ELLIPTICAL FIN HEAT SINK
900 Series
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up
to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD,
Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.
These heat sinks are designed for air flow applications in the
Telecom, Data Center, Networking, Cloud Computing, and many
more Industries.
Material:
AL 6063
Finish:
Black Anodize
FORCED CONVECTION
SERIES
Height
12
15
18
901
21
23
28
33
12
15
18
902
21
23
28
33
12
15
18
903
21
23
28
33
12
15
18
904
21
23
28
33
12
15
18
905
21
23
28
33
CHIP SIZE
19mm
19mm
19mm
19mm
19mm
19mm
19mm
21mm
21mm
21mm
21mm
21mm
21mm
21mm
23mm
23mm
23mm
23mm
23mm
23mm
23mm
27mm
27mm
27mm
27mm
27mm
27mm
27mm
29mm
29mm
29mm
29mm
29mm
29mm
29mm
NATURAL
CONVECTION
14.77 C/W
14 C/W
13.23 C/W
12.46 C/W
11.98 C/W
11.5 C/W
9.57 C/W
14.31 C/W
13.57 C/W
12.83 C/W
12.09 C/W
11.63 C/W
10.47 C/W
9.3 C/W
13.85 C/W
13.14 C/W
12.44 C/W
11.73 C/W
11.28 C/W
10.16 C/W
9.04 C/W
12.93 C/W
12.29 C/W
11.64 C/W
11 C/W
10.58 C/W
9.54 C/W
8.51 C/W
12.47 C/W
11.86 C/W
11.25 C/W
10.63 C/W
10.23 C/W
9.24 C/W
8.24 C/W
200 LFM
6.63 C/W
6.12 C/W
5.67 C/W
5.28 C/W
4.89 C/W
4.38 C/W
4.04 C/W
5.81 C/W
5.3 C/W
4.95 C/W
4.61 C/W
4.32 C/W
3.89 C/W
3.57 C/W
4.75 C/W
4.38 C/W
4.07 C/W
3.84 C/W
3.59 C/W
3.22 C/W
2.93 C/W
4.34 C/W
4.05 C/W
3.73 C/W
3.43 C/W
3.21 C/W
2.89 C/W
2.62 C/W
4.09 C/W
3.81 C/W
3.56 C/W
3.3 C/W
3.06 C/W
2.72 C/W
2.47 C/W
400 LFM
5.09 C/W
4.63 C/W
4.17 C/W
3.87 C/W
3.58 C/W
3.26 C/W
2.98 C/W
3.86 C/W
3.5 C/W
3.35 C/W
3.111 C/W
2.91 C/W
2.61 C/W
2.37 C/W
3.31 C/W
3.05 C/W
2.81 C/W
2.57 C/W
2.4 C/W
2.17 C/W
1.95 C/W
3 C/W
2.76 C/W
2.5 C/W
2.31 C/W
2.11 C/W
1.84 C/W
1.66 C/W
2.74 C/W
2.52 C/W
2.31 C/W
2.12 C/W
1.91 C/W
1.69 C/W
1.49 C/W
600 LFM
4.38 C/W
3.95 C/W
3.58 /CW
3.24 C/W
3.06 C/W
2.80 C/W
2.62 C/W
3.16 C/W
2.89 C/W
2.66 C/W
2.47 C/W
2.32 C/W
2.09 C/W
1.95 C/W
2.79 C/W
2.53 C/W
2.32 C/W
2.11 C/W
1.97 C/W
1.8 C/W
1.64 C/W
2.53 C/W
2.29 C/W
2.07 C/W
1.9 C/W
1.71 C/W
1.51 C/W
1.35 C/W
2.25 C/W
2.02 C/W
1.84 C/W
1.65 C/W
1.49 C/W
1.33 C/W
1.18 C/W
910
909
908
907
906
SERIES
HEIGHT
12
15
18
21
23
28
33
12
15
18
21
23
28
33
12
15
18
21
23
28
33
12
15
18
21
23
28
33
12
15
18
21
23
28
33
CHIP SIZE
31mm
31mm
31mm
31mm
31mm
31mm
31mm
33mm
33mm
33mm
33mm
33mm
33mm
33mm
35mm
35mm
35mm
35mm
35mm
35mm
35mm
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
40mm
40mm
40mm
40mm
40mm
40mm
40mm
NATURAL
CONVECTION
12.02 C/W
11.43 C/W
10.85 C/W
10.27 C/W
9.88 C/W
8.93 C/W
7.98 C/W
11.56 C/W
11 C/W
10.45 C/W
9.9 C/W
9.54 C/W
8.62 C/W
7.71 C/W
11.1 C/W
10.58 C/W
10.06 C/W
9.53 C/W
8.75 C/W
7.93 C/W
7.11 C/W
10.52 C/W
10.04 C/W
9.56 C/W
9.08 C/W
8.75 C/W
7.93 C/W
7.11 C/W
9.95 C/W
9.51 C/W
9.06 C/W
8.62 C/W
8.3 C/W
7.55 C/W
6.78 C/W
FORCED CONVECTION
200 LFM
3.37 C/W
3.13 C/W
2.85 C/W
2.63 C/W
2.44 C/W
2.21 C/W
2.02 C/W
3.23 C/W
2.97 C/W
2.69 C/W
2.5 C/W
2.3 C/W
2.08 C/W
1.89 C/W
3.07 C/W
2.79 C/W
2.54 C/W
2.35 C/W
2.13 C/W
1.94 C/W
1.69 C/W
3.11 C/W
2.82 C/W
2.59 C/W
2.38 C/W
2.15 /CW
1.88 C/W
1.64 C/W
3.09 C/W
2.77 C/W
2.74 C/W
2.22 C/W
2.01C/W
1.8 C/W
1.61 C/W
400 LFM
2.25 C/W
2.02 C/W
1.79 C/W
1.63 C/W
1.5 C/W
1.36 C/W
1.19 C/W
2.09 C/W
1.88 C/W
1.7 C/W
1.52 C/W
1.37 C/W
1.23 C/W
1.08 C/W
2.07 C/W
1.87 C/W
1.69 C/W
1.52 C/W
1.35 C/W
1.19 C/W
1.02 C/W
2.01 C/W
1.79 C/W
1.59 C/W
1.41 C/W
1.24 C/W
1.08 C/W
.93 C/W
1.93 C/W
1.73 C/W
1.52 C/W
1.35 C/W
1.19 C/W
1.04 C/W
.88 C/W
600 LFM
1.87 C/W
1.66 C/W
1.45 C/W
1.31 C/W
1.19 C/W
1.05 C/W
.93 C/W
1.73 C/W
1.54 C/W
1.37 C/W
1.22 C/W
1.08 C/W
.98 C/W
.86 C/W
1.64 C/W
1.46 C/W
1.27 C/W
1.15 C/W
1.01 C/W
.86 C/W
.72 C/W
1.61 C/W
1.41 C/W
1.22 C/W
1.06 C/W
.94 C/W
.8 C/W
.68 C/W
1.56 C/W
1.37 C/W
1.17 C/W
.99 C/W
.87 C/W
.75 C/W
.64 C/W
Series Chip Size Construction Height Chip Height
901-
19-
1-
12-
1-
XXX
901
902
903
904
905
906
907
908
909
910
XX
19
21
23
27
29
31
33
35
37.5
40
X
1= Eliptical Fin
2= Pin Fin
XX
12 = 11.6
15 = 14.6
18 = 17.6
21 = 20.6
23 = 22.6
28 = 27.6
33 = 32.6
X
1 = .9-2.1
2 = 2.2-3.4
Finish
B-
X
B = BLK ANO
Interface
1
X
0 = None
1 = T725
T h e r m a l
C o o l i n g
S o l u t i o n s
f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
ELLIPTICAL FIN HEAT SINK
900 Series
Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and
the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm.
Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage
chip. Contact area is the edge of chip.
ASSEMBLY INSTRUCTION:
Step 1:
Hook the
clip under one
side of the BGA
chip set.
Step 2:
Rotate
assembly down
until opposite
side clip engages
substrate edge of
BGA chip set.
Step 3:
Make sure
the sop rods are
clearing from edges
of BGA chip set.
Step 4:
Press firmly
down to make sure
clips fully engage
edges of chip set.
Heat Sink should not
move around easily.
Random Vibration Test
Frequency
：5
Hz to 500 Hz
Acceleration
：3.13
grms
P.S.D
：0.01
g2/HZ (5 Hz)
0.02 g2/HZ (20 Hz to 500 Hz)
Test Axis
：X,
Y, Z axis
Test Time
：10
mins (Each axis)
Total Test Time
：30
mins
T h e r m a l
C o o l i n g
S o l u t i o n s
SHOCK TEST SPECIFICATION：
Wave Form
：Half
sine wave
Acceleration
：50
g
Duration Time
：11
ms
No. of Shock
：Each
axis 3 times
Shock Direction
：±X,
±Y, ±Z axis
Reliability & Communication
Testing Instruments
f r o m
S m a r t
t o
F i n i s h
www.wakefield-vette.com
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