Hermetically Sealed, Transistor
Output Optocouplers for Analog and
Digital Applications
Technical Data
Agilent 4N55*, 5962-87679, HCPL-553X, HCPL-653X,
HCPL-257K, HCPL-655X, 5962-90854, HCPL-550X
*See matrix for available extensions.
Features
•
Dual Marked with Device Part
Number and DSCC Drawing
Number
•
Manufactured and Tested on a
MIL-PRF-38534 Certified Line
•
QML-38534, Class H and K
•
Five Hermetically Sealed Package
Configurations
•
Performance Guaranteed, Over
-55°C to +125°C
•
High Speed: Typically 400 kBit/s
•
9 MHz Bandwidth
•
Open Collector Output
•
2-18 Volt V
CC
Range
•
1500 Vdc Withstand Test Voltage
•
High Radiation Immunity
•
6N135, 6N136, HCPL-2530/2531,
Function Compatibility
•
Reliability Data
Description
These units are single, dual
and quad channel, hermetically
sealed optocouplers. The
products are capable of
operation and storage over the
full military temperature range
and can be purchased as
either standard product or
with full MIL-PRF-38534 Class
Level H or K testing or from
the appropriate DSCC Drawing.
All devices are manufactured
and tested on a MIL-PRF-
38534 certified line and are
included in the DSCC Qualified
Manufacturers List QML-38534
for Hybrid Microcircuits.
Applications
•
Military and Space
•
High Reliability Systems
•
Vehicle Command, Control, Life
Critical Systems
•
Line Receivers
•
Switching Power Supply
•
Voltage Level Shifting
•
Analog Signal Ground Isolation
(see Figures 7, 8, and 13)
•
Isolated Input Line Receiver
•
Isolated Output Line Driver
•
Logic Ground Isolation
•
Harsh Industrial Environments
•
Isolation for Test Equipment
Systems
The connection of a 0.1
µF
bypass capacitor between V
CC
and GND is recommended.
CAUTION: It is advised that normal static precautions be taken in handling and assembly
of this component to prevent damage and/or degradation which may be induced by ESD.
Each channel contains a
GaAsP light emitting diode
which is optically coupled to
an integrated photon detector.
Separate connections for the
photodiodes and output
transistor collectors improve
the speed up to a hundred
times that of a conventional
phototransistor optocoupler by
reducing the base-collector
capacitance.
These devices are suitable for
wide bandwidth analog
applications, as well as for
interfacing TTL to LSTTL or
CMOS. Current Transfer Ratio
(CTR) is 9% minimum at I
F
=
16 mA. The 18 V V
CC
capability will enable the
designer to interface any TTL
family to CMOS. The
availability of the base lead
allows optimized gain/
bandwidth adjustment in
analog applications. The
shallow depth of the IC
photodiode provides better
radiation immunity than
conventional phototransistor
couplers.
These products are also
available with the transistor
base node not connected to
improve common mode noise
immunity and ESD
susceptibility. In addition,
higher CTR minimums are
available by special request.
Package styles for these parts
are 8 and 16 pin DIP through
hole (case outlines P and E
respectively), 16 pin DIP flat
pack (case outline F), and
leadless ceramic chip carrier
(case outline 2). Devices may
be purchased with a variety of
lead bend and plating options,
see Selection Guide Table for
details. Standard Microcircuit
Drawing (SMD) parts are
available for each package and
lead style.
Because the same functional
die (emitters and detectors)
are used for each channel of
each device listed in this data
sheet, absolute maximum
ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all
parts. Occasional exceptions
exist due to package variations
and limitations and are as
noted. Additionally, the same
package assembly processes
and materials are used in all
devices. These similarities give
justification for the use of data
obtained from one part to
represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Truth Table
(Positive Logic)
Input
On (H)
Off (L)
Output
L
H
Functional Diagram
Multiple Channel Devices
Available
V
CC
V
B
V
O
GND
2
Selection Guide–Package Styles and Lead Configuration Options
16 Pin DIP
Package
Lead Style
Channels
Common Channel Wiring
Agilent Part No. and Options
Commercial
MIL-PRF-38534 Class H
MIL-PRF-38534 Class K
Standard Lead Finish
Solder Dipped*
Butt Joint/Gold Plate
Gull Wing/Soldered*
Class H SMD Part #
Prescript for all below
Either Gold or Soldered
Gold Plate
Solder Dipped*
Butt Joint/Gold Plate
Butt Joint/Soldered*
Gull Wing/Soldered*
Class K SMD Part #
Prescript for all below
Either Gold or Soldered
Gold Plate
Solder Dipped*
Butt Joint/Gold Plate
Butt Joint/Soldered*
Gull Wing/Soldered*
1. JEDEC registered part.
* Solder contains lead
8 Pin DIP
Through Hole
1
None
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
Option 200
Option 100
Option 300
5962-
9085401HPX
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
5962-
9085401KPX
9085401KPC
9085401KPA
9085401KYC
9085401KYA
9085401KXA
8 Pin DIP
Through Hole
2
V
CC
GND
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
Option 200
Option 100
Option 300
5962-
8767902PX
8767902PC
8767902PA
8767902YC
8767902YA
8767902XA
5962-
8767906KPX
8767906KPC
8767906KPA
8767906KYC
8767906KYA
8767906KXA
16 Pin Flat
Pack
4
V
CC
GND
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
20 Pad LCCC
Through Hole
2
None
4N55
(1)
4N55/883B
HCPL-257K
Gold Plate
Option 200
Option 100
Option 300
5962-
8767901EX
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
5962-
8767905KEX
8767905KEC
8767905KEA
8767905KUC
8767905KUA
8767905KTA
Unformed Leads Surface Mount
2
None
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads
5962-
8767904FX
8767904FC
5962-
87679032X
87679032A
5962-
8767908KFX
8767908KFC
5962-
8767907K2X
8767907K2A
3
8 Pin Ceramic DIP Single Channel Schematic
2
+
V
F
CATHODE
-
3
5
I
F
I
CC
I
B
I
O
8
7
6
V
CC
V
B
V
O
ANODE
GND
Note, base is pin 7.
Functional Diagrams
16 Pin DIP
Through Hole
2 Channels
1
V
B1
V
CC1
V
O1
GND
16
8 Pin DIP
Through Hole
1 Channel
8 Pin DIP
Through Hole
2 Channels
16 Pin Flat Pack
Unformed Leads
4 Channels
1
16
20 Pad LCCC
Surface Mount
2 Channels
15 14
V
CC2
19
20
V
B2
V
O2
GND
2
V
O1
GND
1
V
CC1
V
B1
7
8
13
12
1
2
3
15
V
CC
V
B
V
OUT
8
1
V
CC
V
O1
V
O2
8
2
V
CC
V
O1
V
O2
V
O3
V
O4
GND
15
14
2
14
7
6
2
3
7
3
3
4
13
6
4
13
2
3
10
9
4
5
V
B2
V
CC2
GND
V
O2
12
GND
5
4
GND
5
5
12
6
7
11
10
6
7
11
10
8
9
8
9
Note: 8 pin DIP and flat pack devices have common V
CC
and ground. 16 pin DIP and LCCC (leadless ceramic chip carrier) packages have isolated
channels with separate V
CC
and ground connections.
Outline Drawings
16 Pin DIP Through Hole, 2 Channels
20.06 (0.790)
20.83 (0.820)
0.89 (0.035)
1.65 (0.065)
4.45 (0.175)
MAX.
8.13 (0.320)
MAX.
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
0.20 (0.008)
0.33 (0.013)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
4
Leaded Device Marking
Agilent DESIGNATOR
Agilent P/N
DSCC SMD*
DSCC SMD*
PIN ONE/
ESD IDENT
A QYYWWZ
XXXXXX
XXXXXXX
XXX XXX
50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
COUNTRY OF MFR.
Agilent CAGE CODE*
Leadless Device Marking
Agilent DESIGNATOR
Agilent P/N
PIN ONE/
ESD IDENT
COUNTRY OF MFR.
A QYYWWZ
XXXXXX
XXXX
XXXXXX
XXX 50434
* QUALIFIED PARTS ONLY
COMPLIANCE INDICATOR,*
DATE CODE, SUFFIX (IF NEEDED)
DSCC SMD*
DSCC SMD*
Agilent CAGE CODE*
Outline Drawings
16 Pin Flat Pack, 4 Channels
7.24 (0.285)
6.99 (0.275)
2.29 (0.090)
MAX.
1.27 (0.050)
REF.
11.13 (0.438)
10.72 (0.422)
0.46 (0.018)
0.36 (0.014)
8.13 (0.320)
MAX.
2.85 (0.112)
MAX.
0.88 (0.0345)
MIN.
0.89 (0.035)
0.69 (0.027)
5.23
(0.206)
MAX.
9.02 (0.355)
8.76 (0.345)
0.31 (0.012)
0.23 (0.009)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
20 Terminal LCCC Surface Mount, 2 Channels
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
1.78 (0.070)
2.03 (0.080)
1.02 (0.040) (3 PLCS)
1.14 (0.045)
1.40 (0.055)
8.70 (0.342)
9.10 (0.358)
4.95 (0.195)
5.21 (0.205)
8 Pin DIP Through Hole, 1 and 2 Channel
9.40 (0.370)
9.91 (0.390)
0.76 (0.030)
1.27 (0.050)
4.32 (0.170)
MAX.
8.13 (0.320)
MAX.
7.16 (0.282)
7.57 (0.298)
TERMINAL 1 IDENTIFIER
2.16 (0.085)
METALIZED
CASTILLATIONS (20 PLCS)
0.64
(0.025)
(20 PLCS)
0.51 (0.020)
0.51 (0.020)
MIN.
3.81 (0.150)
MIN.
1.78 (0.070)
2.03 (0.080)
0.20 (0.008)
0.33 (0.013)
1.52 (0.060)
2.03 (0.080)
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MAX.
7.36 (0.290)
7.87 (0.310)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
SOLDER THICKNESS 0.127 (0.005) MAX.
5
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
