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835-13-050-10-001000

产品描述Board Connector, 50 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT
产品类别连接器    连接器   
文件大小167KB,共1页
制造商Mill-Max
官网地址https://www.mill-max.com
标准
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835-13-050-10-001000概述

Board Connector, 50 Contact(s), 2 Row(s), Female, Straight, Solder Terminal, Socket, ROHS COMPLIANT

835-13-050-10-001000规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称Mill-Max
包装说明ROHS COMPLIANT
Reach Compliance Codecompliant
主体/外壳类型SOCKET
连接器类型BOARD CONNECTOR
联系完成配合GOLD (30) OVER NICKEL (100)
联系完成终止GOLD (10)
触点性别FEMALE
触点材料NOT SPECIFIED
DIN 符合性NO
滤波功能NO
IEC 符合性NO
JESD-609代码e4
MIL 符合性NO
制造商序列号835
混合触点NO
安装方式STRAIGHT
安装类型BOARD
装载的行数2
选件GENERAL PURPOSE
端子节距2.54 mm
端接类型SOLDER
触点总数50
Base Number Matches1

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INTERCONNECTS
OFP® Pass Thru Sockets for Ø.030” &
Single and Double Row
834/835 Series Pass Thru Sockets have a low
.130” profile and will accept Ø.030” round pin,
as well as industry standard .025” square pin
headers.
They are typically used to interconnect two or
more parallel circuit boards.
Sockets are designed for hand, wave or reflow*
soldering. The high temp. insulator is compati-
ble with all solder processes.
Unique
ORGANIC FIBRE PLUG®
barriers pre-
vent solder, paste or flux from contaminating
the internal spring contacts. After soldering, the
OFP®
barriers are pushed out of the socket
when the mating header is inserted.
Mill-Max sockets use a precision machined
brass sleeve with a press-fit beryllium copper
“multi-finger” spring contact.
Recommended mounting holes are Ø.046
±.003” PTH (1,2 mm drilled prior to plating).
*Intrusive reflow (also called "pin-in-paste") is a tech-
nique of using conventional thru-hole components
in a reflow soldering process. The pass thru socket
is placed into plated-thru-holes in the circuit board
(solder paste has previously been screen printed on
pads adjacent to the holes) and the board is
reflowed in the same pass as other SMT compo-
nents. Solder will fill the plated-thru-holes and
achieve solder joints as reliable as wave soldering.
The OFP® barrier prevents solder paste from being
picked-up inside the contact during assembly.
Series 834, 835
.025” pins
Typical Application
U
US Patent #7,086,870
Ordering Information
Single Row
OFP® Pass Thru Socket
834-XX-0 _ _-10-001000
01-64
Fig. 1
®
Specify # of pins
Fig. 1
Double Row OFP® Pass Thru Socket
835-XX-0 _ _-10-001000
Fig. 2
Specify # of pins
For RoHS compliance
select plating code.
SPECIFY PLATING CODE XX=
®
02-72
XX= Plating Code
See Below
13
30µ” Au
93
30µ” Au
99
43
44
Sleeve (Pin)
10µ” Au 200µ” Sn/Pb 200µ”Sn/Pb 200µ”Sn 200µ”Sn
200µ”Sn/Pb 30µ” Au 200µ”Sn
Fig. 2
Contact (Clip)
w w w. m i l l - m a x . c o m
85
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