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5962F9863301VCC: 产品描述AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16; 产品类别逻辑逻辑; 文件大小38KB，共2页; 制造商Renesas(瑞萨电子); 官网地址https://www.renesas.com/

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5962F9863301VCC概述

AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16

5962F9863301VCC规格参数

参数名称	属性值
零件包装代码	DIP
包装说明	DIP,
针数	16
Reach Compliance Code	unknown
系列	AC
JESD-30 代码	R-CDIP-T16
JESD-609代码	e4
逻辑集成电路类型	ENCODER
位数	9
功能数量	1
端子数量	16
最高工作温度	125 °C
最低工作温度	-55 °C
封装主体材料	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP
封装形状	RECTANGULAR
封装形式	IN-LINE
传播延迟（tpd）	17 ns
认证状态	Not Qualified
筛选级别	MIL-PRF-38535 Class V
座面最大高度	5.08 mm
表面贴装	NO
技术	CMOS
温度等级	MILITARY
端子面层	GOLD
端子形式	THROUGH-HOLE
端子节距	2.54 mm
端子位置	DUAL
总剂量	300k Rad(Si) V
宽度	7.62 mm
Base Number Matches	1

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ACS147MS

Data Sheet

July 1999

File Number

4761

Radiation Hardened 10-to-4 Line Priority

Encoder

These nine-input priority encoders accept data from nine

active LOW inputs and provide a binary representation on

the four active LOW outputs. A priority is assigned to each

input so that when two or more inputs are simultaneously

active, the input with the highest priority is represented on

the output. Input line I9 has the highest priority.

These devices provide the 10-to-4-line priority encoding

function by use of the implied decimal “zero”. The “zero” is

encoded when all nine data inputs are HIGH, forcing all four

outputs HIGH.

The ACS147MS is fabricated on a CMOS Silicon on

Sapphire (SOS) process, which provides an immunity to

Single Event Latch-up and the capability of highly reliable

performance in any radiation environment.

Speciﬁcations for Rad Hard QML devices are controlled

by the Defense Supply Center in Columbus (DSCC). The

SMD numbers listed below must be used when ordering.

Detailed Electrical Speciﬁcations for the ACS147MS are

contained in SMD 5962-98633. A “hot-link” is provided

on our homepage for downloading.

http://www.intersil.com/spacedefense/spaceselect.htm

Features

• QML Qualiﬁed Per MIL-PRF-38535 Requirements

• 1.25 Micron Radiation Hardened SOS CMOS

• Radiation Environment

- Latch-Up Free Under Any Conditions

- Total Dose (Max.) . . . . . . . . . . . . . . . . . 3 x 10

RAD(Si)

- SEU Immunity . . . . . . . . . . . . . <1 x 10

-10

Errors/Bit/Day

- SEU LET Threshold . . . . . . . . . . . . >100MeV/(mg/cm

)

• Input Logic Levels. . . . V

= (0.3)(V

), V

= (0.7)(V

)

• Output Current

. . . . . . . . . . . . . . . . . . . . . . . . . . ±12mA

(Min)

• Quiescent Supply Current . . . . . . . . . . . . . . . 20µA (Max)

• Propagation Delay . . . . . . . . . . . . . . . . . . . . . . 17ns (Max)

Applications

• High Speed Control Circuits

• Sensor Monitoring

• Low Power Designs

Ordering Information

ORDERING NUMBER

5962F9863301VCC

ACS147D/SAMPLE-03

5962F9863301VXC

ACS147K/SAMPLE-03

5962F9863301V9A

INTERNAL MARKETING

NUMBER

ACS147DMSR-03

ACS147D/SAMPLE-03

ACS147KMSR-03

ACS147K/SAMPLE-03

ACS147HMSR-03

TEMP. RANGE (

-55 to 125

PACKAGE

16 Ld SBDIP

16 Ld Flatpack

Die

DESIGNATOR

CDIP2-T16

CDFP4-F16

Pinouts

ACS147MS

(SBDIP)

TOP VIEW

I4 1

I5 2

I6 3

I7 4

I8 5

Y2 6

Y1 7

GND 8

16 V

15 NC

14 Y3

13 I3

12 I2

11 I1

10 I9

9 Y0

GND

ACS147MS

(FLATPACK)

TOP VIEW

CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.

5962F9863301VCC相似产品对比

	5962F9863301VCC	ACS147HMSR-03	ACS147DMSR-03	5962F9863301VXC	5962F9863301V9A	ACS147KMSR-03
描述	AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16	AC SERIES, 9-BIT ENCODER, UUC15, DIE-15	AC SERIES, 9-BIT ENCODER, CDIP16, SIDE BRAZED, CERAMIC, DIP-16	AC SERIES, 9-BIT ENCODER, CDFP16, CERAMIC, DFP-16	AC SERIES, 9-BIT ENCODER, UUC16, DIE-16	AC SERIES, 9-BIT ENCODER, CDFP16, CERAMIC, DFP-16
零件包装代码	DIP	DIE	DIP	DFP	DIE	DFP
包装说明	DIP,	DIE,	DIP,	DFP, FL16,.3	DIE,	DFP,
针数	16	15	16	16	16	16
Reach Compliance Code	unknown	unknown	unknown	not_compliant	unknown	unknow
系列	AC	AC	AC	AC	AC	AC
JESD-30 代码	R-CDIP-T16	X-XUUC-N15	R-CDIP-T16	R-CDFP-F16	S-XUUC-N16	R-CDFP-F16
逻辑集成电路类型	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER	ENCODER
位数	9	9	9	9	9	9
功能数量	1	1	1	1	1	1
端子数量	16	15	16	16	16	16
封装主体材料	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	UNSPECIFIED	CERAMIC, METAL-SEALED COFIRED
封装代码	DIP	DIE	DIP	DFP	DIE	DFP
封装形状	RECTANGULAR	UNSPECIFIED	RECTANGULAR	RECTANGULAR	SQUARE	RECTANGULAR
封装形式	IN-LINE	UNCASED CHIP	IN-LINE	FLATPACK	UNCASED CHIP	FLATPACK
传播延迟（tpd）	17 ns	17 ns	17 ns	17 ns	17 ns	17 ns
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
筛选级别	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V	MIL-PRF-38535 Class V
表面贴装	NO	YES	NO	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
端子形式	THROUGH-HOLE	NO LEAD	THROUGH-HOLE	FLAT	NO LEAD	FLAT
端子位置	DUAL	UPPER	DUAL	DUAL	UPPER	DUAL
总剂量	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V	300k Rad(Si) V
最高工作温度	125 °C	-	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-	-55 °C	-55 °C	-55 °C	-55 °C
座面最大高度	5.08 mm	-	5.08 mm	2.92 mm	-	2.92 mm
温度等级	MILITARY	-	MILITARY	MILITARY	MILITARY	MILITARY
端子节距	2.54 mm	-	2.54 mm	1.27 mm	-	1.27 mm
宽度	7.62 mm	-	7.62 mm	6.73 mm	-	6.73 mm
厂商名称	-	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)	Renesas(瑞萨电子)

5962F9863301VCC

5962F9863301VCC概述

5962F9863301VCC规格参数

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