on-resistance of 4.5 and a drain-to-source voltage
of 400V. As with all MOS devices, the FET structure
prevents thermal runaway and thermally induced
secondary breakdown.
Features
•
400V Drain-to-Source Voltage
•
Depletion Mode Device Offers Low R
DS(on)
at Cold Temperatures
•
Low On-Resistance: 4.5 (Typical) @ 25°C
•
Low V
GS(off)
Voltage
•
High Input Impedance
•
Low Input and Output Leakage
•
Small Package Size SOT-89 and SOT-223
•
PC Card (PCMCIA) Compatible
•
PCB Space and Cost Savings
Ordering Information
Part Number
CPC3909CTR
CPC3909ZTR
Description
SOT-89: Tape and Reel (1000/Reel)
SOT-223: Tape and Reel (1000/Reel)
Applications
•
•
•
•
•
•
•
•
LED Drive Circuits
Telecommunications
Normally On Switches
Ignition Modules
Converters
Security
Power Supplies
Regulators
Circuit Symbol
D
G
Package Pinout:
D
4
2
D
1
S
3
S
G
Pin Number
Name
1
GATE
2
DRAIN
3
SOURCE
4
DRAIN
DS-CPC3909-R00C
PRELIMINARY
1
I
NTEGRATED
C
IRCUITS
D
IVISION
Absolute Maximum Ratings @ 25ºC
Parameter
Drain-to-Source Voltage (V
(BR)DSX
)
Gate-to-Source Voltage (V
GS
)
Total Package Dissipation
1
SOT-89
SOT-223
Operational Temperature
Storage Temperature
1
PRELIMINARY
CPC3909
Ratings
400
15
1.1
2.5
-40 to +110
-40 to +125
Units
V
V
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to the
device. Functional operation of the device at conditions beyond
those indicated in the operational sections of this data sheet is
not implied.
W
o
C
o
C
Mounted on 1"x1" FR4 board.
Electrical Characteristics @25
o
C (Unless Otherwise Specified)
Parameter
Gate-to-Source Off Voltage
Drain-to-Source Leakage Current
Drain Current
On-Resistance
Gate Leakage Current
Gate Capacitance
Symbol
V
GS(off)
I
DS(off)
I
D
R
DS(on)
I
GSS
C
ISS
Conditions
I
D
=2A, V
DS
=10V, V
DS
=100V
V
GS
= -5V, V
DS
=210V
V
GS
= -5V, V
DS
=400V
V
GS
= 0V, V
DS
=5V
V
GS
= 0V, I
DS
=300mA
V
GS
=15V
V
DS
= V
GS
=0V
Min
-0.9
-
-
300
-
-
-
Typ
-
-
-
-
4.5
-
-
Max
-3.1
20
1
-
9
100
TBD
Units
V
nA
A
mA
nA
pF
Thermal Resistance
Package
SOT-89
Parameter
Junction to Case
Junction to Ambient
SOT-223
Junction to Case
Junction to Ambient
Symbol
R
JC
R
JA
R
JC
R
JA
Conditions
-
Min
-
Typ
-
Max
50
90
14
55
ºC/W
Units
-
-
-
2
PRELIMINARY
R00C
I
NTEGRATED
C
IRCUITS
D
IVISION
Manufacturing Information
Moisture Sensitivity
PRELIMINARY
CPC3909
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard,
IPC/JEDEC J-STD-020,
in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a
Moisture Sensitivity Level (MSL) rating
as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard
IPC/JEDEC J-STD-033.
Device
CPC3909C / CPC3909Z
Moisture Sensitivity Level (MSL) Rating
MSL 1
ESD Sensitivity
This product is
ESD Sensitive,
and should be handled according to the industry standard
JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of
J-STD-020
must be observed.
Device
CPC3909C / CPC3909Z
Maximum Temperature x Time
260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable, and the use of a short drying bake may be necessary. Chlorine-based or
Fluorine-based solvents or fluxes should not be used. Cleaning methods that employ ultrasonic energy should not be
used.
R00C
PRELIMINARY
3
I
NTEGRATED
C
IRCUITS
D
IVISION
PRELIMINARY
CPC3909
MECHANICAL DIMENSIONS
CPC3909Z
2.90 / 3.10
(0.114 / 0.122)
0.229 / 0.330
(0.009 / 0.013)
PCB Land Pattern
1.90
(0.075)
3.30 / 3.71
(0.130 / 0.146)
6.705 / 7.290
(0.264 / 0.287)
1.499 / 1.981
(0.059 / 0.078)
6.10
(0.24)
3.20
(0.126)
Pin 1
0.610 / 0.787
(0.024 / 0.031)
6.30 / 6.71
(0.248 / 0.264)
0.020 / 0.102
(0.0008 / 0.004)
0.864 / 1.067
(0.034 / 0.042)
2.286
(0.090)
1.549 / 1.803
(0.061 / 0.071)
4.597
(0.181)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
0.914 MIN
(0.036 MIN)
1.90
(0.075)
2.286
(0.090)
0.90
(0.035)
CPC3909C
1.626 / 1.829
(0.064 / 0.072)
R 0.254
(R 0.010)
1.397 / 1.600
(0.055 / 0.063)
PCB Land Pattern
1.90
(0.075)
3.937 / 4.242
(0.155 / 0.167)
Pin 1
0.889 / 1.194
(0.035 / 0.047)
0.356 / 0.483
(0.014 / 0.019)
0.432 / 0.559
(0.017 / 0.022)
0.864 / 1.016
(0.034 / 0.040)
2.286 / 2.591
(0.090 / 0.102)
1.40
(0.055)
0.356 / 0.432
(0.014 / 0.017)
0.432 / 0.508
(0.017 / 0.020)
45º
2.45
(0.096)
50º
1.90
(0.074)
5.00
(0.197)
4.394 / 4.597
(0.173 / 0.181)
1.118 / 1.270
(0.044 / 0.050)
1.422 / 1.575
(0.056 / 0.062)
2.921 / 3.073
(0.115 / 0.121)
0.60
(0.024)
TYP 3
50º
2.845 / 2.997
(0.112 / 0.118)
Dimensions
mm MIN / mm MAX
(inches MIN / inches MAX)
4
PRELIMINARY
R00C
I
NTEGRATED
C
IRCUITS
D
IVISION
PRELIMINARY
CPC3909
MECHANICAL DIMENSIONS
CPC3909ZTR Tape & Reel
177.8 Dia
(7.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
5.50 ± 0.05
(0.217 ± 0.002)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.08 ± 0.2
(0.476 ± 0.008)
B
0
=7.42 ± 0.1
(0.292 ± 0.004)
K
0
=1.88 ± 0.1
(0.074 ± 0.004)
Embossed
Carrier
A
0
=6.83 ± 0.1
(0.269 ± 0.004)
P=8.03 ± 0.1
(0.316 ± 0.004)
Dimensions
mm
(inches)
Embossment
CPC3909CTR Tape & Reel
177.8 Dia
(7.00 Dia)
Top Cover
Tape Thickness
0.102 Max
(0.004 Max)
5.50 ± 0.05
(0.217 ± 0.002)
2.00 ± 0.05
(0.079 ± 0.002)
4.00 ± 0.1
(0.157 ± 0.004)
1.75 ± 0.1
(0.069 ± 0.004)
W=12.00 ± 0.3
(0.472 ± 0.012)
B
0
=4.60 ± 0.1
(0.181 ± 0.004)
K
0
=1.80 ± 0.1
(0.071 ± 0.004)
Embossed
Carrier
A
0
=4.80 ± 0.1
(0.189 ± 0.004)
P=8.00 ± 0.1
(0.315 ± 0.004)
Dimensions
mm
(inches)
Embossment
For additional information please visit our website at: www.ixysic.com
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to
its products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
便携式数字数据采集系统（PDDAS）使用了LabVIEW实时模块和PXI，以控制风洞测试和采集记录来自128个不同通道的空气压力数据 "通过LabVIEW实时模块，可以在各种操作情况下获得采集空气压力数据及向风洞提供反馈控制信号所需的确定性响应时间。" – Dave Scheibenhoffer, G Systems 挑战: 用一个可采集、分析和存储来自下一代喷气式战斗机引擎设计的动...[详细]
DSP 与 ARM 处理器
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