NXP Semiconductors
Technical Data
Document Number: MC33660
Rev 6.0, 7/2016
ISO K line serial link interface
The 33660 is a serial link bus interface device designed to provide bi-directional
half-duplex communication interfacing in automotive diagnostic applications. It
is designed to interface between the vehicle’s on-board microcontroller, and
systems off-board the vehicle via the special ISO K line. The 33660 is designed
to meet the Diagnostic Systems ISO9141 specification. The device’s K line bus
driver’s output is fully protected against bus shorts and over-temperature
conditions.
The 33660 derives its robustness to temperature and voltage extremes by being
built on a SMARTMOS process, incorporating CMOS logic, bipolar/MOS analog
circuitry, and DMOS power FETs. Although the 33660 was principally designed
for automotive applications, it is suited for other serial communication
applications. It is parametrically specified over an ambient temperature range of
-40 ºC
≤
T
A
≤
125 ºC and 8.0 V
≤
V
BB
≤
18 V supply. The economical SO-8
surface-mount plastic package makes the 33660 very cost effective.
Features
• Operates over a wide supply voltage of 8.0 V to 18 V
• Operating temperature of -40
°C
to 125
°C
• Interfaces directly to standard CMOS microprocessors
• ISO K line pin protected against shorts to battery
• Thermal shutdown with hysteresis
• ISO K line pin capable of high currents
• ISO K line can be driven with up to 10 nF of parasitic capacitance
• 8.0 kV ESD protection attainable with few additional components
• Standby mode: no V
BAT
current drain with V
DD
at 5.0 V
• Low current drain during operation with V
DD
at 5.0 V
33660
ISO9141 PHYSICAL INTERFACE
EF SUFFIX (PB-FREE)
98ASB42564B
8-PIN SOICN
Applications
• Farm equipment
• Automotive systems
• Industrial equipment
• Robotic equipment
• Applications where module-to-module
communications are required
• Marine and aircraft networks
+V
BAT
V
DD
33660
VDD
MCU
Dx
SCIRxD
SCITxD
CEN
RX
TX
ISO
GND
VDD
VBB
ISO K-LINE
T
X
D
R
X
D
Figure 1. 33660 simplified application diagram
© 2016 NXP B.V.
1
Orderable parts
Table 1. Orderable part variations
Part number
(1)
Temperature
(T
A
)
Package
Parameter
VBB Load Dump
Peak Voltage (in
accordance with
ISO 7637-2 & ISO
7637-3)
Module Level ESD
(Air Discharge,
Powered)
Symbol
V
BB(5a)
Condition
Pulse 5a
470 ohm series resistor and
100 nF capacitor to GND on VBB
Pulse 5b
470 ohm series resistor and
100 nF capacitor to GND on VBB
33 V zener diode and 470 pF
capacitor to GND on ISO
33660
–
33660B
(2)
82 V
MC33660EF
-40 °C to
125 °C
MC33660BEF
8-SOICN
V
BB(5b)
45 V
45 V
V
ESD4
–
±25000 V
Notes
1. To order parts in tape & reel, add the R2 suffix to the part number.
2. Recommended for all new designs
33660
2
NXP Semiconductors
2
Internal block diagram
VBB
60 V
CEN
10 V
125 kΩ
600 kΩ
3.0 kΩ
20 V
*
Only applies to 33660B
R
HYS
55 kΩ
RX
10 V
550 kΩ
45 V
ISO
Master
Bias
110 kΩ
55 V
VDD
10 V
125 kΩ
TX
10 V
Thermal
Shutdown
2.0 kΩ
GND
Figure 2. 33660 simplified internal block diagram
33660
NXP Semiconductors
3
3
3.1
Pin connections
Pinout diagram
VBB
NC
GND
ISO
1
1
2
2
3
3
4
4
8
8
7
7
6
6
5
5
CEN
VDD
RX
TX
Figure 3. 33660 pin connections
3.2
Pin definitions
Table 2. 33660 pin definitions
Pin Number
1
2
3
4
5
6
7
8
Pin Name
VBB
NC
GND
ISO
TX
RX
VDD
CEN
Battery power through external resistor and diode.
Not to be connected.
(3)
Common signal and power return.
Bus connection.
Logic level input for data to be transmitted on the bus.
Logic output of data received on the bus.
Logic power source input.
Chip enable. Logic “1” for active state. Logic “0” for sleep state.
Definition
Notes
3. NC pins should not have any connections made to them. NC pins are not guaranteed to be open circuits.
33660
4
NXP Semiconductors
4
4.1
Electrical characteristics
Maximum ratings
Table 3. Maximum ratings
All voltages are with respect to ground unless otherwise noted. Exceeding these ratings may cause a malfunction or permanent damage
to the device.
Symbol
V
DD
VDD DC Supply Voltage
VBB Load Dump Peak Voltage (in accordance with ISO 7637-2 & ISO
7637-3)
• Pulse 5a - 33660B only
• Pulse 5b
ISO Pin Load Dump Peak Voltage
ESD Voltage
• Human Body Model
• Machine Model
33660
33660B
V
ESD3-1
V
ESD3-2
• Charge Device Model
Corner Pins
All other Pins
V
ESD4
• Module Level ESD (Air Discharge, Powered)
33660B only
ISO pin with 33 V zener diode and 470 pF capacitor to GND -
E
CLAMP
T
STG
T
C
T
J
P
D
T
PPRT
R
θJA
ISO Clamp Energy
Storage Temperature
Operating Case Temperature
Operating Junction Temperature
Power Dissipation T
A
= 25
°C
Peak Package Reflow Temperature During Reflow
Thermal Resistance: Junction-to-Ambient
10
-55 to +150
-40 to +125
-40 to +150
100
Note 10.
150
mJ
°C
°C
°C
mW
°C
°C/W
(9), (10)
(8)
Rating
Value
-0.3 to 7.0
Unit
V
Notes
V
BB(5a)
V
BB(5b)
V
ISO
V
ESD1
V
ESD2
82
45
40
±2000
±150
±200
±750
±500
V
(4)
(5)
(6)
(6)
V
V
(6)
±25000
(7)
Notes
4. Device will survive double battery jump start conditions in typical applications for 10 minutes duration, but is not guaranteed to remain within
specified parametric limits during this duration.
5. ESD data available upon request.
6. ESD1 testing is performed in accordance with the Human Body Model (C
ZAP
= 100 pF, R
ZAP
= 1500
Ω),
ESD2 testing is performed in accordance
with the Machine Model (C
ZAP
= 200 pF, R
ZAP
= 0
Ω),
ESD3 testing is performed in accordance with the Charge Device Model (C
ZAP
= 4.0 pF).
7.
ESD4 testing is performed in accordance with ISO 10605 ESD model (C = 330 pF, R = 2.0 kΩ). ESD discharges start at ±5.0 kV and go up to
±25 kV in increments of 5.0 kV. There are two positions for discharges: 8.0 cm cable from ISO connector, 85 cm cable from ISO connector. There
are 10 ESD discharges per voltage at each cable position at a minimum of 1.0 s intervals. Remaining charge is not bled off after every discharge.
Nonrepetitive clamping capability at 25
°C.
Pin soldering temperature limit is for 10 seconds maximum duration. Not designed for immersion soldering. Exceeding these limits may cause
malfunction or permanent damage to the device.
Freescale’s Package Reflow capability meets Pb-free requirements for JEDEC standard J-STD-020C. For Peak Package Reflow Temperature
and Moisture Sensitivity Levels (MSL), Go to www.freescale.com, search by part number [e.g. remove prefixes/suffixes and enter the core ID to
view all orderable parts. (i.e. MC33xxxD enter 33xxx), and review parametrics.
8.
9.
10.
33660
NXP Semiconductors
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