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89HPES8T5AZBBC

产品描述CABGA-196, Tray
产品类别嵌入式处理器和控制器    微控制器和处理器   
文件大小438KB,共30页
制造商IDT (Integrated Device Technology)
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89HPES8T5AZBBC概述

CABGA-196, Tray

89HPES8T5AZBBC规格参数

参数名称属性值
Brand NameIntegrated Device Technology
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码CABGA
包装说明LBGA, BGA196,14X14,40
针数196
制造商包装代码BC196
Reach Compliance Codenot_compliant
ECCN代码EAR99
其他特性ALSO REQUIRES 3.3V SUPPLY
地址总线宽度
总线兼容性PCI
最大时钟频率125 MHz
外部数据总线宽度
JESD-30 代码S-PBGA-B196
JESD-609代码e0
长度15 mm
湿度敏感等级3
端子数量196
最高工作温度70 °C
最低工作温度
封装主体材料PLASTIC/EPOXY
封装代码LBGA
封装等效代码BGA196,14X14,40
封装形状SQUARE
封装形式GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度)225
电源1,3.3 V
认证状态Not Qualified
座面最大高度1.5 mm
最大供电电压1.1 V
最小供电电压0.9 V
标称供电电压1 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn63Pb37)
端子形式BALL
端子节距1 mm
端子位置BOTTOM
处于峰值回流温度下的最长时间20
宽度15 mm
uPs/uCs/外围集成电路类型BUS CONTROLLER, PCI
Base Number Matches1

文档解析

89HPES8T5A是IDT推出的8通道PCI Express交换机,具备5个端口,专为简化高速互连而设计。它支持PCIe 1.1标准,应用于扩展槽和外围设备连接,如网络接口和存储控制器。芯片集成完整PCIe协议栈,包括SerDes和逻辑层,实现无缝数据传输。 主要功能包括低延迟交换架构、256字节负载支持,以及流量管理通过8个TC和1个VC实现。配置灵活性高,支持SMBus从接口访问所有寄存器,主接口用于EEPROM初始化;热插拔通过SMBus与I/O扩展器集成,简化实现。附加测试特性如统计计数器,辅助性能监控。 在系统集成方面,产品提供端到端错误保护和热插拔兼容性,符合RAS要求。功耗管理技术降低典型能耗,支持多种电源状态;封装采用标准BGA格式,便于高可靠性应用部署。

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8-Lane 5-Port
PCI Express® Switch
®
89HPES8T5A
Data Sheet
The 89HPES8T5A is a member of IDT’s PRECISE™ family of PCI
Express switching solutions. The PES8T5A is an 8-lane, 5-port periph-
eral chip that performs PCI Express Base switching. It provides connec-
tivity and switching functions between a PCI Express upstream port and
up to four downstream ports and supports switching between down-
stream ports.
Device Overview
u
u
Features
u
u
u
High Performance PCI Express Switch
– Eight 2.5Gbps PCI Express lanes
– Five switch ports
– Upstream port is x4
– Downstream ports are x1
– Low-latency cut-through switch architecture
– Support for Max Payload Sizes up to 256 bytes
– One virtual channel
– Eight traffic classes
– PCI Express Base Specification Revision 1.1 compliant
Flexible Architecture with Numerous Configuration Options
– Automatic lane reversal on all ports
– Automatic polarity inversion on all lanes
– Ability to load device configuration from serial EEPROM
Legacy Support
– PCI compatible INTx emulation
– Bus locking
u
u
Highly Integrated Solution
– Requires no external components
– Incorporates on-chip internal memory for packet buffering and
queueing
– Integrates eight 2.5 Gbps embedded SerDes with 8B/10B
encoder/decoder (no separate transceivers needed)
Reliability, Availability, and Serviceability (RAS) Features
– Internal end-to-end parity protection on all TLPs ensures data
integrity even in systems that do not implement end-to-end
CRC (ECRC)
– Supports ECRC and Advanced Error Reporting
– Supports PCI Express Native Hot-Plug, Hot-Swap capable I/O
– Compatible with Hot-Plug I/O expanders used on PC mother-
boards
Power Management
– Utilizes advanced low-power design techniques to achieve low
typical power consumption
– Supports PCI Power Management Interface specification (PCI-
PM 1.2)
– Unused SerDes are disabled.
– Supports Advanced Configuration and Power Interface Speci-
fication, Revision 2.0 (ACPI) supporting active link state
Testability and Debug Features
– Built in Pseudo-Random Bit Stream (PRBS) generator
– Numerous SerDes test modes
– Ability to read and write any internal register via the SMBus
– Ability to bypass link training and force any link into any mode
– Provides statistics and performance counters
Block Diagram
5-Port Switch Core / 8 PCI Express Lanes
Frame Buffer
Route Table
Port
Arbitration
Scheduler
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Transaction Layer
Data Link Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
Mux / Demux
Phy
Logical
Layer
SerDes
SerDes
SerDes
SerDes
SerDes
(Port 0)
(Port 2)
(Port 3)
Figure 1 Internal Block Diagram
(Port 4)
(Port 5)
IDT and the IDT logo are registered trademarks of Integrated Device Technology, Inc.
1 of 29
June 18, 2014

89HPES8T5AZBBC相似产品对比

89HPES8T5AZBBC 89HPES8T5AZBBCG8 89HPES8T5AZBBC8 89HPES8T5AZBBCI 89HPES8T5AZBBCG
描述 CABGA-196, Tray CABGA-196, Reel CABGA-196, Reel CABGA-196, Tray CABGA-196, Tray
Brand Name Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology Integrated Device Technology
是否无铅 含铅 不含铅 含铅 含铅 不含铅
是否Rohs认证 不符合 符合 不符合 不符合 符合
厂商名称 IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology) IDT (Integrated Device Technology)
零件包装代码 CABGA CABGA CABGA CABGA CABGA
包装说明 LBGA, BGA196,14X14,40 LBGA, CABGA-196 LBGA, BGA196,14X14,40 LBGA, BGA196,14X14,40
针数 196 196 196 196 196
制造商包装代码 BC196 BCG196 BC196 BC196 BCG196
Reach Compliance Code not_compliant compliant not_compliant not_compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99
总线兼容性 PCI PCI; SMBUS PCI; SMBUS PCI PCI
最大时钟频率 125 MHz 125 MHz 125 MHz 125 MHz 125 MHz
JESD-30 代码 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196 S-PBGA-B196
JESD-609代码 e0 e1 e0 e0 e1
长度 15 mm 15 mm 15 mm 15 mm 15 mm
湿度敏感等级 3 3 3 3 3
端子数量 196 196 196 196 196
最高工作温度 70 °C 70 °C 70 °C 85 °C 70 °C
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 LBGA LBGA LBGA LBGA LBGA
封装形状 SQUARE SQUARE SQUARE SQUARE SQUARE
封装形式 GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE GRID ARRAY, LOW PROFILE
峰值回流温度(摄氏度) 225 260 225 225 260
座面最大高度 1.5 mm 1.5 mm 1.5 mm 1.5 mm 1.5 mm
最大供电电压 1.1 V 1.1 V 1.1 V 1.1 V 1.1 V
最小供电电压 0.9 V 0.9 V 0.9 V 0.9 V 0.9 V
标称供电电压 1 V 1 V 1 V 1 V 1 V
表面贴装 YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL INDUSTRIAL COMMERCIAL
端子面层 Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu) Tin/Lead (Sn63Pb37) Tin/Lead (Sn63Pb37) Tin/Silver/Copper (Sn/Ag/Cu)
端子形式 BALL BALL BALL BALL BALL
端子节距 1 mm 1 mm 1 mm 1 mm 1 mm
端子位置 BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
处于峰值回流温度下的最长时间 20 NOT SPECIFIED NOT SPECIFIED 20 30
宽度 15 mm 15 mm 15 mm 15 mm 15 mm
uPs/uCs/外围集成电路类型 BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI BUS CONTROLLER, PCI
Base Number Matches 1 1 1 1 1
其他特性 ALSO REQUIRES 3.3V SUPPLY - - ALSO REQUIRES 3.3V SUPPLY ALSO REQUIRES 3.3V SUPPLY
封装等效代码 BGA196,14X14,40 - - BGA196,14X14,40 BGA196,14X14,40
电源 1,3.3 V - - 1,3.3 V 1,3.3 V
认证状态 Not Qualified - - Not Qualified Not Qualified
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