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HCTS27DMSR

产品描述HCT SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14
产品类别逻辑    逻辑   
文件大小54KB,共9页
制造商Renesas(瑞萨电子)
官网地址https://www.renesas.com/
下载文档 详细参数 选型对比 全文预览

HCTS27DMSR概述

HCT SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14

HCTS27DMSR规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Renesas(瑞萨电子)
零件包装代码DIP
包装说明SIDE BRAZED, CERAMIC, DIP-14
针数14
Reach Compliance Codenot_compliant
系列HCT
JESD-30 代码R-CDIP-T14
JESD-609代码e0
长度19.43 mm
负载电容(CL)50 pF
逻辑集成电路类型NOR GATE
最大I(ol)0.004 A
功能数量3
输入次数3
端子数量14
最高工作温度125 °C
最低工作温度-55 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码DIP
封装等效代码DIP14,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源5 V
Prop。Delay @ Nom-Sup22 ns
传播延迟(tpd)22 ns
认证状态Not Qualified
施密特触发器NO
筛选级别MIL-PRF-38535 Class V
座面最大高度5.08 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装NO
技术CMOS
温度等级MILITARY
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距0.65 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
总剂量200k Rad(Si) V
宽度7.62 mm
Base Number Matches1

文档预览

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HCTS27MS
September 1995
Radiation Hardened
Triple 3-Input NOR Gate
Pinouts
14 LEAD CERAMIC DUAL-IN-LINE METAL SEAL
PACKAGE (SBDIP) MIL-STD-1835 CDIP2-T14
TOP VIEW
A1 1
B1 2
A2 3
B2 4
C2 5
Y2 6
14 VCC
13 C1
12 Y1
11 C3
10 B3
9 A3
8 Y3
Features
• 3 Micron Radiation Hardened SOS CMOS
• Total Dose 200K RAD (Si)
• SEP Effective LET No Upsets: >100 MEV-cm
2
/mg
• Single Event Upset (SEU) Immunity < 2 x 10 Errors/Bit-Day
(Typ)
• Dose Rate Survivability: >1 x 10
12
RAD (Si)/s
• Dose Rate Upset >10
10
-9
RAD (Si)/s 20ns Pulse
• Latch-Up Free Under Any Conditions
• Military Temperature Range: -55
o
C
to
+125
o
C
GND 7
• Significant Power Reduction Compared to LSTTL ICs
• DC Operating Voltage Range: 4.5V to 5.5V
• LSTTL Input Compatibility
- VIL = 0.8V Max
- VIH = VCC/2 Min
• Input Current Levels Ii
5µA at VOL, VOH
14 LEAD CERAMIC METAL SEAL FLATPACK PACKAGE
(FLATPACK) MIL-STD-1835 CDFP3-F14
TOP VIEW
A1
B1
A2
B2
1
2
3
4
5
6
7
14
13
12
11
10
9
8
VCC
C1
Y1
C3
B3
A3
Y3
Description
The Intersil HCTS27MS is a Radiation Hardened Triple 3-Input
NOR Gate. A Low on all inputs forces the output to a High state.
The HCTS27MS utilizes advanced CMOS/SOS technology to
achieve high-speed operation. This device is a member of
radiation hardened, high-speed, CMOS/SOS Logic Family.
The HCTS27MS is supplied in a 14 lead Ceramic flatpack (K
suffix) or a SBDIP Package (D suffix).
C2
Y2
GND
Functional Diagram
An
Bn
Yn
Ordering Information
PART
NUMBER
HCTS27DMSR
TEMPERATURE
RANGE
-55
o
C to +125
o
C
SCREENING
LEVEL
Intersil Class
S Equivalent
Intersil Class
S Equivalent
PACKAGE
14 Lead SBDIP
An
14 Lead
Ceramic
Flatpack
14 Lead SBDIP
L
L
L
HCTS27D/
Sample
HCTS27K/
Sample
+25
o
C
Sample
L
H
+25
o
C
Sample
14 Lead
Ceramic
Flatpack
Die
H
H
H
Cn
TRUTH TABLE
INPUTS
Bn
L
L
H
H
L
L
H
H
Cn
L
H
L
H
L
H
L
H
OUTPUTS
Yn
H
L
L
L
L
L
L
DB NA
L
HCTS27KMSR
-55
o
C to +125
o
C
HCTS27HMSR
+25
o
C
Die
NOTE: L = Logic Level Low, H = Logic level High
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
http://www.intersil.com or 407-727-9207
|
Copyright
©
Intersil Corporation 1999
Spec Number
File Number
430
518643
3055.1

HCTS27DMSR相似产品对比

HCTS27DMSR HCTS27KMSR HCTS27HMSR
描述 HCT SERIES, TRIPLE 3-INPUT NOR GATE, CDIP14, SIDE BRAZED, CERAMIC, DIP-14 HCT SERIES, TRIPLE 3-INPUT NOR GATE, CDFP14, CERAMIC, DFP-14 HCT SERIES, TRIPLE 3-INPUT NOR GATE, UUC14
厂商名称 Renesas(瑞萨电子) Renesas(瑞萨电子) Renesas(瑞萨电子)
零件包装代码 DIP DFP DIE
包装说明 SIDE BRAZED, CERAMIC, DIP-14 CERAMIC, DFP-14 DIE,
针数 14 14 14
Reach Compliance Code not_compliant not_compliant unknown
系列 HCT HCT HCT
JESD-30 代码 R-CDIP-T14 R-CDFP-F14 R-XUUC-N14
逻辑集成电路类型 NOR GATE NOR GATE NOR GATE
功能数量 3 3 3
输入次数 3 3 3
端子数量 14 14 14
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED UNSPECIFIED
封装代码 DIP DFP DIE
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE FLATPACK UNCASED CHIP
传播延迟(tpd) 22 ns 22 ns 20 ns
认证状态 Not Qualified Not Qualified Not Qualified
筛选级别 MIL-PRF-38535 Class V MIL-PRF-38535 Class V MIL-PRF-38535 Class V
最大供电电压 (Vsup) 5.5 V 5.5 V 5.5 V
最小供电电压 (Vsup) 4.5 V 4.5 V 4.5 V
标称供电电压 (Vsup) 5 V 5 V 5 V
表面贴装 NO YES YES
技术 CMOS CMOS CMOS
端子形式 THROUGH-HOLE FLAT NO LEAD
端子位置 DUAL DUAL UPPER
总剂量 200k Rad(Si) V 200k Rad(Si) V 200k Rad(Si) V
是否Rohs认证 不符合 不符合 -
JESD-609代码 e0 e0 -
长度 19.43 mm 9.525 mm -
负载电容(CL) 50 pF 50 pF -
最大I(ol) 0.004 A 0.004 A -
最高工作温度 125 °C 125 °C -
最低工作温度 -55 °C -55 °C -
封装等效代码 DIP14,.3 FL14,.3 -
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED -
电源 5 V 5 V -
Prop。Delay @ Nom-Sup 22 ns 22 ns -
施密特触发器 NO NO -
座面最大高度 5.08 mm 2.92 mm -
温度等级 MILITARY MILITARY -
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) -
端子节距 0.65 mm 0.5 mm -
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED -
宽度 7.62 mm 6.285 mm -
Base Number Matches 1 1 -

 
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