SPST, 4 Func, 1 Channel, CMOS, CDIP14
| 参数名称 | 属性值 |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-CDIP-T14 |
| JESD-609代码 | e4 |
| 标称负供电电压 (Vsup) | |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 14 |
| 最大通态电阻 (Ron) | 320 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 最大供电电流 (Isup) | 0.025 mA |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 95 ns |
| 最长接通时间 | 95 ns |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | GOLD |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| Base Number Matches | 1 |
| 5962R9665201VCC | 5962R9665201VXC | CD4066BFMS | CD4066BDMSR | CD4066BDMS | CD4066BKMSR | CD4066BKMS | |
|---|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDIP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 | SPST, 4 Func, 1 Channel, CMOS, CDFP14 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-CDIP-T14 | R-CDFP-F14 | R-GDIP-T14 | R-CDIP-T14 | R-CDIP-T14 | R-CDFP-F14 | R-CDFP-F14 |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
| 最大通态电阻 (Ron) | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω | 320 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | FLATPACK | IN-LINE | IN-LINE | IN-LINE | FLATPACK | FLATPACK |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电流 (Isup) | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA | 0.025 mA |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | YES | NO | NO | NO | YES | YES |
| 最长断开时间 | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
| 最长接通时间 | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns | 95 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | FLAT | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | FLAT | FLAT |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| JESD-609代码 | e4 | e4 | - | e0 | - | e0 | - |
| 端子面层 | GOLD | GOLD | - | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | - |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | 1 | - |
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