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Datasheet> 器件分类 > 存储> 存储> 70T3799MS133BBGI8

70T3799MS133BBGI8: 产品描述Dual-Port SRAM, 128KX72, 15ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324; 产品类别存储存储; 文件大小207KB，共23页; 制造商IDT (Integrated Device Technology)

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70T3799MS133BBGI8概述

Dual-Port SRAM, 128KX72, 15ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324

70T3799MS133BBGI8规格参数

参数名称	属性值
包装说明	BGA,
Reach Compliance Code	compliant
最长访问时间	15 ns
其他特性	PIPELINED OR FLOW-THROUGH ARCHITECTURE
JESD-30 代码	S-PBGA-B324
JESD-609代码	e1
内存密度	9437184 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	72
功能数量	1
端子数量	324
字数	131072 words
字数代码	128000
工作模式	SYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-40 °C
组织	128KX72
封装主体材料	PLASTIC/EPOXY
封装代码	BGA
封装形状	SQUARE
封装形式	GRID ARRAY
并行/串行	PARALLEL
最大供电电压 (Vsup)	2.6 V
最小供电电压 (Vsup)	2.4 V
标称供电电压 (Vsup)	2.5 V
表面贴装	YES
技术	CMOS
温度等级	INDUSTRIAL
端子面层	TIN SILVER COPPER
端子形式	BALL
端子位置	BOTTOM
Base Number Matches	1

70T3799MS133BBGI8相似产品对比

	70T3799MS133BBGI8	70T3799MS133BBG8	70T3719MS166BBG8	70T3719MS133BBG8	70T3799MS166BBG8
描述	Dual-Port SRAM, 128KX72, 15ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324	Dual-Port SRAM, 128KX72, 15ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324	Dual-Port SRAM, 256KX72, 12ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324	Dual-Port SRAM, 256KX72, 15ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324	Dual-Port SRAM, 128KX72, 12ns, CMOS, PBGA324, 19 X 19 MM, 1.40 MM HEIGHT, 1.76 MM PITCH, GREEN, BGA-324
包装说明	BGA,	BGA,	BGA,	BGA,	BGA,
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
最长访问时间	15 ns	15 ns	12 ns	15 ns	12 ns
其他特性	PIPELINED OR FLOW-THROUGH ARCHITECTURE	PIPELINED OR FLOW-THROUGH ARCHITECTURE	PIPELINED OR FLOW-THROUGH ARCHITECTURE	PIPELINED OR FLOW-THROUGH ARCHITECTURE	PIPELINED OR FLOW-THROUGH ARCHITECTURE
JESD-30 代码	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324	S-PBGA-B324
JESD-609代码	e1	e1	e1	e1	e1
内存密度	9437184 bit	9437184 bit	18874368 bit	18874368 bit	9437184 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	MULTI-PORT SRAM	MULTI-PORT SRAM
内存宽度	72	72	72	72	72
功能数量	1	1	1	1	1
端子数量	324	324	324	324	324
字数	131072 words	131072 words	262144 words	262144 words	131072 words
字数代码	128000	128000	256000	256000	128000
工作模式	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
最高工作温度	85 °C	70 °C	70 °C	70 °C	70 °C
组织	128KX72	128KX72	256KX72	256KX72	128KX72
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	BGA	BGA	BGA	BGA	BGA
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
最大供电电压 (Vsup)	2.6 V	2.6 V	2.6 V	2.6 V	2.6 V
最小供电电压 (Vsup)	2.4 V	2.4 V	2.4 V	2.4 V	2.4 V
标称供电电压 (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
表面贴装	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	INDUSTRIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子面层	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
端子形式	BALL	BALL	BALL	BALL	BALL
端子位置	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Base Number Matches	1	1	1	-	-

70T3799MS133BBGI8

70T3799MS133BBGI8概述

70T3799MS133BBGI8规格参数

70T3799MS133BBGI8相似产品对比

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