SPST, 4 Func, 1 Channel, CMOS, CDIP16,
| 参数名称 | 属性值 |
| Reach Compliance Code | unknown |
| 模拟集成电路 - 其他类型 | SPST |
| JESD-30 代码 | R-GDIP-T16 |
| 标称负供电电压 (Vsup) | -15 V |
| 信道数量 | 1 |
| 功能数量 | 4 |
| 端子数量 | 16 |
| 最大通态电阻 (Ron) | 50 Ω |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 认证状态 | Not Qualified |
| 标称供电电压 (Vsup) | 15 V |
| 表面贴装 | NO |
| 最长断开时间 | 50 ns |
| 最长接通时间 | 50 ns |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子形式 | THROUGH-HOLE |
| 端子位置 | DUAL |
| Base Number Matches | 1 |
| 5962-8671601EX | 5962-8671601EA | 5962-86716012X | 5962-86716012A | HI4-201HS/883 | HI1-201HS/883 | |
|---|---|---|---|---|---|---|
| 描述 | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CDIP16, | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CQCC20 | SPST, 4 Func, 1 Channel, CMOS, CDIP16, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknow |
| 模拟集成电路 - 其他类型 | SPST | SPST | SPST | SPST | SPST | SPST |
| JESD-30 代码 | R-GDIP-T16 | R-GDIP-T16 | S-CQCC-N20 | S-CQCC-N20 | S-CQCC-N20 | R-GDIP-T16 |
| 标称负供电电压 (Vsup) | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
| 信道数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 4 | 4 | 4 | 4 | 4 | 4 |
| 端子数量 | 16 | 16 | 20 | 20 | 20 | 16 |
| 最大通态电阻 (Ron) | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω | 50 Ω |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | IN-LINE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 标称供电电压 (Vsup) | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
| 表面贴装 | NO | NO | YES | YES | YES | NO |
| 最长断开时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 最长接通时间 | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns | 50 ns |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE |
| 端子位置 | DUAL | DUAL | QUAD | QUAD | QUAD | DUAL |
| Base Number Matches | 1 | 1 | 1 | 1 | 1 | - |
| 最大供电电流 (Isup) | - | 10 mA | - | 10 mA | 10 mA | 10 mA |
单片机
模拟电子
DIY/开源硬件专区
模拟电子
ADI参考电路
单片机
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
