High Speed InGaAs p-i-n Photodiode
13PD75-TO
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The 13PD75-TO, an InGaAs photodiode with a 75µm-diameter photosensitive region packaged in a TO-46
header, is intended for high speed and low noise applications. The diameter of the photosensitive region is
sufficiently small to enable operation at low dark current and low capacitance and yet large enough to allow
efficient coupling to multi-mode fiber. Planar semiconductor design and dielectric passivation provide very
low noise performance. Reliability is assured by hermetic sealing and 100% purge burn-in (200°C, 15
hours, Vr = 20V). Headers are available with either a lensed or flat window cap. Chips can also be attached
and wire bonded to customer-supplied or other specified packages.
Features:
• Planar Structure
• Dielectric Passivation
• 100% Purge Burn-in
• High Responsivity
DEVICE CHARACTERISTICS
Parameters
Operating Voltage
Dark Current
Capacitance
Responsivity
Rise/Fall
Frequency Response
Test Conditions
–5V
–5V
1300nm
(–3dB)
Minimum
Typical
0.2
0.7
0.9
1.5
Maximum
–20
2
0.9
0.5
Units
Volts
nA
pF
A/W
ns
GHz
0.8
ABSOLUTE MAXIMUM RATINGS
Reverse Voltage
Forward Current
Reverse Current
Operating Temperature
Storage Temperature
Soldering Temperature
30 Volts
10mA
5mA
–40°C to +85°C
–40°C to +85°C
250°C
Sheet 1 of 3
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Mechanical Specifications
TO-46 Header Packages
Standard TO-46 Lens
0.210
0.184
LENS
0.030
CHIP
Sheet 2 of 3
0.144
1.00
0.017 3X
CATHODE
(BIAS +)
ANODE
(BIAS –)
0.050
22.5°
CASE
0.040
0.040
Custom packaging is also available.
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Sheet 2 of 3
Mechanical Specifications
TO-46 Header Packages
TO-46 Ultra Flat Window
0.100 [2.54]
0.185 [4.70]
0.125 [3.17]
A
Sheet 3 of 3
0.212 [5.38]
0.011 [0.28]
0.015 [0.38] TYP. 0.019 MAX
0.011 [0.28]
-A-
NOT TO SCALE
CHIP
1.0 [25.4]
0.015 [0.38] TYP. 0.019 MAX.
WINDOW SURFACE TO CHIP SURFACE
45°
CATHODE (BIAS +)
ANODE(BIAS –)
CASE/GND
0.05 [1.27]
0.040 [1.02]
0.049 [1.25]
φ
REF.
0.017 [0.43] 3X
0.05 [1.27]
Custom packaging is also available.
829 Flynn Road, Camarillo, CA 93012 • Phone: (805) 445-4500 • Fax: (805) 445-4502
Email: customerservice@telcomdevices.com • Website: www.telcomdevices.com
Sheet 3 of 3