RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS
| SA57254-XXGW | SA57254-20GW | SA57254-25GW | SA57254-XX | SA57254-36GW | SA57254-33GW | SA57254-30GW | SA57254-28GW | |
|---|---|---|---|---|---|---|---|---|
| 描述 | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS | Ceramic Multilayer Capacitor; Capacitance:47pF; Capacitance Tolerance:+/- 5 %; Working Voltage, DC:100V; Dielectric Characteristic:C0G/NP0; Package/Case:0603; Series:VJ; Leaded Process Compatible:Yes; Mounting Type:Surface Mount | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS |
| 是否Rohs认证 | - | 不符合 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | - | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) | Philips Semiconductors (NXP Semiconductors N.V.) |
| 包装说明 | - | TSOP, TSOP5/6,.11,37 | TSOP, TSOP5/6,.11,37 | - | TSOP, TSOP5/6,.11,37 | TSOP, TSOP5/6,.11,37 | TSOP, TSOP5/6,.11,37 | TSOP, TSOP5/6,.11,37 |
| Reach Compliance Code | - | unknow | unknow | - | unknow | unknow | unknow | unknow |
| 控制模式 | - | VOLTAGE-MODE | VOLTAGE-MODE | - | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE | VOLTAGE-MODE |
| JESD-30 代码 | - | R-PDSO-G5 | R-PDSO-G5 | - | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 | R-PDSO-G5 |
| JESD-609代码 | - | e0 | e0 | - | e0 | e0 | e0 | e0 |
| 端子数量 | - | 5 | 5 | - | 5 | 5 | 5 | 5 |
| 最高工作温度 | - | 85 °C | 85 °C | - | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | - | -40 °C | -40 °C | - | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TSOP | TSOP | - | TSOP | TSOP | TSOP | TSOP |
| 封装等效代码 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | - | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 | TSOP5/6,.11,37 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | - | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 认证状态 | - | Not Qualified | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 表面贴装 | - | YES | YES | - | YES | YES | YES | YES |
| 最大切换频率 | - | 57.5 kHz | 57.5 kHz | - | 57.5 kHz | 57.5 kHz | 57.5 kHz | 57.5 kHz |
| 技术 | - | CMOS | CMOS | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | INDUSTRIAL | INDUSTRIAL | - | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | GULL WING | GULL WING | - | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | - | 0.95 mm | 0.95 mm | - | 0.95 mm | 0.95 mm | 0.95 mm | 0.95 mm |
| 端子位置 | - | DUAL | DUAL | - | DUAL | DUAL | DUAL | DUAL |
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