CPACK-56, Tube
参数名称 | 属性值 |
Brand Name | Integrated Device Technology |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | IDT (Integrated Device Technology) |
零件包装代码 | CPACK |
包装说明 | CERPACK-56 |
针数 | 56 |
制造商包装代码 | CS56 |
Reach Compliance Code | not_compliant |
其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
系列 | FCT |
JESD-30 代码 | R-GDFP-F56 |
JESD-609代码 | e0 |
长度 | 18.415 mm |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER |
湿度敏感等级 | 1 |
位数 | 8 |
功能数量 | 2 |
端口数量 | 2 |
端子数量 | 56 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DFP |
封装形状 | RECTANGULAR |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | NOT SPECIFIED |
传播延迟(tpd) | 8 ns |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 |
座面最大高度 | 2.413 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | TIN LEAD |
端子形式 | FLAT |
端子节距 | 0.635 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 9.652 mm |
Base Number Matches | 1 |
5962-9228302MXA | 5962-9228303MXA | 5962-9228301MXX | 5962-9228301MXA | 5962-9228303MXX | 5962-9228302MXX | |
---|---|---|---|---|---|---|
描述 | CPACK-56, Tube | CPACK-56, Tube | Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 | CPACK-56, Tube | Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 | Registered Bus Transceiver, FCT Series, 2-Func, 8-Bit, True Output, CMOS, CDFP56, CERPACK-56 |
零件包装代码 | CPACK | CPACK | DFP | CPACK | DFP | DFP |
包装说明 | CERPACK-56 | CERPACK-56 | DFP, | CERPACK-56 | DFP, | DFP, |
针数 | 56 | 56 | 56 | 56 | 56 | 56 |
Reach Compliance Code | not_compliant | not_compliant | unknown | not_compliant | unknown | unknown |
其他特性 | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE | WITH INDEPENDENT OUTPUT ENABLE FOR EACH DIRECTION; WITH CLOCK ENABLE |
系列 | FCT | FCT | FCT | FCT | FCT | FCT |
JESD-30 代码 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 | R-GDFP-F56 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm | 18.415 mm |
逻辑集成电路类型 | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER | REGISTERED BUS TRANSCEIVER |
位数 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端口数量 | 2 | 2 | 2 | 2 | 2 | 2 |
端子数量 | 56 | 56 | 56 | 56 | 56 | 56 |
最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
输出特性 | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR | 3-STATE WITH SERIES RESISTOR |
输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DFP | DFP | DFP | DFP | DFP | DFP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK | FLATPACK |
传播延迟(tpd) | 8 ns | 7.3 ns | 11 ns | 11 ns | 7.3 ns | 8 ns |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
筛选级别 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 | MIL-STD-883 |
座面最大高度 | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm | 2.413 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | FLAT | FLAT | FLAT | FLAT | FLAT | FLAT |
端子节距 | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm | 0.635 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm |
Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 |
厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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