ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 包装说明 | DFP, FL20,.3 |
| Reach Compliance Code | unknown |
| 系列 | ACT |
| JESD-30 代码 | R-GDFP-F20 |
| JESD-609代码 | e0 |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP |
| 最大I（ol） | 0.024 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP |
| 封装等效代码 | FL20,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | FLATPACK |
| 电源 | 5 V |
| Prop。Delay @ Nom-Sup | 10 ns |
| 传播延迟（tpd） | 10 ns |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 2.286 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) - hot dipped |
| 端子形式 | FLAT |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 总剂量 | 100k Rad(Si) V |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 6.731 mm |
| Base Number Matches | 1 |
| 5962R8973501SA | 54ACTQ273FM | 395264712 | 54ACTQ273LM | 54ACTQ273FM-MLS | RM54ACTQ273LMQB | WHPC1218-34RFT4 | 5962R89735012A | 5962R8973501RA | |
|---|---|---|---|---|---|---|---|---|---|
| 描述 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | Strip Terminal Block | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDFP20, CERAMIC, FP-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | RESISTOR, METAL GLAZE/THICK FILM, 1W, 1%, 200ppm, 34ohm, SURFACE MOUNT, 1218, CHIP, ROHS COMPLIANT | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CQCC20, CERAMIC, LCC-20 | ACT SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, CDIP20, CERAMIC, DIP-20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | compliant | unknown | unknown |
| 是否Rohs认证 | 不符合 | - | 符合 | - | - | - | 符合 | 不符合 | 不符合 |
| 包装说明 | DFP, FL20,.3 | DFP, | - | QCCN, | DFP, | QCCN, | SMT, 1218 | QCCN, LCC20,.35SQ | DIP, DIP20,.3 |
| 系列 | ACT | ACT | - | ACT | ACT | ACT | - | ACT | ACT |
| JESD-30 代码 | R-GDFP-F20 | R-GDFP-F20 | - | S-CQCC-N20 | R-GDFP-F20 | S-CQCC-N20 | - | S-CQCC-N20 | R-GDIP-T20 |
| 负载电容（CL） | 50 pF | 50 pF | - | 50 pF | - | - | - | 50 pF | 50 pF |
| 逻辑集成电路类型 | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP | D FLIP-FLOP | - | D FLIP-FLOP | D FLIP-FLOP |
| 位数 | 8 | 8 | - | 8 | 8 | 8 | - | 8 | 8 |
| 功能数量 | 1 | 1 | - | 1 | 1 | 1 | - | 1 | 1 |
| 端子数量 | 20 | 20 | - | 20 | 20 | 20 | 2 | 20 | 20 |
| 最高工作温度 | 125 °C | 125 °C | - | 125 °C | 125 °C | 125 °C | 155 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | TRUE | TRUE | - | TRUE | TRUE | TRUE | - | TRUE | TRUE |
| 封装主体材料 | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | - | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | DFP | DFP | - | QCCN | DFP | QCCN | - | QCCN | DIP |
| 封装形状 | RECTANGULAR | RECTANGULAR | - | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR PACKAGE | SQUARE | RECTANGULAR |
| 封装形式 | FLATPACK | FLATPACK | - | CHIP CARRIER | FLATPACK | CHIP CARRIER | SMT | CHIP CARRIER | IN-LINE |
| 传播延迟（tpd） | 10 ns | 10 ns | - | 10 ns | 10 ns | 10 ns | - | 10 ns | 10 ns |
| 认证状态 | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified |
| 座面最大高度 | 2.286 mm | 2.286 mm | - | 1.905 mm | 2.286 mm | 1.905 mm | - | 1.905 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | - | 5 V | 5 V |
| 表面贴装 | YES | YES | - | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | - | CMOS | CMOS | CMOS | METAL GLAZE/THICK FILM | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | - | MILITARY | MILITARY | MILITARY | - | MILITARY | MILITARY |
| 端子形式 | FLAT | FLAT | - | NO LEAD | FLAT | NO LEAD | - | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 1.27 mm | - | 1.27 mm | 1.27 mm | 1.27 mm | - | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | - | QUAD | DUAL | QUAD | - | QUAD | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | - | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 6.731 mm | 6.731 mm | - | 8.89 mm | 6.731 mm | 8.89 mm | - | 8.89 mm | 7.62 mm |
| Base Number Matches | 1 | 1 | - | 1 | 1 | 1 | - | 1 | - |
微控制器 MCU
模拟与混合信号
stm32/stm8
DSP 与 ARM 处理器
嵌入式系统
PCB设计
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
