Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125
| 参数名称 | 属性值 |
| Brand Name | Texas Instruments |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP14,.3 |
| 针数 | 14 |
| Reach Compliance Code | not_compliant |
| 控制类型 | ENABLE HIGH |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-GDIP-T14 |
| 长度 | 19.56 mm |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.008 A |
| 位数 | 1 |
| 功能数量 | 4 |
| 端口数量 | 2 |
| 端子数量 | 14 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP |
| 封装等效代码 | DIP14,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 2/5.5 V |
| Prop。Delay @ Nom-Sup | 8.5 ns |
| 传播延迟（tpd） | 13 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | MIL-PRF-38535 Class Q |
| 座面最大高度 | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| Base Number Matches | 1 |
| 5962-9686201QCA | SNJ54AHC126J | SN74AHC126PWLE | SN54AHC126W | SN54AHC126FKR | SN54AHC126WR | SN54AHC126FK | SN74AHC126DGV | SN74AHC126DBLE | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-CDIP -55 to 125 | Quadruple Bus Buffer Gates With 3-State Outputs 14-TSSOP -40 to 85 | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, DFP-14 | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, CC-20 | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CDFP14, CERAMIC, FP-14 | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | AHC SERIES, QUAD 1-BIT DRIVER, TRUE OUTPUT, PDSO14, TVSOP-14 | Quadruple Bus Buffer Gates With 3-State Outputs 14-SSOP -40 to 85 |
| 零件包装代码 | DIP | DIP | TSSOP | DFP | QFN | DFP | QLCC | SOIC | SSOP |
| 包装说明 | DIP, DIP14,.3 | DIP, DIP14,.3 | TSSOP, TSSOP14,.25 | DFP, FL14,.25 | QCCN, | DFP, | QCCN, LCC20,.35SQ | TSSOP, TSSOP14,.25,16 | SSOP, SSOP14,.3 |
| 针数 | 14 | 14 | 14 | 14 | 20 | 14 | 20 | 14 | 14 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | unknown | unknown | not_compliant | unknown | not_compliant |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | - | 不符合 |
| 控制类型 | ENABLE HIGH | ENABLE HIGH | ENABLE HIGH | - | - | - | ENABLE HIGH | - | ENABLE HIGH |
| 系列 | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | - | AHC | AHC | AHC | AHC | AHC/VHC/H/U/V |
| JESD-30 代码 | R-GDIP-T14 | R-GDIP-T14 | R-PDSO-G14 | - | S-CQCC-N20 | R-GDFP-F14 | S-CQCC-N20 | R-PDSO-G14 | R-PDSO-G14 |
| 长度 | 19.56 mm | 19.56 mm | 5 mm | - | 8.89 mm | 9.21 mm | 8.89 mm | 4.4 mm | 6.2 mm |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | - | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.008 A | 0.008 A | 0.008 A | - | - | - | 0.008 A | - | 0.008 A |
| 位数 | 1 | 1 | 1 | - | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | - | 4 | 4 | 4 | 4 | 4 |
| 端口数量 | 2 | 2 | 2 | - | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 14 | 14 | 14 | - | 20 | 14 | 20 | 14 | 14 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | - | 125 °C | 125 °C | 125 °C | 85 °C | 85 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | - | -55 °C | -55 °C | -55 °C | -40 °C | -40 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | - | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | DIP | TSSOP | - | QCCN | DFP | QCCN | TSSOP | SSOP |
| 封装等效代码 | DIP14,.3 | DIP14,.3 | TSSOP14,.25 | - | - | - | LCC20,.35SQ | TSSOP14,.25,16 | SSOP14,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | - | CHIP CARRIER | FLATPACK | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 电源 | 2/5.5 V | 2/5.5 V | 2/5.5 V | - | - | - | 2/5.5 V | - | 2/5.5 V |
| Prop。Delay @ Nom-Sup | 8.5 ns | 8.5 ns | 8.5 ns | - | - | - | 8.5 ns | - | 8.5 ns |
| 传播延迟（tpd） | 13 ns | 13 ns | 13 ns | - | 13 ns | 13 ns | 13 ns | 13 ns | 13 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 5.08 mm | 5.08 mm | 1.2 mm | - | 2.03 mm | 2.03 mm | 2.03 mm | 1.2 mm | 2 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | - | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | YES | - | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | - | MILITARY | MILITARY | MILITARY | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | GULL WING | - | NO LEAD | FLAT | NO LEAD | GULL WING | GULL WING |
| 端子节距 | 2.54 mm | 2.54 mm | 0.65 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | 0.4 mm | 0.65 mm |
| 端子位置 | DUAL | DUAL | DUAL | - | QUAD | DUAL | QUAD | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | - | NOT SPECIFIED | - | NOT SPECIFIED |
| 宽度 | 7.62 mm | 7.62 mm | 4.4 mm | - | 8.89 mm | 6.29 mm | 8.89 mm | 3.6 mm | 5.3 mm |
| 负载电容（CL） | - | 50 pF | 50 pF | - | 50 pF | 50 pF | 50 pF | - | 50 pF |
| 厂商名称 | - | - | - | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) | Texas Instruments(德州仪器) |
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