HCPL-520x, HCPL-523x, HCPL-623x,
HCPL-625x, 5962-88768 and 5962-88769
1
Hermetically Sealed Low IF, Wide VCC, Logic Gate
Optocouplers
Data Sheet
Description
These units are single, dual and quad channel, hermetically
sealed optocouplers. The products are capable of operation
and storage over the full military temperature range and can
be purchased as either commercial product or with full
MIL-PRF-38534 Class Level H or K testing or from the
appropriate DLA Standard Microcircuit Drawing (SMD). All
devices are manufactured and tested on a MIL-PRF-38534
certified line, and Class H and K devices are included in the DLA
Qualified Manufacturers List QML-38534 for Hybrid
Microcircuits.
Each channel contains an AlGaAs light emitting diode that is
optically coupled to an integrated high gain photon detector.
The detector has a threshold with hysteresis, which provides
differential mode noise immunity and eliminates the potential
for output signal chatter. The detector in the single-channel
units has a tri-state output stage that allows for direct
connection to data buses. The output is noninverting. The
detector IC has an internal shield that provides a guaranteed
common mode transient immunity of up to 10,000 V/μs.
Improved power supply rejection eliminates the need for
special power supply bypass precautions.
Features
Dual marked with device part number and DLA Standard
Microcircuit Drawing (SMD)
Manufactured and tested on a MIL-PRF-38534 certified line
QML-38534, Class H and K
Four hermetically sealed package configurations
Performance guaranteed over –55°C to +125°C
Wide V
CC
range (4.5V to 20V)
350 ns maximum propagation delay
CMR: > 10,000 V/μs typical
1500 Vdc withstand test voltage
Three-state output available
High radiation immunity
HCPL-2200/31 function compatibility
Reliability data available
Compatible with LSTTL, TTL, and CMOS logic
Applications
CAUTION
It is advised that normal static precautions be
taken in handling and assembly of this
component to prevent damage and/or
degradation which may be induced by ESD.
Military and space
High reliability systems
Transportation and life critical systems
High-speed line receiver
Isolated bus driver (single channel)
Pulse transformer replacement
Ground loop elimination
Harsh industrial environments
Computer-peripheral interfaces
1.
See
Selection Guide–Package Styles and Lead Configuration
Options
for available extensions.
Broadcom
-1-
HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769
Data Sheet
Functional Diagram
Functional Diagram
Multiple-channel devices are available.
V
CC
V
O
Truth Tables
(Positive Logic)
Multichannel Devices
Input
On (H)
Output
H
L
V
E
GND
Off (L)
Single Channel Devices
Package styles for these parts are 8-pin DIP through hole (case
outline P), 16-pin DIP flat pack (case outline F), and leadless
ceramic chip carrier (case outline 2). Devices can be purchased
with a variety of lead bend and plating options. See
Selection
Guide–Package Styles and Lead Configuration Options
for
details. Standard Microcircuit Drawing (SMD) parts are
available for each package and lead style.
Because the same electrical die (emitters and detectors) are
used for each channel of each device listed in this data sheet,
absolute maximum ratings, recommended operating
conditions, electrical specifications, and performance
characteristics shown in the figures are identical for all parts.
Occasional exceptions exist due to package variations and
limitations and are as noted. Additionally, the same package
assembly processes are used in all devices. These similarities
give justification for the use of data obtained from one part to
represent other part’s performance for die related reliability
and certain limited radiation test results.
Input
On (H)
Off (L)
On (H)
Off (L)
Enable
H
H
L
L
Output
Z
Z
H
L
NOTE
A 0.1-μF bypass capacitor must be connected
between V
CC
and GND pins.
Functional Diagrams
8-Pin DIP
Through Hole
1 Channel
1
2
3
4
V
CC
V
O
8
7
6
5
8-Pin DIP
Through Hole
2 Channels
1
2
3
4
V
CC
V
O1
V
O2
8
7
6
5
1
2
3
4
5
6
7
8
16-Pin Flat Pack
Unformed Leads
4 Channels
16
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
13
12
11
10
9
20-Pad LCCC
Surface Mount
2 Channels
15
V
CC2
19
20
2
3
GND
1
7
8
V
O2
GND
2
V
O1
V
CC1
13
12
10
V
E
GND
GND
NOTE
Multichannel DIP and flat pack devices have common V
CC
and ground. Single-channel DIP has an enable pin 6.
LCCC (leadless ceramic chip carrier) package has isolated channels with separate V
CC
and ground connections.
All diagrams are top view.
Broadcom
-2-
HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769
Data Sheet
Selection Guide–Package Styles and Lead Configuration Options
Selection Guide–Package Styles and Lead Configuration Options
Package
Lead Style
Channels
Common Channel Wiring
Part Numbers and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped
b
Butt Joint/Gold Plate
a
Gull Wing/Soldered
b
Class H SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
Class K SMD Part Number
Prescript for all below
Gold Plate
a
Solder Dipped
b
Butt Joint/Gold Plate
a
Butt Joint/Soldered
b
Gull Wing/Soldered
b
a.
b.
Solder lead finish: Sn63/Pb37.
8-Pin DIP
Through Hole
1
None
8-Pin DIP
Through Hole
2
V
CC
GND
16-Pin Flat Pack
Unformed Leads
4
V
CC
GND
20-Pad LCCC
Surface Mount
2
None
HCPL-5200
HCPL-5201
HCPL-520K
Gold Plate
a
Option 200
Option 100
Option 300
HCPL-5230
HCPL-5231
HCPL-523K
Gold Plate
a
Option 200
Option 100
Option 300
HCPL-6250
HCPL-6251
HCPL-625K
Gold Plate
a
HCPL-6230
HCPL-6231
HCPL-623K
Solder Pads
b
5962-
8876801PC
8876801PA
8876801YC
8876801YA
8876801XA
5962-
8876901PC
8876901PA
8876901YC
8876901YA
8876901XA
5962-
8876903FC
5962-
88769022A
5962-
8876802KPC
8876802KPA
8876802KYC
8876802KYA
8876802KXA
5962-
8876904KPC
8876904KPA
8876904KYC
8876904KYA
8876904KXA
5962-
8876906KFC
5962-
8876905K2A
Gold Plate lead finish: Maximum gold thickness of leads is <100 micro inches. Typical is 60 to 90 micro inches.
Broadcom
-3-
HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769
Data Sheet
Outline Drawings
Outline Drawings
8-Pin DIP Through Hole, 1 and 2 Channel
10.03 (0.395)
10.29 (0.405)
1.02 (0.040)
1.52 (0.060)
4.32 (0.170)
MAX.
0.51 (0.020)
MIN.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
7.36 (0.290)
7.87 (0.310)
2.29 (0.090)
2.79 (0.110)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.51 (0.020)
MAX.
16-Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
2.84 (0.112)
MAX.
8.13 (0.320)
MAX.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
0.88 (0.0345)
MIN.
9.14 (0.360)
8.64 (0.340)
0.30 (0.012)
0.23 (0.009)
Broadcom
-4-
HCPL-520x, HCPL-523x, HCPL-623x, HCPL-625x, 5962-88768 and 5962-88769
Data Sheet
Outline Drawings
20-Terminal LCCC Surface Mount, 2 Channels
8.69 (0.342)
9.09 (0.358)
4.95 (0.195)
5.21 (0.205)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
0.64
(0.025)
(20 PLCS)
1.52 (0.060)
2.03 (0.080)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
1.78 (0.070)
2.03 (0.080)
8.69 (0.342)
9.09 (0.358)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.51 (0.020)
Leaded Device Marking
AVAGO Designator
AVAGO P/N
DLA SMD
[1]
DLA SMD
[1]
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
X 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
AVAGO FSCN
[1]
[1] QML PARTS ONLY
Leadless Device Marking
AVAGO Designator
AVAGO P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
X XXXX
XXXXXX
XXX 50434
COMPLIANCE INDICATOR,
[1]
DATE CODE, SUFFIX (IF NEEDED)
DLA SMD
[1]
DLA SMD
[1]
AVAGO FSCN
[1]
[1] QML PARTS ONLY
Broadcom
-5-
FPGA/CPLD
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