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IDT72V90823BCG

产品描述Digital Time Switch, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100
产品类别无线/射频/通信    电信电路   
文件大小399KB,共27页
制造商IDT (Integrated Device Technology)
标准
下载文档 详细参数 选型对比 全文预览

IDT72V90823BCG概述

Digital Time Switch, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100

IDT72V90823BCG规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称IDT (Integrated Device Technology)
零件包装代码BGA
包装说明11 X 11 MM, 1 MM PITCH, BGA-100
针数100
Reach Compliance Codecompliant
ECCN代码EAR99
JESD-30 代码S-PBGA-B100
JESD-609代码e1
长度11 mm
湿度敏感等级3
功能数量1
端子数量100
最高工作温度85 °C
最低工作温度-40 °C
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)260
认证状态Not Qualified
座面最大高度1.5 mm
标称供电电压3.3 V
表面贴装YES
电信集成电路类型DIGITAL TIME SWITCH
温度等级INDUSTRIAL
端子面层TIN SILVER COPPER
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间30
宽度11 mm
Base Number Matches1

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3.3 VOLT TIME SLOT INTERCHANGE
DIGITAL SWITCH
2,048 x 2,048
FEATURES:
IDT72V90823
2,048 x 2,048 channel non-blocking switching at 8.192 Mb/s
Per-channel variable or constant throughput delay
Automatic identification of ST-BUS
®
/GCI interfaces
Accept streams of 2.048 Mb/s, 4.096 Mb/s or 8.192 Mb/s
Automatic frame offset delay measurement
Per-stream frame delay offset programming
Per-channel high impedance output control
Per-channel Processor Mode
Control interface compatible to Intel/Motorola CPUs
Connection memory block programming
IEEE-1149.1 (JTAG) Test Port
Available in 84-pin Plastic Leaded Chip Carrier (PLCC),
100-pin Ball Grid Array (BGA), 100-pin Plastic Quad Flatpack
(PQFP) and 100-pin Thin Quad Flatpack (TQFP)
3.3V Power Supply
Operating Temperature Range -40°C to +85°C
°
°
DESCRIPTION:
The IDT72V90823 is a non-blocking digital switch that has a capacity of
2,048 x 2,048 channels at a serial bit rate of 8.192 Mb/s, 1,024 x 1,024 channels
at 4.096 Mb/s and 512 x 512 channels at 2.048 Mb/s. Some of the main features
are: programmable stream and channel control, Processor Mode, input offset
delay and high-impedance output control.
Per-stream input delay control is provided for managing large multi-chip
switches that transport both voice channel and concatenated data channels. In
addition, input streams can be individually calibrated for input frame offset.
FUNCTIONAL BLOCK DIAGRAM
V
CC
GND
RESET
TMS
TDI
TDO
TCK
TRST
IC
ODE
Test Port
RX0
RX1
RX2
RX3
RX4
RX5
RX6
RX7
RX8
RX9
RX10
RX11
RX12
RX13
RX14
RX15
TX0
TX1
TX2
TX3
TX4
TX5
TX6
TX7
TX8
TX9
TX10
TX11
TX12
TX13
TX14
TX15
Loopback
Receive
Serial Data
Streams
Data Memory
Output
MUX
Transmit
Serial Data
Streams
Internal
Registers
Connection
Memory
Timing Unit
Microprocessor Interface
CLK
F0i
FE/
WFPS
HCLK
AS/ IM DS/
RD
ALE
CS
R/W/ A0-A7
DTA
D8-D15/
WR
AD0-AD7
CCO
5712 drw01
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc. The ST-BUS is a trademark of Mitel Corp.
February
May 14, 2012
25, 2009
DECEMBER 2002
DSC-5712/4
1
20
12
Integrated Device Technology, Inc. All rights reserves. Product specifications subject to change without notice.

IDT72V90823BCG相似产品对比

IDT72V90823BCG IDT72V90823PFG IDT72V90823PFG8 IDT72V90823PQFG
描述 Digital Time Switch, PBGA100, 11 X 11 MM, 1 MM PITCH, BGA-100 Digital Time Switch, PQFP100, 14 X 14 MM, 0.50 MM PITCH, GREEN, TQFP-100 Digital Time Switch, PQFP100, 14 X 14 MM, 0.50 MM PITCH, GREEN, TQFP-100 Digital Time Switch, PQFP100, 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100
是否无铅 不含铅 不含铅 不含铅 不含铅
是否Rohs认证 符合 符合 符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 BGA QFP QFP QFP
包装说明 11 X 11 MM, 1 MM PITCH, BGA-100 14 X 14 MM, 0.50 MM PITCH, GREEN, TQFP-100 14 X 14 MM, 0.50 MM PITCH, GREEN, TQFP-100 14 X 20 MM, 0.65 MM PITCH, PLASTIC, QFP-100
针数 100 100 100 100
Reach Compliance Code compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99
JESD-30 代码 S-PBGA-B100 S-PQFP-G100 S-PQFP-G100 R-PQFP-G100
JESD-609代码 e1 e3 e3 e3
长度 11 mm 14 mm 14 mm 20 mm
功能数量 1 1 1 1
端子数量 100 100 100 100
最高工作温度 85 °C 85 °C 85 °C 85 °C
最低工作温度 -40 °C -40 °C -40 °C -40 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LFQFP LFQFP QFP
封装形状 SQUARE SQUARE SQUARE RECTANGULAR
封装形式 GRID ARRAY, LOW PROFILE FLATPACK, LOW PROFILE, FINE PITCH FLATPACK, LOW PROFILE, FINE PITCH FLATPACK
峰值回流温度(摄氏度) 260 260 260 260
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 1.5 mm 1.6 mm 1.6 mm 3.4 mm
标称供电电压 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES
电信集成电路类型 DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH DIGITAL TIME SWITCH
温度等级 INDUSTRIAL INDUSTRIAL INDUSTRIAL INDUSTRIAL
端子面层 TIN SILVER COPPER MATTE TIN MATTE TIN MATTE TIN
端子形式 BALL GULL WING GULL WING GULL WING
端子节距 1 mm 0.5 mm 0.5 mm 0.65 mm
端子位置 BOTTOM QUAD QUAD QUAD
处于峰值回流温度下的最长时间 30 30 30 30
宽度 11 mm 14 mm 14 mm 14 mm
Base Number Matches 1 1 1 1
湿度敏感等级 3 3 3 -

 
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