Telecom Circuit, 1-Func, QFN-32
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Silicon Laboratories Inc |
| 包装说明 | HVQCCN, |
| Reach Compliance Code | compliant |
| Samacsys Description | RF System on a Chip - SoC Mighty Gecko SoC, 2.4 GHz, 256 kB flash, 32 kB RAM, 19.5 dBm, QFN-32, mesh |
| JESD-30 代码 | S-XQCC-N32 |
| 长度 | 5 mm |
| 功能数量 | 1 |
| 端子数量 | 32 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | HVQCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 0.9 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 电信集成电路类型 | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | QUAD |
| 宽度 | 5 mm |
| Base Number Matches | 1 |
| EFR32MG1B232F256GM32-C0 | EFR32MG1B132F256GM32-C0 | EFR32MG1B132F256GM48-C0 | EFR32MG1V132F256GM32-C0 | EFR32MG1P232F256GM48-C0 | |
|---|---|---|---|---|---|
| 描述 | Telecom Circuit, 1-Func, QFN-32 | Telecom Circuit, 1-Func, QFN-32 | Telecom Circuit, 1-Func, QFN-48 | Telecom Circuit, 1-Func, QFN-32 | Telecom Circuit, 1-Func, QFN-48 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc | Silicon Laboratories Inc |
| 包装说明 | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, | HVQCCN, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| JESD-30 代码 | S-XQCC-N32 | S-XQCC-N32 | S-XQCC-N48 | S-XQCC-N32 | S-XQCC-N48 |
| 长度 | 5 mm | 5 mm | 7 mm | 5 mm | 7 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 32 | 32 | 48 | 32 | 48 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装代码 | HVQCCN | HVQCCN | HVQCCN | HVQCCN | HVQCCN |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| 座面最大高度 | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm | 0.9 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 电信集成电路类型 | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT | TELECOM CIRCUIT |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD |
| 宽度 | 5 mm | 5 mm | 7 mm | 5 mm | 7 mm |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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