Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2
参数名称 | 属性值 |
厂商名称 | Microsemi |
包装说明 | O-MXPM-X2 |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
其他特性 | HIGH RELIABILITY |
应用 | SWITCHING |
外壳连接 | ISOLATED |
配置 | SINGLE |
最大二极管电容 | 4 pF |
二极管元件材料 | SILICON |
最大二极管正向电阻 | 0.2 Ω |
二极管类型 | PIN DIODE |
JESD-30 代码 | O-MXPM-X2 |
少数载流子标称寿命 | 30 µs |
元件数量 | 1 |
端子数量 | 2 |
封装主体材料 | METAL |
封装形状 | ROUND |
封装形式 | POST/STUD MOUNT |
表面贴装 | NO |
技术 | POSITIVE-INTRINSIC-NEGATIVE |
端子形式 | UNSPECIFIED |
端子位置 | UNSPECIFIED |
Base Number Matches | 1 |
HUM2020DE3 | HUM2001BE3 | HUM2001CE3 | HUM2005SME3 | HUM2005BE3 | HUM2010SME3 | HUM2015CE3 | |
---|---|---|---|---|---|---|---|
描述 | Pin Diode, Silicon, HERMETIC SEALED PACKAGE-2 | Pin Diode, Silicon, HERMETIC SEALED, AXIAL PACKAGE-2 | Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1 | Pin Diode, Silicon, HERMETIC SEALED, MELF-2 | Pin Diode, Silicon, HERMETIC SEALED, AXIAL PACKAGE-2 | Pin Diode, Silicon, HERMETIC SEALED, MELF-2 | Pin Diode, Silicon, HERMETIC SEALED PACKAGE-1 |
包装说明 | O-MXPM-X2 | O-XALF-W2 | O-MUPM-X1 | O-LELF-R2 | O-XALF-W2 | O-LELF-R2 | O-MUPM-X1 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY | HIGH RELIABILITY |
应用 | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
外壳连接 | ISOLATED | ISOLATED | CATHODE | ISOLATED | ISOLATED | ISOLATED | CATHODE |
配置 | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
最大二极管电容 | 4 pF | 4 pF | 4 pF | 4 pF | 4 pF | 4 pF | 4 pF |
二极管元件材料 | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
最大二极管正向电阻 | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω | 0.2 Ω |
二极管类型 | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE | PIN DIODE |
JESD-30 代码 | O-MXPM-X2 | O-XALF-W2 | O-MUPM-X1 | O-LELF-R2 | O-XALF-W2 | O-LELF-R2 | O-MUPM-X1 |
少数载流子标称寿命 | 30 µs | 30 µs | 30 µs | 30 µs | 30 µs | 30 µs | 30 µs |
元件数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 2 | 2 | 1 | 2 | 2 | 2 | 1 |
封装主体材料 | METAL | UNSPECIFIED | METAL | GLASS | UNSPECIFIED | GLASS | METAL |
封装形状 | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND | ROUND |
封装形式 | POST/STUD MOUNT | LONG FORM | POST/STUD MOUNT | LONG FORM | LONG FORM | LONG FORM | POST/STUD MOUNT |
表面贴装 | NO | NO | NO | YES | NO | YES | NO |
技术 | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE | POSITIVE-INTRINSIC-NEGATIVE |
端子形式 | UNSPECIFIED | WIRE | UNSPECIFIED | WRAP AROUND | WIRE | WRAP AROUND | UNSPECIFIED |
端子位置 | UNSPECIFIED | AXIAL | UPPER | END | AXIAL | END | UPPER |
Base Number Matches | 1 | - | - | 1 | 1 | 1 | - |
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