Edition 2004-05-03
Published by Infineon Technologies AG,
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81669 München, Germany
©
Infineon Technologies AG 5/7/04.
All Rights Reserved.
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persons may be endangered.
.
HYB18T1G400/800/160AF
DATASHEET Rev. 1.02 (05.04)
Features
•
High Performance:
-5
Speed Sorts
DDR2
-400
-3.7
DDR2
-533
-3S
DDR2
-667
-3
DDR2
-667
1Gb DDR2 SDRAM
Units
tck
MHz
Mb/s/pin
Bin
(CL-tRCD-TRP)
max. Clock Frequency
3-3-3 4-4-4 5-5-5 4-4-4
200
400
3
15
15
40
55
266
533
4
15
15
45
60
5
15
15
45
60
333
667
4
12
12
45
57
Data Rate
CAS Latency (CL)
tRCD
tRP
tRAS
tRC
tck
ns
ns
ns
ns
• 1.8V ± 0.1V Power Supply
1.8 V ± 0.1V (SSTL_18) compatible) I/O
• DRAM organisations with 4, 8 and 16 data in/outputs
• Double Data Rate architecture: two data transfers per
clock cycle, eight internal banks for concurrent operation
• CAS Latency: 3, 4 and 5
• Burst Length: 4 and 8
• Differential clock inputs (CK and CK)
• Bi-directional, differential data strobes (DQS and DQS) are
transmitted / received with data. Edge aligned with
read data and center-aligned with write data
• DLL aligns DQ and DQS transitions with clock
• DQS can be disabled for single-ended data strobe opera-
tion
• Commands entered on each positive clock edge, data and
data mask are referenced to both edges of DQS
• Data masks (DM) for write data
• Posted CAS by programmable additive latency for better
command and data bus efficiency
• Off-Chip-Driver impedance adjustment (OCD) and On-Die-
Termination (ODT) for better signal quality.
• Auto-Precharge operation for read and write bursts
• Auto-Refresh, Self-Refresh and power saving Power-
Down modes
• Average Refresh Period 7.8µs at a T
CASE
lower than
85
o
C, 3.9µs between 85
o
C and 95
o
C
• Strong and Weak Strength Data-Output Driver
• 1k page size for x 4 & x 8,
2k page size for x16
•
Lead-free Packages:
68 pin FBGA for x4 & x8 components
92 pin FBGA for x16 components
1.0 Description
The 1Gb Double-Data-Rate-2 (DDR2) DRAMs are high-speed
CMOS Double Data Rate 2 Synchronous DRAM devices con-
taining 1,073,741,824 bits and is internally configured as a
octal-bank DRAM. The 1Gb chip is organized as either 32Mbit
x 4 I/O x 8 banks, 16Mbit x 8 I/O x 8 banks or 8Mbit x 16 I/O x 8
banks device. These synchronous devices achieve high speed
double-data-rate transfer rates of up to 667 Mb/sec/pin for gen-
eral applications.
The chip is designed to comply with all key DDR2 DRAM key
features: (1) posted CAS with additive latency, (2) write latency
= read latency -1, (3) normal and weak strength data-output
driver, (4) Off-Chip Driver (OCD) impedance adjustment and
(5) an ODT (On-Die Termination) function.
All of the control and address inputs are synchronized with a
pair of externally supplied differential clocks. Inputs are latched
at the cross point of differential clocks (CK rising and CK fall-
ing). All I/Os are synchronized with a single ended DQS or dif-
ferential (DQS, DQS) pair in a source synchronous fashion. A
17 bit address bus for x 4 and x 8 organised components and a
16 bit address bus for x16 components is used to convey row,
column and bank address information in a RAS / CAS multi-
plexing style.
The DDR2 devices operate with a 1.8V +/-0.1V power supply
and are available in FBGA packages.
An Auto-Refresh and Self-Refresh mode is provided along with
various power-saving power-down modes.
The functionality described and the timing specifications
included in this data sheet are for the DLL Enabled mode of
operation.
Page 3
Rainer.Weidlich@Infineon.com
Rev. 1.02 May 2004
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