Product Number: 315-99-109-41-003100
Description:
Interconnect Socket
.100 Grid; Low Profile Socket
Ultra Low Profile
Single Row
Through Hole
Accepts .015-.022" Leads
Plating Code:
99
Shell Plating:
200 " Tin/Lead(93/7) over 100 "
Nickel
Inner Contact Plating:
100 " Tin/Lead(93/7) over 50 "
Nickel
#
Of
Pins
9
Mill-Max
Part
Number
315-99-109-41-003100
RoHS
Compliant
CONTACT:
Contact Used: #12, Standard 4 Finger Contact
Current Rating =
3 Amps
BERYLLIUM COPPER ALLOY
172 (UNS C17200) per
ASTM B 194
Properties of BERYLLIUM COPPER:
Chemical composition: Cu 98.1%, Be 1.9%
Temper as stamped: TD01
Properties after heat treatment (TH01):
Hardness: 36-43 Rockwell C
Mechanical Life: 100 Cycles Min.
Density: .298 lbs/in3
Electrical Conductivity: 22% IACS*
Resistance: 10 miliohms Max
Operating Temperature: -55°C/+125°C
Melting point: 980°C/865°C (liquidus/solidus)
Stress Relaxation†: 96% of stress remains after 1,000 hours @ 100 ºC ; 70% of stress remains after 1,000 hours @ 200
ºC
*International Annealed Copper Standard, i.e. as a % of pure copper.
†Since BeCu loses its spring properties over time at high temperatures; it is rated for continuous use up to 150°C. For
applications up to 300°C, Mill-Max offers many contacts in Beryllium Nickel. Contact Tech Support for more info.
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/24/2008
Page 1 of 2
LOOSE PIN:
Loose Pin Used: 1534
BRASS ALLOY
(UNS C36000) per ASTM B 16
Properties of BRASS ALLOY:
Chemical composition: Cu 61.5%, Zn 35.4%, Pb 3.1%†
Hardness as machined: 80-90 Rockwell B
Density: .307 lbs/in3
Electrical conductivity: 26% IACS*
Melting point: 900°C/885°C (liquidus/solidus)
†(3 to 4% lead is used to permit “free machining” and is permitted by EC Directive 2002/95Annex 6; so all pin materials are
RoHS compliant)
*International Annealed Copper Standard, i.e. as a % of pure copper.
INSULATOR INFORMATION:
PCT
Polyester, (Thermx CG933, black)
High Temperature
Properties of PCT Polyester:
Brand: Thermx
Grade: CG-933
Rated voltage: 100 VRMS/150 VDC
Insulation resistance: 10,000 Megaohms min.
Material Heat Deflection Temp (per ASTM D 648): 529°F (276°C) @ 66 psi
Dielectric strength: 1000 VRMS min. (700 VRMS min. for series 117 Shrink DIP)
Note: Materials above 446°F (230°C) are considered suitable for “eutectic” reflow soldering, above 500°F (260°C) for “lead-
free” reflow soldering.
Mill-Max Mfg. Corp. Datasheet – Last Modified 6/24/2008
Page 2 of 2
PCB设计
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