电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索

IDT72811L25PF9

产品描述FIFO, 512X9, 15ns, Synchronous, CMOS, PQFP64, TQFP-64
产品类别存储    存储   
文件大小208KB,共16页
制造商IDT (Integrated Device Technology)
下载文档 详细参数 全文预览

IDT72811L25PF9概述

FIFO, 512X9, 15ns, Synchronous, CMOS, PQFP64, TQFP-64

IDT72811L25PF9规格参数

参数名称属性值
是否无铅含铅
是否Rohs认证不符合
厂商名称IDT (Integrated Device Technology)
零件包装代码QFP
包装说明TQFP-64
针数64
Reach Compliance Codecompliant
ECCN代码EAR99
最长访问时间15 ns
周期时间25 ns
JESD-30 代码S-PQFP-G64
JESD-609代码e0
长度14 mm
内存密度4608 bit
内存宽度9
湿度敏感等级3
功能数量2
端子数量64
字数512 words
字数代码512
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织512X9
可输出YES
封装主体材料PLASTIC/EPOXY
封装代码LQFP
封装形状SQUARE
封装形式FLATPACK, LOW PROFILE
并行/串行PARALLEL
峰值回流温度(摄氏度)240
认证状态Not Qualified
座面最大高度1.6 mm
最大供电电压 (Vsup)5.5 V
最小供电电压 (Vsup)4.5 V
标称供电电压 (Vsup)5 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层TIN LEAD
端子形式GULL WING
端子节距0.8 mm
端子位置QUAD
处于峰值回流温度下的最长时间20
宽度14 mm
Base Number Matches1

文档预览

下载PDF文档
DUAL CMOS SyncFIFO™
DUAL 256 x 9, DUAL 512 x 9,
DUAL 1,024 x 9, DUAL 2,048 x 9,
DUAL 4,096 x 9, DUAL 8,192 x 9
IDT72801
IDT72811
IDT72821
IDT72831
IDT72841
IDT72851
FEATURES:
The IDT72801 is equivalent to two IDT72201 256 x 9 FIFOs
The IDT72811 is equivalent to two IDT72211 512 x 9 FIFOs
The IDT72821 is equivalent to two IDT72221 1,024 x 9 FIFOs
The IDT72831 is equivalent to two IDT72231 2,048 x 9 FIFOs
The IDT72841 is equivalent to two IDT72241 4,096 x 9 FIFOs
The IDT72851 is equivalent to two IDT72251 8,192 x 9 FIFOs
Offers optimal combination of large capacity, high speed,
design flexibility and small footprint
Ideal for prioritization, bidirectional, and width expansion
applications
10 ns read/write cycle time for the IDT72801/72811/72821/72831/
72841 (excluding the IDT72851)
15 ns read/write cycle time for the IDT72851
Separate control lines and data lines for each FIFO
Separate Empty, Full, Programmable Almost-Empty and Almost-
Full flags for each FIFO
Enable puts output data lines in high-impedance state
Space-saving 64-pin Thin Quad Flat Pack (TQFP) and Slim Thin
Quad Flatpack (STQFP)
Industrial temperature range (–40°C to +85°C) is available
°
°
DESCRIPTION:
The IDT72801/72811/72821/72831/72841/72851 are dual synchronous
(clocked) FIFOs. The device is functionally equivalent to two IDT72201/72211/
72221/72231/72241/72251 FIFOs in a single package with all associated
control, data, and flag lines assigned to separate pins.
Each of the two FIFOs (designated FIFO A and FIFO B) contained in the
IDT72801/72811/72821/72831/72841/72851 has a 9-bit input data port (DA0
- DA8, DB0 - DB8) and a 9-bit output data port (QA0 - QA8, QB0 - QB8). Each
input port is controlled by a free-running clock (WCLKA, WCLKB), and two Write
Enable pins (WENA1, WENA2,
WENB1,
WENB2). Data is written into each of
the two arrays on every rising clock edge of the Write Clock (WCLKA, WCLKB)
when the appropriate write enable pins are asserted.
The output port of each FIFO bank is controlled by its associated clock pin
(RCLKA, RCLKB) and two Read Enable pins (RENA1,
RENA2, RENB1,
RENB2).
The Read Clock can be tied to the Write Clock for single clock operation
or the two clocks can run asynchronous of one another for dual clock operation.
An Output Enable pin (OEA,
OEB)
is provided on the read port of each FIFO
for three-state output control.
Each of the two FIFOs has two fixed flags, Empty (EFA,
EFB)
and Full (FFA,
FFB).
Two programmable flags, Almost-Empty (PAEA,
PAEB)
and Almost-Full
(PAFA,
PAFB),
are provided for each FIFO bank to improve memory utilization.
If not programmed, the programmable flags default to empty+7 for
PAEA
and
PAEB,
and full-7 for
PAFA
and
PAFB.
The IDT72801/72811/72821/72831/72841/72851 architecture lends itself
to many flexible configurations such as:
• 2-level priority data buffering
• Bidirectional operation
• Width expansion
• Depth expansion
These FIFOs is fabricated using IDT's high-performance submicron
CMOS technology.
FUNCTIONAL BLOCK DIAGRAM
WCLKA
WENA1
WENA2
DA0 - DA8
EFA
PAEA
PAFA
LDA
FFA
WCLKB
WENB1
WENB2
DB0 - DB8
LDB
INPUT REGISTER
OFFSET REGISTER
FLAG
LOGIC
INPUT REGISTER
OFFSET REGISTER
EFB
PAEB
PAFB
FFB
WRITE CONTROL
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1024 x 9, 2048 x 9,
4096 x 9, 8192 x 9
WRITE CONTROL
LOGIC
RAM ARRAY
256 x 9, 512 x 9,
1024 x 9, 2048 x 9,
4096 x 9, 8192 x 9
FLAG
LOGIC
WRITE POINTER
READ POINTER
WRITE POINTER
READ POINTER
READ CONTROL
LOGIC
READ CONTROL
LOGIC
OUTPUT REGISTER
RESET LOGIC
RESET LOGIC
OUTPUT REGISTER
RSA
OEA
QA0 - QA8
RCLKA
RENA1
RENA2
RSB
OEB
QB0 - QB8
RCLKB
RENB1
RENB2
3034 drw 01
IDT, IDT logo and the
SyncFIFO
logo are trademarks of Integrated Device Technology, Inc.
COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGE
1
2001 Integrated Device Technology, Inc. All rights reserved. Product specifications subject to change without notice.
APRIL 2001
DSC-3034/2
基于RL78/G14的多路微小电流/功耗检测仪
在电子电路设计中我们时常要对设备的功耗进行分析,本项目设计微小电路测试仪可以直观的观察电路中电流的的变化,可以对电路进行功耗的分析。1.利用检流放大器对当前采集当前电路中的电流值,并 ......
pkilllo 瑞萨MCU/MPU
MAX2140内部ESD二极管的保护电路设计
在对MAX2140 SDARS接收器进行热插拔操作(接通电源或断开电源)时,可能使其内部静电放电(ESD)保护二极管失效,热插拔不是该器件的标准操作。但这种情况会发生在很多应用中,尤其是在汽车工业中, ......
黑衣人 能源基础设施
各位大哥帮帮小第啊
就是有源晶振还能分频吗?时钟芯片DS1302的晶振要接32768HZ的啊!没的卖啊!!只好分频了!...
hezhiwen 单片机
硬件开发流程及规范---第一章 概述
第一章 概述 第一节 硬件开发过程简介 §1.1.1 硬件开发的基本过程 硬件开发的基本过程: 1.明确硬件总体需求情况,如CPU 处理能力、存储容量及速度,I/O 端口的分配、接口要求、电平要求 ......
chenky 嵌入式系统
选择VHDL还是verilog HDL?
选择VHDL还是verilog HDL? 在你选择之前有必要先简单介绍一下它们的总称:硬件描述语言HDL(Hardware Describe Language) HDL概述 随着EDA技术的发展,使用硬件语言设计PLD/FPGA成 ......
eeleader FPGA/CPLD
MSP43-F149 ADC12高频采样问题
手册说430F149采样频率最高可到200K,是通过设置SHTO和SHT1来配置的么?另外脉冲采样模式是通过TIMEA-OUT1触发的??? 我想实现200KHZ采样应该怎么设置啊·····先谢过啦·...
天空一 stm32/stm8

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

 
机器人开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 大学堂 TI培训 Datasheet 电子工程 索引文件: 2260  577  131  2341  892  21  2  41  25  35 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved