A
Heatsinks for D PAK and others
B
C
– copper heatsinks with excellent heat conductivity
– direct mounting on printed circuit through solderable surface
– especially suitable for SMD components of type D PAK (TO 252), D² PAK (TO 263), D³ PAK (TO 268), SOT 669 LF PAK,
SO IC-8 FL MP Power SO-8, Power SO-10, Power SO-20, Power SO-36, SO-14, SO-16, SOT 223 etc
,
– available standard packing: bulk parts or reel
– special packing like magazine, tray etc. on request; - special versions according to customers specifications
–
tape width:
44 mm,
reel diameter:
330 mm,
quantity:
FK 244 08 = 450, FK 244 13 = 200
D
art. no.
10
E
FK 244 08 D PAK ...
weight: 2g
art. no.
10
14,8
8
31,5 K/W
8
10
23
F
FK 244 13 D PAK ...
weight: 3.3g
art. no.
10
14,8
25 K/W
10
8
23
13
26
26
31
31
8
G
FK 244 08 D2 PAK ...
weight: 2.2g
art. no.
13
17,8
29,3 K/W
10
H
FK 244 13 D2 PAK ...
weight: 3.6g
13
17,8
8
22,8 K/W
10
8
I
art. no.
8
FK 244 08 D3 PAK ...
weight: 2.5g
18
22,8
26 K/W
10
8
K
art. no.
13
FK 244 13 D3 PAK ...
weight: 3.9g
18
22,8
19,5 K/W
L
please indicate:
surface:
material:
material thickness:
... packing (optional)
TR = tape and reel
solderable surface
copper (Cu)
0.6 mm
M
Heatsink profile-overview
Classification table
Finger-shaped heatsinks
Heatsinks for transistors
A 13 – 17
A 18 – 20
C2–3
C4–9
Attachable heatsinks
Heatsinks for TO 5 and TO 18
Thermal conductive material
Technical introduction
C 10 – 16
C 17 – 19
E 2 – 22
A2–7
N
C 21
13
8
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