Si4012
Si4012 C
RYSTAL
-
LESS
FSK/OOK RF T
RANSMITTER
Features
Frequency range
27–960 MHz
Output power range
–13 to +10 dBm
Low Power Consumption
OOK
14.2 mA @ +10 dBm
FSK
19.8 mA @ +10 dBm
Data rate:
Up to 100 kbaud FSK
Up to 50 kbaud OOK
FSK and OOK modulation
Power supply = 1.8 to 3.6 V
Automatic antenna tuning
Programmable ramp rate
Crystal-less operation
±150 ppm: 0 to 70° C
±250 ppm: –40 to 85° C
Optional crystal input for
applications requiring tighter
tolerances
Ultra low standby current <10 nA
Integrated voltage regulator
255 byte FIFO
Low battery detector
SMBus Interface
–40 to +85 °C temperature range
10-Pin MSOP Package,
RoHs compliant
Low BOM
Ordering Information:
See page 43.
Pin Assignments
Si4012
XTAL 1
10 SDA
9 SCL
Si4012
8 SDN
7 nIRQ
6 LED
Applications
Wireless MBus T1-mode
Remote control
Home security & alarm
Personal data logging
Toy control
Wireless PC peripherals
Remote meter reading
Remote keyless entry
Home automation
Industrial control
Sensor networks
Health monitors
GND 2
TXM 3
TXP 4
VDD 5
Description
Silicon Laboratories’ Si4012 is a fully-integrated crystalless CMOS high-data-rate
RF transmitter designed for the sub-GHz ISM band. This chip is optimized for
battery powered applications requiring low standby currents and high output
transmit power.
The device offers advanced radio features including continuous frequency
coverage from 27–960 MHz, adjustable output power of up to +10 dBm, and data
rates up to 100 kbaud in FSK mode. The Si4012’s high level of integration offers
reduced BOM cost while simplifying overall system design.
Patents pending
Functional Block Diagram
Si4012
Digital Logic
Antenna Tune
Host
MCU
SMBus
Interface
OOK
FSK
Modulator
LCOSC
Divider
PA
Auto
Tune
TXP
TXM
RF Analog Core
TX
255 Byte
Data FIFO
LED
XTAL
Digital
Controller
Register
Bank
LPOSC
VA
VD
XTAL
OSC
LDO
POR
BANDGAP
Battery
Monitor
VDD
GND
Rev 1.1 3/13
Copyright © 2013 by Silicon Laboratories
Si4012
Si4012
2
Preliminary Rev. 0.1
Si4012
T
ABLE
Section
OF
C
ONTENTS
Page
1. Electrical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4
1.1. Definition of Test Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
2. Typical Application Schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
3. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9
4. Host MCU Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.1. SMBus Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4.2. SMBus Flow Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10
4.3. Host Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
4.4. Operating Mode Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5. Command Structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
5.1. Commands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
5.2. Properties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
5.3. Error Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .41
6. Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
7. Ordering Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
8. Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
9. Land Pattern: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
10. Top Marking: 10-Pin MSOP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
Document Change List . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .48
Contact Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .50
Preliminary Rev. 0.1
3
Si4012
1. Electrical Specifications
Table 1. Recommended Operating Conditions
1
Parameter
Supply Voltage
Supply Voltage Slew Rate
Input Voltage
Symbol
V
DD
Initial Battery Insertion
2
Digital Input Signals
Test Condition
Min
1.8
20
–0.3
Typ
—
—
—
Max
3.6
650
V
DD
+
0.3
Unit
V
mV/
us
V
Notes:
1.
All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are
listed in "1.1. Definition of Test Conditions" on page 7.
2.
Recommend bypass capacitor = 1 µF; slew rate measured 1 V < V
DD
,< 1.7 V.
Table 2. DC Characteristics*
Parameter
Power Saving Modes
Symbol
I
Shutdown
I
Idle
TX Mode Current @ 10 dBm
I
TX_OOK
I
TX_FSK
Conditions
Lowest current mode
Register values retained,
lowest current consumption idle mode
OOK, Manchester encoded
FSK
Min
—
—
—
—
Typ
10
600
14.2
19.8
Max
—
—
—
—
Units
nA
µA
mA
mA
*Note:
All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are
listed in "1.1. Definition of Test Conditions" on page 7.
4
Preliminary Rev. 0.1
Si4012
Table 3. Si4012 RF Transmitter Characteristics
1
(TA = 25 °C, VDD = 3.3 V, RL = 550
,
unless otherwise noted)
Parameter
Frequency Range (F
RF
)
2
Frequency Noise (rms)
3
Phase Noise @ 915 MHz
Test Condition
Allen deviation, measured across
1 ms interval
10 kHz offset
100 kHz offset
1 MHz offset
0 °C
≤
T
A
≤
70 °C
–40 °C
≤
T
A
≤
85 °C
Min
27
—
—
—
—
—
–150
–250
–10
Typ
—
0.3
–70
–100
–105
5
Max
960
—
—
—
—
—
+150
+250
+10
—
Unit
MHz
ppm
dBc/Hz
dBc/Hz
dBc/Hz
ms
ppm
ppm
ppm
dBm
Frequency Tuning Time
Carrier Frequency Accuracy
Frequency Error Contribution
with External Crystal
Transmit Power
4
—
10
Maximum programmed Tx power,
with optimum differential load, V
DD
> 2.2 V
Minimum programmed TX power,
with optimum differential load,
V
DD
> 2.2 V
Power variation vs temp and supply,
with optimum differential load,
V
DD
> 2.2 V
Power variation vs temp and supply,
with optimum differential load,
V
DD
> 1.8 V
Transmit power step size
from –13 to 6.5 dBm
—
—
–13
—
dBm
–1.0
—
0.5
dB
–2.5
—
0.34
—
0.25
—
0.5
—
10.7
dB
dB
us
kbaud
kbaud
ppm
ppm
ppm
dB
pF
PA Edge Ramp Rate
Programmable Range
Data Rate
FSK Deviation
OOK mode
OOK
FSK
Max frequency deviation
Deviation resolution
Deviation accuracy
OOK Modulation Depth
Antenna Tuning Capacitive
Range (Differential)
0.1
—
50
0.1
—
100
—
275
—
—
2
—
±(4 ppm + 2% pk-pk target FSK
deviation in ppm)
60
—
—
2.4
—
12.5
315 MHz
Notes:
1.
All specifications guaranteed by production test unless otherwise noted. Production test conditions and max limits are
listed in "1.1. Definition of Test Conditions" on page 7.
2.
The frequency range is continuous over the specified range.
3.
The frequency step size is limited by the frequency noise.
4.
Optimum differential load is equal to 4 V/(11.5 mA/2 x 4/PI) = 550
Therefore
the antenna load resistance in parallel
with the Si4012 differential output resistance should equal 600
Preliminary Rev. 0.1
5
FPGA/CPLD
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