Standard SRAM, 4KX4, 20ns, CMOS, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 最长访问时间 | 20 ns |
| JESD-30 代码 | S-CQCC-N28 |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | STANDARD SRAM |
| 内存宽度 | 4 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 4KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-STD-883 |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子位置 | QUAD |
| Base Number Matches | 1 |
| 5962-89790023X | 5962-8979002KA | 5962-8979002LX | 5962-8979002KX | |
|---|---|---|---|---|
| 描述 | Standard SRAM, 4KX4, 20ns, CMOS, CQCC28, CERAMIC, LCC-28 | Standard SRAM, 4KX4, 20ns, CMOS, CDFP24 | Standard SRAM, 4KX4, 20ns, CMOS, CDIP24, CERAMIC, DIP-24 | Standard SRAM, 4KX4, 20ns, CMOS, CDFP24, CERAMIC, FP-24 |
| 包装说明 | QCCN, | DFP, | DIP, | DFP, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C |
| 最长访问时间 | 20 ns | 20 ns | 20 ns | 20 ns |
| JESD-30 代码 | S-CQCC-N28 | R-GDFP-F24 | R-GDIP-T24 | R-GDFP-F24 |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
| 内存宽度 | 4 | 4 | 4 | 4 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 24 | 24 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C |
| 组织 | 4KX4 | 4KX4 | 4KX4 | 4KX4 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DFP | DIP | DFP |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | FLATPACK | IN-LINE | FLATPACK |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | FLAT | THROUGH-HOLE | FLAT |
| 端子位置 | QUAD | DUAL | DUAL | DUAL |
| 零件包装代码 | QLCC | - | DIP | DFP |
| 针数 | 28 | - | 24 | 24 |
| 筛选级别 | MIL-STD-883 | - | MIL-STD-883 | MIL-STD-883 |
| Base Number Matches | 1 | 1 | 1 | - |
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