REVISIONS
LTR
A
DESCRIPTION
Make changes to t
T1
, T
DP
, V
PAUX
, t
T2
, T
DA
tests and switch footnotes 2 and 3
as specified under table I. - ro
DATE (YR-MO-DA)
00-08-21
APPROVED
R. MONNIN
B
Make changes to SEP as specified under 1.5 and I
CCS
, t
T1
, t
T2
tests as
specified in table I. – ro
00-09-20
R. MONNIN
C
Make correction to PWR pin description as specified in figure 1. - ro
01-12-14
R. MONNIN
D
Make changes to UV- in table I, added footnote to 1.5 and table I. - gt
03-06-19
R. MONNIN
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
D
15
D
16
D
17
D
18
REV
SHEET
PREPARED BY
RICK OFFICER
D
19
D
20
D
21
D
1
D
22
D
2
D
3
D
4
D
5
D
6
D
7
D
8
D
9
D
10
D
11
D
12
D
13
D
14
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
CHECKED BY
RAJESH PITHADIA
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216
http://www.dscc.dla.mil
APPROVED BY
RAYMOND MONNIN
DRAWING APPROVAL DATE
00-07-26
MICROCIRCUIT, DIGITAL-LINEAR, RADIATION
HARDENED, COMPLEMENTARY SWITCH FET
DRIVER, MONOLITHIC SILICON
AMSC N/A
REVISION LEVEL
D
SIZE
A
SHEET
CAGE CODE
67268
1 OF
22
5962-00521
DSCC FORM 2233
APR 97
DISTRIBUTION STATEMENT A. Approved for public release; distribution is unlimited.
5962-E446-03
1. SCOPE
1.1 Scope. This drawing documents three product assurance class levels consisting of high reliability (device classes Q and
M), space application (device class V) and for appropriate satellite and similar applications (device class T). A choice of case
outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of
Radiation Hardness Assurance (RHA) levels are reflected in the PIN. For device class T, the user is encouraged to review the
manufacturer’s Quality Management (QM) plan as part of their evaluation of these parts and their acceptability in the intended
application.
1.2 PIN. The PIN is as shown in the following example:
5962
Federal
stock class
designator
\
F
RHA
designator
(see 1.2.1)
\/
Drawing number
1.2.1 RHA designator. Device classes Q, T and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and
are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A
specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
IS-1715ARH
Circuit function
Radiation hardened, complementary switch
field effect transistor (FET) driver
00521
01
Device
type
(see 1.2.2)
/
V
Device
class
designator
(see 1.2.3)
X
Case
outline
(see 1.2.4)
C
Lead
finish
(see 1.2.5)
1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as
follows:
Device class
M
Device requirements documentation
Vendor self-certification to the requirements for MIL-STD-883 compliant,
non-JAN class level B microcircuits in accordance with MIL-PRF-38535,
appendix A
Certification and qualification to MIL-PRF-38535
Certification and qualification to MIL-PRF-38535 with performance as specified
in the device manufacturers approved quality management plan.
Q, V
T
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
X
Descriptive designator
CDFP4-F16
Terminals
16
Package style
Flat pack
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q, T and V or MIL-PRF-38535,
appendix A for device class M.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-00521
SHEET
D
2
1.3 Absolute maximum ratings. 1/
Supply voltage range (V
CC
) .............................................................. 10 V dc to 20 V dc
DC input voltage range (V
IN
) ............................................................ 0 V to V
CC
Junction temperature (T
J
) ................................................................. +175°C
Storage temperature range .............................................................. -65°C to +150°C
Lead temperature (soldering, 10 seconds) ....................................... +265°C
Thermal resistance, junction-to-case (θ
JC
) ....................................... 18°C/W
Thermal resistance, junction-to-ambient (θ
JA
) .................................. 90°C/W
1.4 Recommended operating conditions.
Supply voltage range (V
CC
) .............................................................. 10 V dc to 18 V dc
Ambient operating temperature range (T
A
) ...................................... -55°C to +125°C
1.5 Radiation features
SEP effective let number upsets ....................................................... > 90 MeV/(cm /mg)
Maximum total dose available (dose rate = 50 – 300 rads(Si) / s): 2/
5
Device classes M, Q, or V ............................................................. 3 x 10 Rads
Device class T ............................................................................... 1 x 10 Rads
Dose rate latch-up ............................................................................ None 3/
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a
part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those listed in
the issue of the Department of Defense Index of Specifications and Standards (DoDISS) and supplement thereto, cited in the
solicitation.
SPECIFICATION
DEPARTMENT OF DEFENSE
MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.
STANDARDS
DEPARTMENT OF DEFENSE
MIL-STD-883 -
MIL-STD-1835 -
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
5
2
_____
1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects.
Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in
MIL-STD-883, method 1019, condition A.
3/ Guaranteed by design or process but not tested.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-00521
SHEET
D
3
HANDBOOKS
DEPARTMENT OF DEFENSE
MIL-HDBK-103 -
MIL-HDBK-780 -
List of Standard Microcircuit Drawings.
Standard Microcircuit Drawings.
(Unless otherwise indicated, copies of the specification, standards, and handbooks are available from the Standardization
Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements for device classes Q, T and V shall be in accordance with
MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The
modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for
device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified
herein.
3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
in MIL-PRF-38535 and herein for device classes Q, T and V or MIL-PRF-38535, appendix A and herein for device class M.
3.2.1 Case outline. The case outline shall be in accordance with 1.2.4 herein.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.
3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2.
3.3 Electrical performance characteristics and post irradiation parameter limits. Unless otherwise specified herein, the
electrical performance characteristics and post irradiation parameter limits are as specified in table I and shall apply over the
full ambient operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical
tests for each subgroup are defined in table I.
3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be
marked as listed in MIL-HDBK-103. For packages where marking of the entire SMD PIN number is not feasible due to space
limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the
RHA designator shall still be marked. Marking for device classes Q, T and V shall be in accordance with MIL-PRF-38535.
Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A.
3.5.1 Certification/compliance mark. The certification mark for device classes Q, T and V shall be a "QML" or "Q" as
required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535,
appendix A.
3.6 Certificate of compliance. For device classes Q, T and V, a certificate of compliance shall be required from a
QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a
certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-
HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of
supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q, T and V, the requirements of
MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-00521
SHEET
D
4
TABLE I. Electrical performance characteristics.
Conditions 1/
-55°C
≤
T
A
≤+125°C
V
CC
= 10 V to 18 V
ENBL
≥
3 V
unless otherwise specified
OVERALL section
Operating voltage range
V
CC
M,D,P,L,R,F 2/
Input current, nominal
I
CC
M,D,P,L,R,F 2/
Input current, sleep mode
I
CCS
ENBLE = 0.8 V
M,D,P,L,R,F 2/
Under voltage, rising
threshold
UV+
M,D,P,L,R,F 2/
Under voltage, falling
threshold
UV-
M,D,P,L,R,F 2/
Under voltage delta
UVD
M,D,P,L,R,F 2/
Power driver (PWR) section
Pre turn-on PWR output,
low
V
PPWR
V
CC
= 0 V, ENBL
≤
0.8 V,
I
OUT
= 10 mA
M,D,P,L,R,F 2/
PWR pin output low,
saturation
V
PWR
INPUT = 0.8 V,
I
OUT
= 40 mA
M,D,P,L,R,F 2/
INPUT = 0.8 V,
I
OUT
= 100 mA
M,D,P,L,R,F 2/
1
1.5
1
1,2,3
1.0
1.5
1
1,2,3
01
2.0
1.0
V
1,2,3
01
2.0
V
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
1,2,3
1
01
01
01
01
01
01
10
10
1.0
1.0
300
300
8.5
8.5
7.7
7.7
0
0
18
18
6.0
6.0
900
900
9.5
9.5
8.8
8.8
2.0
2.0
V
V
V
µA
mA
V
Test
Symbol
Group A
subgroups
Device
type
Min
Limits
Unit
Max
See footnotes at end of table.
STANDARD
MICROCIRCUIT DRAWING
DEFENSE SUPPLY CENTER COLUMBUS
COLUMBUS, OHIO 43216-5000
DSCC FORM 2234
APR 97
SIZE
A
REVISION LEVEL
5962-00521
SHEET
D
5
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