CHIP NTC THERMISTOR
■
FEATURES
·Miniature size ,No lead ,ideal for high density SMT installation
·Low resistance and high B-value series
·Superior solderability and resistance to soldering heat
·Ideal for wave or re-flow soldering
·Glass coating , high precision , small resistance drift
·Environment friendliness.
■
APPLICATIONS
communications equipment
·Temperature sensing in rechargeable batteries
·Temperature sensor for CPU
·Temperature compensation in a variety of other circuits, such as advanced stereo、wireless
earphone and etc.
■
CMF
①
①
②
PART
X
NUMBER
XXX
②
③
X
XXXX
④
⑤
X
X
⑥
X
⑦
X
⑧
⑨
·Temperature compensation in IC、LCD、transistor、crystal oscillator in devices such as mobile
Product Code：Chip NTC Thermistor
Size Code
Code
Size（Inches）
D
0402
Unit: Ω
A
0603
B
0805
C
1206
②
Rated zero-power resistance(R
25
)
The first two are significant figure of resistance and the third one expresses number
of following zeros.
④
Tolerance of R
25
(%)
Code
Tolerance of R
25
⑤
⑥
E
±0.5
F
±1.0
G
±2.0
H
±3.0
J
±5.0
K
±10.0
X
Special tolerance
B value constant (25/50℃)
Tolerance of B value(%)
Code
Tolerance of B value
E
±0.5
F
±1.0
G
±2.0
H
±3.0
J
±5.0
X
Specific
tolerance
H
-18/25
M
-20/25
N
5/25
⑦
B value Temperature Code
Code
T
1
/T
2
A
25/50
B
25/ 85
C
0/25
D
0/50
E
0/100
F
0/80
G
25/100
⑧
Termination Code: N—Nickel Barrier
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1
CHIP NTC THERMISTOR
⑨
Packaging style Code: T—Tape & Reel、B—Bulk
■
DIMENSIONS
M
T
W
L
unit：
Size
0402
（1005）
0603
（1608）
0805
（2012）
1206
（3216）
L
Length
.04±.006
(1.0±0.15)
.063±.006
(1.6±0.15)
.08±.008
(2.0±0.20)
.126±.008
(3.2±0.20)
W
Width
.02±.004
(0. 5±0.10)
.031±.006
(0.8±0.15)
.05±.008
(1.25±0.20)
.063±.008
(1.6±0.20)
inches(mm)
T
Thickness
.024 max
(0.60 max)
.037 max
(0.95 max)
.05 max
(1.25 max)
.063 max
(1.60 max)
M
Termination Width
.004 min
(0.10 min)
.004 min
(0.10 min)
.006 min
(0.15 min)
.008 min
(0.20 min)
■
·
PRODUCT
0402
SERIES
SERIES
Resistance at 25℃
Part No.
（KΩ）
CMFD102□3000○
CMFD222□3200○
CMFD332□3200○
CMFD472□3400○
CMFD472□4000○
CMFD682□3400○
CMFD103□3400○
CMFD103□3650○
CMFD103□3900○
1.0
2.2
3.3
4.7
4.7
6.8
10
10
10
3000
3200
3200
3400
4000
3400
3400
3650
3900
B-Constant 25/50℃（K）
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CHIP NTC THERMISTOR
CMFD153□3900○
CMFD223□3900○
CMFD223□4050○
CMFD333□3950○
CMFD333□4150○
CMFD473□4050○
CMFD473□4150○
CMFD683□4100○
CMFD683□4200○
CMFD104□4200○
CMFD224□4300○
·
0603、0805、1206
SERIES
15
22
22
33
33
47
47
68
68
100
220
3900
3900
4050
3950
4150
4050
4150
4100
4200
4200
4300
Resistance at 25℃
Part No.
（KΩ）
CMF△221□3650○
CMF△331□3650○
CMF△471□3650○
CMF△681□3650○
CMF△102□3650○
CMF△222□3650○
CMF△222□4050○
CMF△332□3650○
CMF△332□4050○
CMF△472□3650○
CMF△472□4050○
CMF△682□3650○
CMF△682□4050○
CMF△103□3500○
CMF△103□3650○
0.22
0.33
0.47
0.68
1.0
2.2
2.2
3.3
3.3
4.7
4.7
6.8
6.8
10
10
3650
3650
3650
3650
3650
3650
4050
3650
4050
3650
4050
3650
4050
3500
3650
B-Constant 25/50℃（K）
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CHIP NTC THERMISTOR
CMF△103□3900○
CMF△153□3900○
CMF△223□3950○
CMF△223□4050○
CMF△333□4000○
CMF△333□4150○
CMF△473□4050○
CMF△473□4150○
CMF△683□4100○
CMF△683□4240○
CMF△104□4300○
CMF△224□4450○
CMF△334□4500○
CMF△105□4500○
CMF△225□4500○
CMF△335□4600○
CMF△475□4650○
10
15
22
22
33
33
47
47
68
68
100
220
330
1000
2200
3300
4700
3900
3900
3950
4050
4000
4150
4050
4150
4100
4240
4300
4450
4500
4500
4500
4600
4650
Notice
·Size Code(D：0402； △ denote A：0603, B：0805, C：1206)
·□：Resistance tolerance（F：±1%,G：±2%, H：±3%,J：±5%,K：±10%）
·○: Tolerance of B-Constant (F：±1%,G：±2%, H：±3%,J：±5%)
·Operating Temperature Range： -40~+125
·Max rated Power：0402 series 100mw,0603 series300mw,0805、1206 series 350mw
·Dissipation factor(in still air 25℃)：0402 series 1mw/℃, 0603 series 3mw/℃, 0805、1206 series
3.5mw/℃
·Thermal time constant(in still air) ：≤10sec
·Products can be offered not including Pb and other harmful substances
·The above-mentioned products can be made into the radial and axial resin coating specification
·Special Products are available
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CHIP NTC THERMISTOR
■
NO.
1
2
3
RELIABILITY
TEST
AND
TEST
METHOD
CRITERIA
TEST
CONDITION
ITEM
HIGH TEMPERATURE TEST
LOW TEMPERATURE TEST
HUMIDITY TEST
WITHOUT LOADING，125±3℃ IN AIR FOR 1000
+48/-0 HOURS
WITHOUT LOADING，-40±3℃ IN AIR FOR 1000
+48/-0 HOURS
WITHOUT LOADING，
60±2℃ 90~95%RH IN AIR FOR
1000 +48/-0 HOURS
5 CYCLES OF FOLLOWING SEQUENCE WITHOUT
LOADING.
·R25 CHANGE SHALL BE
STEP
TEMP(℃)
TIME(min)
LESS THAN±3%
1
-40 +0/-3
30
·B-CONSTANT (B25/50)
2
ROOM TEMP.
10~15
CHANGE SHALL BE LESS THAN
3
+125 +0/-3
30
±2%
4
ROOM TEMP.
10~15
·NO VISIBLE DAMAGE
85±2℃ IN AIR，WITH MAX. OPERATING CURRENT
FOR 1000 +48/-0 HRS..
FREQUENCY:10~55~10Hz
AMPLITUDE:1.5mm
VIBRATED FOR A PERIOD OF 2HRS. IN XYZ THERR
DIRECTIONS EACH OTHER ,TOTBL 6HRS..
·ENVIRONMENT FRIENDLINESS
SOLDERING TEMP.:285±5℃
IMMERSION TIME: 10±0.5SEC.
PRE. TEMP.: 150±5℃
PRE. TIME.: 60SEC.
·OTHER PRODUCT
SOLDERING TEMP.:260±5℃
IMMERSION TIME: 10±0.5SEC.
PRE. TEMP.: 150±5℃
PRE. TIME.: 3min.
·ENVIRONMENT FRIENDLINESS
SOLDERING TEMP.:255±5℃
IMMERSION TIME: 5±0.5SEC.
PRE. TEMP.: 120±5℃
PRE. TIME.: 60SEC
·OTHER PRODUCT
SOLDERING TEMP.:235±5℃
IMMERSION TIME: 5±0.5SEC.
PRE. TEMP.: 120±5℃
PRE. TIME.: 60SEC
SOLDER NTC THERMISTOR ON THE GLASS EPOXY PCB,
AND APPLY 5N OF FORCE
4
HEAT CYCLE TEST
5
HIGH TEMPERATURE LOAD
TEST
6
VIBRATION
7
RESISTANCE
SOLDERING HEAT
MINIMUM 75% OF THE WHOLE
TO ELECTRODE SURFBCE SHBLL
BE COVERED WITH
SOLDER
8
SOLDERABILITY
MINIMUM 95% OF THE WHOLE
ELECTRODE SURFBCE SHBLL
BE COVERED WITH
SOLDER
9
ADHESIVE STRENGTH OF
ELECTRODE
NO PEELING OF THE
ELECTRODES
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Microchip MCU
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