
配置 | SINGLE | SINGLE | SINGLE | SINGLE |
最小直流电流增益 (hFE) | 30 | 30 | 30 | 30 |
JESD-30 代码 | R-CDSO-N3 | R-CDSO-N3 | R-CDSO-N3 | R-CDSO-N3 |
元件数量 | 1 | 1 | 1 | 1 |
端子数量 | 3 | 3 | 3 | 3 |
最高工作温度 | 200 °C | 200 °C | 200 °C | 200 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
极性/信道类型 | NPN | NPN | NPN | NPN |
认证状态 | Qualified | Qualified | Not Qualified | Qualified |
表面贴装 | YES | YES | YES | YES |
端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
端子位置 | DUAL | DUAL | DUAL | DUAL |
晶体管应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
晶体管元件材料 | SILICON | SILICON | SILICON | SILICON |
是否Rohs认证 | 符合 | 符合 | - | 符合 |
峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
最大功率耗散 (Abs) | 0.4 W | 0.4 W | - | 0.4 W |
参考标准 | MIL-19500/399 | MIL-19500/399 | - | MIL-19500/399 |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED |
Base Number Matches | 1 | 1 | 1 | - |
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