Features
Regulated
Converters
●
●
●
●
●
●
●
●
2.2W DIP Package
1kVDC Isolation
Regulated Output
UL94V-0 Package Material
Continuous Short Circuit Protection
Internal SMD design
100% Burned In
Efficiency to 75%
ECONOLINE
DC/DC-Converter
REC2.2-
S_DR/H1
Series
Output
Current
(mA)
600
440
244
183
146
±220
±122
±92
±73
Selection Guide
Part
Number
DIP24 (SMD)
REC2.2-xx3.3SR/H1
REC2.2-xx05SR/H1
REC2.2-xx09SR/H1
REC2.2-xx12SR/H1
REC2.2-xx15SR/H1
REC2.2-xx05DR/H1
REC2.2-xx09DR/H1
REC2.2-xx12DR/H1
REC2.2-xx15DR/H1
xx = Input Voltage
* add suffix "/SMD" for SMD package, e.g. REC2.2-0505SR/H1/SMD
* add suffix "/M" for Metal Case, e.g. REC2.2-0505SR/H1/M
Input
Voltage
(VDC)
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
5, 12, 24, 48
Output
Voltage
(VDC)
3.3
5
9
12
15
±5
±9
±12
±15
Max Cap.
Load
(µF)
1000
470
220
120
100
±220
±100
±68
±47
2.2 Watt
DIP24
&
SMD
Single
&
Dual
Output
UL-60950-1 Certified
Specifications
(Core Operating Area)
Input Voltage Range
Output Voltage Accuracy
Line Voltage Regulation
Load Voltage Regulation (10% to 100% full load )
Output Ripple and Noise (at 20MHz BW)
Operating Frequency
Efficiency at Full Load
No Load Power Consumption
Isolation Voltage
Rated Working Voltage
Isolation Capacitance
Isolation Resistance
Short Circuit Protection
Operating Temperature Range (free air convection)
Storage Temperature Range
Relative Humidity
Thermal Impedance
Package Weight
MTBF (+25°C)
(+80°C)
94
Natural convection
using MIL-HDBK 217F
using MIL-HDBK 217F
January-2007
(tested for 1 second)
(long term isolation)
±15%
±3% typ.
±0.5% max
±1% max.
100mVp-p max.
75kHz min.
65% min.
200mW max.
1000VDC min.
see Application Notes
30pF typ.
Output Power (%)
100
80
60
40
30
20
0
Derating-Graph
(Ambient Temperature)
1 GΩ min.
Continuous
-40°C to +80°C (see Graph)
-50°C to +125°C
95% RH
20°C/W for metal case
12g
1000 x 10
3
hours
150 x 10
3
hours
Safe Operating Area
80
Operating Temperature °C
-40
0
50
100
150
}
Detailed Information see
Application Notes chapter "MTBF"
www.recom-international.com
ECONOLINE
DC/DC-Converter
Package Style and Pinning (mm)
REC2.2-S_DR/H1
Series
3rd angle
projection
24 PIN DIP Package
32.00
10.20
3.81
2.06
0.51
20.30
Pin Connections
Pin #
1
2
Single
+Vin
No Pin
No Pin
–Vout
+ Vout
–Vin
–Vin
+ Vout
–Vout
No Pin
No Pin
+Vin
Dual
+Vin
–Vout
Com
Com
+ Vout
–Vin
–Vin
+ Vout
Com
Com
–Vout
+Vin
15.24
3
10
11
Recommended Footprint Details
1.00 ø+0.15/0
12
13
14
15
22
23
24
1 2 3
Bottom View
24 23 22
10 11 12
15 14 13
Top View
2.54
XX.X ± 0.5 mm
XX.XX ± 0.25 mm
2.54
24 PIN DIP SMD Package
32.00
20.32
11.20
10.90
1.50
25.40
2.54
All unused pins are
NC (No Connection).
SMD pin connections
follow standard
package pinning.
Recommended Footprint Details
Pin area
0.1 x 0.50
1 2 3 4 5
0.50
9 10 11 12
1.60
2.40
23.40
Bottom View
24 23 22 21 20
16 15 14 13
26.54
24.14
1
Top View
XX.X ± 0.5 mm
XX.XX ± 0.25 mm
25.40
27.94
www.recom-international.com
January-2007
95
NXP MCU
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