256 MBit Synchronous Low-Power DRAM
| HYB39L256160AC | HYB39L256160AC-7.5 | HYB39L256160AT-8 | HYB39L256160AC-8 | HYB39L256160AT-7.5 | |
|---|---|---|---|---|---|
| 描述 | 256 MBit Synchronous Low-Power DRAM | 256 MBit Synchronous Low-Power DRAM | 256 MBit Synchronous Low-Power DRAM | 256 MBit Synchronous Low-Power DRAM | 256 MBit Synchronous Low-Power DRAM |
| 是否Rohs认证 | - | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | - | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) | Infineon(英飞凌) |
| 零件包装代码 | - | BGA | TSOP2 | BGA | TSOP2 |
| 包装说明 | - | TFBGA, BGA54,9X9,32 | TSOP2, TSOP54,.46,32 | TFBGA, BGA54,9X9,32 | TSOP2, TSOP54,.46,32 |
| 针数 | - | 54 | 54 | 54 | 54 |
| Reach Compliance Code | - | compliant | compliant | compliant | compliant |
| ECCN代码 | - | EAR99 | EAR99 | EAR99 | EAR99 |
| 访问模式 | - | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST | FOUR BANK PAGE BURST |
| 最长访问时间 | - | 5.4 ns | 6 ns | 6 ns | 5.4 ns |
| 其他特性 | - | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
| 最大时钟频率 (fCLK) | - | 133 MHz | 125 MHz | 125 MHz | 133 MHz |
| I/O 类型 | - | COMMON | COMMON | COMMON | COMMON |
| 交错的突发长度 | - | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 | 1,2,4,8 |
| JESD-30 代码 | - | R-PBGA-B54 | R-PDSO-G54 | R-PBGA-B54 | R-PDSO-G54 |
| JESD-609代码 | - | e0 | e0 | e0 | e0 |
| 长度 | - | 12 mm | 22.22 mm | 12 mm | 22.22 mm |
| 内存密度 | - | 268435456 bit | 268435456 bit | 268435456 bit | 268435456 bit |
| 内存集成电路类型 | - | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM | SYNCHRONOUS DRAM |
| 内存宽度 | - | 16 | 16 | 16 | 16 |
| 功能数量 | - | 1 | 1 | 1 | 1 |
| 端口数量 | - | 1 | 1 | 1 | 1 |
| 端子数量 | - | 54 | 54 | 54 | 54 |
| 字数 | - | 16777216 words | 16777216 words | 16777216 words | 16777216 words |
| 字数代码 | - | 16000000 | 16000000 | 16000000 | 16000000 |
| 工作模式 | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | - | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | - | 16MX16 | 16MX16 | 16MX16 | 16MX16 |
| 输出特性 | - | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | - | TFBGA | TSOP2 | TFBGA | TSOP2 |
| 封装等效代码 | - | BGA54,9X9,32 | TSOP54,.46,32 | BGA54,9X9,32 | TSOP54,.46,32 |
| 封装形状 | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | - | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE |
| 峰值回流温度（摄氏度） | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 刷新周期 | - | 8192 | 8192 | 8192 | 8192 |
| 座面最大高度 | - | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 自我刷新 | - | YES | YES | YES | YES |
| 连续突发长度 | - | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP | 1,2,4,8,FP |
| 最大待机电流 | - | 0.000475 A | 0.000475 A | 0.000475 A | 0.000475 A |
| 最大压摆率 | - | 0.18 mA | 0.14 mA | 0.14 mA | 0.18 mA |
| 最大供电电压 (Vsup) | - | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | - | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | - | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | - | YES | YES | YES | YES |
| 技术 | - | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | - | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | - | BALL | GULL WING | BALL | GULL WING |
| 端子节距 | - | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
| 端子位置 | - | BOTTOM | DUAL | BOTTOM | DUAL |
| 处于峰值回流温度下的最长时间 | - | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | - | 8 mm | 10.16 mm | 8 mm | 10.16 mm |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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