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5962-8872501XXT

产品描述IC 256K X 1 STANDARD SRAM, 35 ns, CQCC28, CERAMIC, LCC-28, Static RAM
产品类别存储    存储   
文件大小144KB,共11页
制造商Defense Supply Center Columbus
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5962-8872501XXT概述

IC 256K X 1 STANDARD SRAM, 35 ns, CQCC28, CERAMIC, LCC-28, Static RAM

5962-8872501XXT规格参数

参数名称属性值
零件包装代码QLCC
包装说明QCCN,
针数28
Reach Compliance Codeunknown
ECCN代码3A001.A.2.C
最长访问时间35 ns
其他特性TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 代码R-CQCC-N28
JESD-609代码e4
长度13.97 mm
内存密度262144 bit
内存集成电路类型STANDARD SRAM
内存宽度1
功能数量1
端子数量28
字数262144 words
字数代码256000
工作模式ASYNCHRONOUS
最高工作温度125 °C
最低工作温度-55 °C
组织256KX1
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装代码QCCN
封装形状RECTANGULAR
封装形式CHIP CARRIER
并行/串行PARALLEL
认证状态Not Qualified
筛选级别MIL-STD-883
座面最大高度3.048 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级MILITARY
端子面层PALLADIUM GOLD
端子形式NO LEAD
端子节距1.27 mm
端子位置QUAD
宽度8.89 mm
Base Number Matches1

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SRAM
Austin Semiconductor, Inc.
256K x 1 SRAM
SRAM MEMORY ARRAY
AVAILABLE AS MILITARY
SPECIFICATIONS
• SMD 5962-88725
• SMD 5962-88544
• MIL-STD-883
MT5C2561
PIN ASSIGNMENT
(Top View)
24-Pin DIP (C)
(300 MIL)
A6
A7
A8
A9
A10
A11
A14
A15
A0
Q
WE\
Vss
1
2
3
4
5
6
7
8
9
10
11
12
24
23
22
21
20
19
18
17
16
15
14
13
Vcc
A5
A4
A3
A2
A1
A17
A16
A13
A12
D
CE\
FEATURES
High Speed: 35, 45, 55, and 70
Battery Backup: 2V data retention
Low power standby
High-performance, low-power, CMOS double-metal
process
• Single +5V (+10%) Power Supply
• Easy memory expansion with CE\
• All inputs and outputs are TTL compatible
28-Pin LCC (EC)
• Timing
35ns access
45ns access
55ns access
70ns access
• Package(s)
Ceramic DIP (300 mil)
Ceramic LCC
A8
A7
A6
Vcc
A17
3 2 1 28 27
26
25
24
23
22
21
20
19
18
13 14 15 16 17
A12
D
CE\
Vss
WE\
OPTIONS
MARKING
-35
-45
-55*
-70*
NC 4
A9 5
A10 6
A11 7
A14 8
A15 9
A0 10
Q 11
NC 12
NC
A4
A3
A2
A1
A17
A16
A13
NC
C
EC
No. 106
No. 204
• Operating Temperature Ranges
Industrial (-40
o
C to +85
o
C)
IT
o
o
Military (-55 C to +125 C)
XT
• 2V data retention/low power
L
GENERAL DESCRIPTION
The Austin Semiconductor SRAM family employs
high-speed, low-power CMOS and are fabricated using double-
layer metal, double-layer polysilicon technology.
For flexibility in high-speed memory applications,
Austin Semiconductor offers chip enable (CE\) on all organiza-
tions. This enhancement can place the outputs in High-Z for
additional flexibility in system design. The x1 configuration
features separate data input and output.
Writing to these devices is accomplished when write
enable (WE\) and CE\ inputs are both LOW. Reading is accom-
plished when WE\ remains HIGH and CE\ goes LOW. The
device offers a reduced power standby mode when disabled.
This allows system designs to achieve low standby power re-
quirements.
These devices operate from a single +5V power sup-
ply and all inputs and outputs are fully TTL compatible.
Austin Semiconductor, Inc. reserves the right to change products or specifications without notice.
*Electrical characteristics identical to those provided for the 45ns
access devices.
For more products and information
please visit our web site at
www.austinsemiconductor.com
MT5C2561
Rev. 2.5 1/01
1

5962-8872501XXT相似产品对比

5962-8872501XXT
描述 IC 256K X 1 STANDARD SRAM, 35 ns, CQCC28, CERAMIC, LCC-28, Static RAM
零件包装代码 QLCC
包装说明 QCCN,
针数 28
Reach Compliance Code unknown
ECCN代码 3A001.A.2.C
最长访问时间 35 ns
其他特性 TTL COMPATIBLE INPUTS/OUTPUTS; BATTERY BACKUP; LOW POWER STANDBY
JESD-30 代码 R-CQCC-N28
JESD-609代码 e4
长度 13.97 mm
内存密度 262144 bit
内存集成电路类型 STANDARD SRAM
内存宽度 1
功能数量 1
端子数量 28
字数 262144 words
字数代码 256000
工作模式 ASYNCHRONOUS
最高工作温度 125 °C
最低工作温度 -55 °C
组织 256KX1
封装主体材料 CERAMIC, METAL-SEALED COFIRED
封装代码 QCCN
封装形状 RECTANGULAR
封装形式 CHIP CARRIER
并行/串行 PARALLEL
认证状态 Not Qualified
筛选级别 MIL-STD-883
座面最大高度 3.048 mm
最大供电电压 (Vsup) 5.5 V
最小供电电压 (Vsup) 4.5 V
标称供电电压 (Vsup) 5 V
表面贴装 YES
技术 CMOS
温度等级 MILITARY
端子面层 PALLADIUM GOLD
端子形式 NO LEAD
端子节距 1.27 mm
端子位置 QUAD
宽度 8.89 mm
Base Number Matches 1

 
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