NXP Semiconductors
Data Sheet: Technical Data
KS22P100M120SF0
Rev. 3, 04/2016
KS22/KS20 Microcontroller
120 MHz ARM® Cortex®-M4, with up to 256 KB Flash
The KS2x product family is built on the ARM
®
Cortex
®
-M4
processor with lower power and higher memory densities in
multiple packages. This device offers 120 MHz performance with
an integrated single-precision floating point unit (FPU).
Embedded flash memory sizes range from 128 KB to 256KB.
This device also includes:
• USB FS OTG 2.0 with crystal-less functionality
• FlexCAN, supporting CAN protocol according to the ISO
11898-1 standard and CAN 2.0 B protocol specifications
• FlexIO, a highly configurable module providing a wide
range of protocols including, but not limited to UART,
LPI2C, SPI, I2S, and PWM/Waveform generation.
MKS22FN256Vxx12
MKS22FN128Vxx12
MKS20FN256Vxx12
MKS20FN128Vxx12
100 & 64 LQFP (LL &
LH)
48 QFN (FT)
14×14×1.7 mm Pitch 7×7×0.65 mm Pitch 0.5
0.5 mm; 10×10×1.6 mm
mm
Pitch 0.5 mm
Performance
• 120 MHz ARM Cortex-M4 core with DSP instructions
delivering 1.25 Dhrystone MIPS per MHz
Memories and memory interfaces
• Up to 256 KB of embedded flash and 64 KB of SRAM
• Preprogrammed Kinetis Flashloader for one-time, in-
system factory programming
Analog modules
• One 16-bit ADC module with up to 17 single-end
channels and 4 differential channels, and up to 1.2
Msps at ≤ 13-bit mode
• One 12-bit DAC module
• One analog comparator (CMP) module
Communication interfaces
• USB full-speed 2.0 device controller
System peripherals
• One FlexIO module
• Flexible low-power modes, multiple wake up sources
• Three UART modules (one supporting ISO7816,
• 16-channel asynchronous DMA controller
and the other two operating up to 1.5 Mbit/s)
• Independent external and software watchdog monitor
• One LPUART module supporting asynchronous
operation in low-power modes
Clocks
• Two LPI2C modules supporting up to 5 Mbit/s,
• Two crystal oscillators: 32 kHz (RTC), and 32-40 kHz
asynchronous operation in low-power modes
or 3-32 MHz
supported
• Three internal oscillators: 32 kHz, 4 MHz, and 48 MHz
• Two 16-bit SPI modules supporting up to 30 Mbit/s
• Multi-purpose clock generator (MCG) with PLL and FLL
• Two FlexCAN modules for KS22, One FlexCAN for
KS20
Security and integrity modules
• Two I2S modules
• Hardware CRC module
• 128-bit unique identification (UID) number per chip
Timers
• Hardware random-number generator
• Three 16-bit low-power timer PWM modules (TPM)
• Flash access control (FAC) to protect proprietary
• One low-power timer (LPTMR)
software
• Periodic interrupt timer (PIT)
• Real time clock (RTC), with independent power
Human-machine interfaces
domain
• Up to 66 general-purpose input/output pins (GPIO)
• Programmable delay block (PDB)
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products. © 2015–2016 NXP B.V.
Table of Contents
1 Ordering information............................................................... 5
2 Overview................................................................................. 6
2.1 System features...............................................................7
2.1.1
2.1.2
2.1.3
2.1.4
2.1.5
2.1.6
2.1.7
2.1.8
2.1.9
2.1.10
2.1.11
ARM Cortex-M4 core........................................ 7
NVIC..................................................................7
AWIC.................................................................7
Memory............................................................. 8
Reset and boot..................................................9
Clock options.....................................................10
Security............................................................. 13
Power management.......................................... 14
LLWU................................................................ 16
Debug controller................................................17
Computer operating properly (COP) watchdog
timer.................................................................. 17
4.3.7
Human-Machine Interfaces (HMI)..................... 47
4.4 Pinouts.............................................................................47
4.5 Package dimensions....................................................... 50
5 Electrical characteristics..........................................................56
5.1 Terminology and guidelines.............................................56
5.1.1
Definitions......................................................... 56
5.1.2
5.1.3
5.1.4
5.1.5
Examples.......................................................... 57
Typical-value conditions....................................58
Relationship between ratings and operating
requirements..................................................... 58
Guidelines for ratings and operating
requirements..................................................... 59
2.2 Peripheral features.......................................................... 17
2.2.1
eDMA and DMAMUX........................................ 18
2.2.2
TPM...................................................................18
2.2.3
ADC...................................................................19
2.2.4
DAC...................................................................19
2.2.5
CMP.................................................................. 20
2.2.6
RTC...................................................................21
2.2.7
PIT.....................................................................21
2.2.8
PDB...................................................................21
2.2.9
2.2.10
2.2.11
2.2.12
2.2.13
2.2.14
2.2.15
2.2.16
2.2.17
LPTMR.............................................................. 22
CRC.................................................................. 22
UART................................................................ 23
LPUART............................................................ 23
SPI.................................................................... 24
FlexCAN............................................................24
LPI2C................................................................ 26
USB...................................................................26
I2S.....................................................................27
5.2 Ratings............................................................................ 59
5.2.1
Thermal handling ratings...................................59
5.2.2
Moisture handling ratings.................................. 60
5.2.3
ESD handling ratings........................................ 60
5.2.4
Voltage and current operating ratings............... 60
5.3 General............................................................................ 60
5.3.1
AC electrical characteristics.............................. 61
5.3.2
Nonswitching electrical specifications............... 61
5.3.3
Switching specifications.................................... 72
5.3.4
Thermal specification........................................ 74
5.4 Peripheral operating requirements and behaviors...........75
5.4.1
5.4.2
5.4.3
5.4.4
5.4.5
5.4.6
5.4.7
Debug modules................................................. 75
System modules................................................80
Clock modules...................................................80
Memories and memory interfaces.....................86
Security and integrity modules.......................... 87
Analog............................................................... 87
Timers............................................................... 97
5.4.8
Communication interfaces.................................97
6 Design considerations.............................................................108
6.1 Hardware design considerations..................................... 108
6.1.1
6.1.2
6.1.3
Printed circuit board recommendations.............108
Power delivery system...................................... 108
Analog design................................................... 109
2.2.18 FlexIO................................................................27
2.2.19 Port control and GPIO.......................................28
3 Memory map........................................................................... 30
4 Pinouts.................................................................................... 31
4.1 Signal Multiplexing and Pin Assignments........................ 31
4.2 Pin properties.................................................................. 34
4.3 Module Signal Description Tables................................... 39
4.3.1
Core Modules....................................................39
4.3.2
System Modules................................................40
4.3.3
4.3.4
4.3.5
4.3.6
Clock Modules...................................................40
Analog............................................................... 41
Timer Modules.................................................. 42
Communication Interfaces................................ 43
6.1.4
Digital design.....................................................110
6.1.5
Crystal oscillator................................................112
6.2 Software considerations.................................................. 114
7 Part identification.....................................................................114
7.1 Description.......................................................................114
7.2 Format............................................................................. 115
7.3 Fields............................................................................... 115
7.4 Example...........................................................................115
8 Revision history.......................................................................116
4
NXP Semiconductors
KS22/KS20 Microcontroller, Rev. 3, 04/2016
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