J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS
| 参数名称 | 属性值 |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| 系列 | HCT |
| JESD-30 代码 | X-XUUC-N16 |
| JESD-609代码 | e0 |
| 负载电容(CL) | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP |
| 位数 | 2 |
| 功能数量 | 2 |
| 端子数量 | 16 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出极性 | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 传播延迟(tpd) | 35 ns |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 总剂量 | 100k Rad(Si) V |
| 触发器类型 | POSITIVE EDGE |
| Base Number Matches | 1 |
| 5962R9576901V9A | 5962R9576901VEC | 5962R9576901VXC | HCTS109HMSR | HCTS109KMSR | |
|---|---|---|---|---|---|
| 描述 | J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS | J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS, CDIP16 | J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS, CDFP16 | J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS | J-Kbar Flip-Flop, HCT Series, 2-Func, Positive Edge Triggered, 2-Bit, Complementary Output, CMOS, CDFP16 |
| 包装说明 | DIE, | , | , | DIE, | DFP, FL16,.3 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown |
| 系列 | HCT | HCT | HCT | HCT | HCT |
| JESD-30 代码 | X-XUUC-N16 | R-CDIP-T16 | R-CDFP-F16 | X-XUUC-N16 | R-CDFP-F16 |
| 负载电容(CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP | J-KBAR FLIP-FLOP |
| 位数 | 2 | 2 | 2 | 2 | 2 |
| 功能数量 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 16 | 16 | 16 | 16 | 16 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C |
| 输出极性 | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY | COMPLEMENTARY |
| 封装主体材料 | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | UNSPECIFIED | CERAMIC, METAL-SEALED COFIRED |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | UNSPECIFIED | RECTANGULAR |
| 封装形式 | UNCASED CHIP | IN-LINE | FLATPACK | UNCASED CHIP | FLATPACK |
| 传播延迟(tpd) | 35 ns | 35 ns | 35 ns | 35 ns | 35 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | FLAT | NO LEAD | FLAT |
| 端子位置 | UPPER | DUAL | DUAL | UPPER | DUAL |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| JESD-609代码 | e0 | e4 | e4 | - | e0 |
| 封装代码 | DIE | - | - | DIE | DFP |
| 端子面层 | TIN LEAD | GOLD | GOLD | - | Tin/Lead (Sn/Pb) |
| 总剂量 | 100k Rad(Si) V | 100k Rad(Si) V | 100k Rad(Si) V | - | 200k Rad(Si) V |
| Base Number Matches | 1 | 1 | 1 | 1 | - |
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