HYB5116400BJ-50-,HYB5116400BJ-50- pdf中文资料,HYB5116400BJ-50-引脚图,HYB5116400BJ-50-电路-Datasheet-电子工程世界

HYB5116400BJ-50-: 产品描述4M x 4-Bit Dynamic RAM; 文件大小330KB，共26页; 制造商SIEMENS; 官网地址http://www.infineon.com/

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HYB5116400BJ-50-概述

4M x 4-Bit Dynamic RAM

HYB5116400BJ-50-相似产品对比

	HYB5116400BJ-50-	Q67100-Q1051	Q67100-Q1050	Q67100-Q1049	HYB5116400BJ-50	HYB5116400BJ-60	HYB5116400BJ-70	HYB5116400BT-50	HYB5116400BT-60	HYB5116400BT-70
描述	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM	4M x 4-Bit Dynamic RAM
厂商名称	-	-	-	-	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS	SIEMENS
零件包装代码	-	-	-	-	SOIC	SOIC	SOJ	TSOP2	TSOP2	TSOP2
针数	-	-	-	-	26	26	24	24	24	24
Reach Compliance Code	-	-	-	-	unknow	unknow	unknow	unknow	unknown	unknow
ECCN代码	-	-	-	-	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
访问模式	-	-	-	-	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE	FAST PAGE
最长访问时间	-	-	-	-	50 ns	60 ns	70 ns	50 ns	60 ns	70 ns
其他特性	-	-	-	-	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH	RAS ONLY/CAS BEFORE RAS/HIDDEN/SELF REFRESH
JESD-30 代码	-	-	-	-	R-PDSO-J26	R-PDSO-J26	R-PDSO-J24	R-PDSO-G24	R-PDSO-G24	R-PDSO-G24
内存密度	-	-	-	-	16777216 bi	16777216 bi	16777216 bi	16777216 bi	16777216 bit	16777216 bi
内存集成电路类型	-	-	-	-	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM	FAST PAGE DRAM
内存宽度	-	-	-	-	4	4	4	4	4	4
功能数量	-	-	-	-	1	1	1	1	1	1
端口数量	-	-	-	-	1	1	1	1	1	1
端子数量	-	-	-	-	26	26	24	24	24	24
字数	-	-	-	-	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words	4194304 words
字数代码	-	-	-	-	4000000	4000000	4000000	4000000	4000000	4000000
工作模式	-	-	-	-	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	-	-	-	-	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	-	-	-	-	4MX4	4MX4	4MX4	4MX4	4MX4	4MX4
输出特性	-	-	-	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	-	-	-	-	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装形状	-	-	-	-	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	-	-	-	-	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE	SMALL OUTLINE
认证状态	-	-	-	-	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
刷新周期	-	-	-	-	4096	4096	4096	4096	4096	4096
最大供电电压 (Vsup)	-	-	-	-	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	-	-	-	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	-	-	-	-	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	-	-	-	-	YES	YES	YES	YES	YES	YES
技术	-	-	-	-	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	-	-	-	-	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	-	-	-	-	J BEND	J BEND	J BEND	GULL WING	GULL WING	GULL WING
端子位置	-	-	-	-	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL

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